Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
Display
QFN Thermal Pad Design for Void Minimization
Different types of components with soldered bottom terminations are increasingly used in the electronics industry with the principal objective to improve heat dissipation.
The larg
.. read more
D-PAK Voiding: A Study to Determine the Origins of D-PAK Voiding
Voiding in bottom termination components (BTCs) like QFNs and LGAs have become quote the hot topic in the SMT industry. Surprisingly,one type of BTC component that is observed to have excess
.. read more
Wettable-Flanks: Enabler for the Use of Bottom-Termination Components in Mass Production of High-Reliability Electronic Control Units
Driven by miniaturization,cost reduction and tighter requirements for electrical and thermal performance,the use of lead-frame based bottom-termination components (LF-BTC) as small-outline no-l
.. read more
Using Condensation Testing with Surface Insulation Resistance Measurements for QFN Reliability Assessment
Quad Flat Non-lead (QFN) packages are finding increased uses in high reliability applications due to their smaller footprints,improved thermal and electrical performance [1] and as such there i
.. read more
New Requirements for Sir- Measurement
During the last period of newly assembled electrical devices (pcbs),new component types like LGA and QFN were also qualified as well as smaller passive components with reliability requirements
.. read more
Reliability Study of Bottom Terminated Components
Bottom terminated components (BTC) are leadless components where terminations are protectively plated on the underside of the package. They are all slightly different and have different names,s
.. read more
Advanced Rework Technology and Processes for Next Generation Large Area Arrays,01005,PoP and QFN Devices
BGA Rework is now largely mature,although new supplemental processes that provide improved process control such as
Solder Paste Dipping and Non-Contact Site Cleaning can now be integrated into
.. read more
Printing and Assembly Challenges for QFN Devices
QFN’s offer advantages in reducing size and weight and have excellent thermal and electrical Conductivity related to the ground plane. QFN’s also present printing and assembly challenges includ
.. read more
QFN Flux Entrapment Case Study
The presentation will discuss the problems that many QFN users are dealing with by having flux trapped under the component that is still gooey and conductive and the effect on circuit performan
.. read more
Minimizing Voiding In QFN Packages Using Solder Preforms
According to Prismark Partners,the use of QFNs is growing faster than any package type except for flip-chip CSPs. Prismark
projects that by 2013,32.6 billion QFNs will be assembled worldwide,wh
.. read more
Assembly Challenges of Bottom Terminated Components
Bottom terminated component (BTC) assembly has rapidly increased in recent years. This type of package is attractive due to its low cost and good functional performance (improved signal speeds
.. read more
Thermal Pad Design at QFN Assembly for Voiding Control
Quad Flat No Leads (QFN) package designs receive more and more attention in electronic industry recently. This package offers a number of benefits including (1) small size,such as a near die si
.. read more
PCB Design Principles for QFN and Other Bottom Termination Components
Although many of the QFN and bottom termination products are small in outline and utilize a plastic encapsulated copper
lead-frame structure they do not resemble the more traditional small outl
.. read more
Pb-free Solder Joint Reliability in a Mildly Accelerated Test Condition
Two different temperature cycling profiles were used to compare the thermal fatigue reliability of Pb free and SnPb solder joints in 16 different,high strain surface mount (SMT) packages. In so
.. read more
The Effects of Non-filled Microvia in Pad on Pb-free Solder Joint Reliability of BGA and QFN Packages in Accelerated Thermal...
The High Density Packaging Users Group (HDPUG) Consortium has completed an experiment to investigate the effect of non-filled microvias in SMT solder joint pads and the associated solder voids
.. read more
Validity of the IPC R.O.S.E. Method 2.3.25 Researched
Miniaturization and higher functionality in electronics packaging require the use of advanced packages and small components. This trend has translated into the use of new package types such as
.. read more
NASA-DoD Lead-Free Electronics Project: Mechanical Shock Test
Mechanical shock testing was conducted by Boeing Research and Technology (Seattle) for the NASA-DoD Lead-Free Electronics Solder Project. This project is follow-on to the Joint Council on Aging
.. read more
Drop Test Performance of A Medium Complexity Lead-Free Board After Assembly and Rework
The mechanical behavior of printed circuit assemblies (PCA) at high strain rates is very important for the reliability of products used in harsh environments. The transition to Pb-free material
.. read more
BGA and QFN Repair Process
Repairing a PCB with a defective BGA,uBGA,or QFN is often a difficult and tedious task. The conventional method is to remove the defective device from the PCB; clean the pads on the PCB,then pr
.. read more
The Utilization of X-ray to Effectively Test Quad Flat No-Lead Packages
The Quad Flat No-Lead or QFN packages are increasing in their utilization in the printed circuit board market. This is being driven largely by the shrinking size both in profile and footprint,h
.. read more
QFN Thermal Pad Design for Void Minimization
Different types of components with soldered bottom terminations are increasingly used in the electronics industry with the principal objective to improve heat dissipation.
The larg
.. read more
D-PAK Voiding: A Study to Determine the Origins of D-PAK Voiding
Voiding in bottom termination components (BTCs) like QFNs and LGAs have become quote the hot topic in the SMT industry. Surprisingly,one type of BTC component that is observed to have excess
.. read more
Wettable-Flanks: Enabler for the Use of Bottom-Termination Components in Mass Production of High-Reliability Electronic Control Units
Driven by miniaturization,cost reduction and tighter requirements for electrical and thermal performance,the use of lead-frame based bottom-termination components (LF-BTC) as small-outline no-l
.. read more
Using Condensation Testing with Surface Insulation Resistance Measurements for QFN Reliability Assessment
Quad Flat Non-lead (QFN) packages are finding increased uses in high reliability applications due to their smaller footprints,improved thermal and electrical performance [1] and as such there i
.. read more
New Requirements for Sir- Measurement
During the last period of newly assembled electrical devices (pcbs),new component types like LGA and QFN were also qualified as well as smaller passive components with reliability requirements
.. read more
Reliability Study of Bottom Terminated Components
Bottom terminated components (BTC) are leadless components where terminations are protectively plated on the underside of the package. They are all slightly different and have different names,s
.. read more
Advanced Rework Technology and Processes for Next Generation Large Area Arrays,01005,PoP and QFN Devices
BGA Rework is now largely mature,although new supplemental processes that provide improved process control such as
Solder Paste Dipping and Non-Contact Site Cleaning can now be integrated into
.. read more
Printing and Assembly Challenges for QFN Devices
QFN’s offer advantages in reducing size and weight and have excellent thermal and electrical Conductivity related to the ground plane. QFN’s also present printing and assembly challenges includ
.. read more
QFN Flux Entrapment Case Study
The presentation will discuss the problems that many QFN users are dealing with by having flux trapped under the component that is still gooey and conductive and the effect on circuit performan
.. read more
Minimizing Voiding In QFN Packages Using Solder Preforms
According to Prismark Partners,the use of QFNs is growing faster than any package type except for flip-chip CSPs. Prismark
projects that by 2013,32.6 billion QFNs will be assembled worldwide,wh
.. read more
Assembly Challenges of Bottom Terminated Components
Bottom terminated component (BTC) assembly has rapidly increased in recent years. This type of package is attractive due to its low cost and good functional performance (improved signal speeds
.. read more
Thermal Pad Design at QFN Assembly for Voiding Control
Quad Flat No Leads (QFN) package designs receive more and more attention in electronic industry recently. This package offers a number of benefits including (1) small size,such as a near die si
.. read more
PCB Design Principles for QFN and Other Bottom Termination Components
Although many of the QFN and bottom termination products are small in outline and utilize a plastic encapsulated copper
lead-frame structure they do not resemble the more traditional small outl
.. read more
Pb-free Solder Joint Reliability in a Mildly Accelerated Test Condition
Two different temperature cycling profiles were used to compare the thermal fatigue reliability of Pb free and SnPb solder joints in 16 different,high strain surface mount (SMT) packages. In so
.. read more
The Effects of Non-filled Microvia in Pad on Pb-free Solder Joint Reliability of BGA and QFN Packages in Accelerated Thermal...
The High Density Packaging Users Group (HDPUG) Consortium has completed an experiment to investigate the effect of non-filled microvias in SMT solder joint pads and the associated solder voids
.. read more
Validity of the IPC R.O.S.E. Method 2.3.25 Researched
Miniaturization and higher functionality in electronics packaging require the use of advanced packages and small components. This trend has translated into the use of new package types such as
.. read more
NASA-DoD Lead-Free Electronics Project: Mechanical Shock Test
Mechanical shock testing was conducted by Boeing Research and Technology (Seattle) for the NASA-DoD Lead-Free Electronics Solder Project. This project is follow-on to the Joint Council on Aging
.. read more
Drop Test Performance of A Medium Complexity Lead-Free Board After Assembly and Rework
The mechanical behavior of printed circuit assemblies (PCA) at high strain rates is very important for the reliability of products used in harsh environments. The transition to Pb-free material
.. read more
BGA and QFN Repair Process
Repairing a PCB with a defective BGA,uBGA,or QFN is often a difficult and tedious task. The conventional method is to remove the defective device from the PCB; clean the pads on the PCB,then pr
.. read more
The Utilization of X-ray to Effectively Test Quad Flat No-Lead Packages
The Quad Flat No-Lead or QFN packages are increasing in their utilization in the printed circuit board market. This is being driven largely by the shrinking size both in profile and footprint,h
.. read more