Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Multilayered Flexible Hybrid Screen Printed Circuits on Disposable Medical Grade Substrates
This paper details the realization of a multi-layered, printed, conformable hybrid circuit. The circuit was created using silver(Ag) flake ink as a conductive layer and UV acrylic-based ink
.. read more
Innovations for future RF designs
This Slide show presents RF Cap Layers to normal FR4 Dielectric materials. This material can be used in multiple configurations including Single sided, Double sided, and Hybrid.&n
.. read more
Board Level Reliability Testing of RF Packages
Board level reliability testing is becoming a requirement amongst users for acceptance of components and packages. Standard component level JEDEC tests are not sufficient to qualify a suppli
.. read more
Increasing Efficiency of Functional Test Through the Use of Modular Test Components and In-Situ Methods for Cleaning of Test Probes...
Instead of using a dedicated test platform, we are presenting methods of using modular and highly scalable components to perform functional testing on a printed circuit board assembly (PCBA)
.. read more
Alternative Concepts for High Speed,High Frequency and Signal Integration into the PCB
Transmission of data is a major driver in the electronics industry. Higher data volumes,high speed data transfer and short time signal transmission have to be realized to meet these requirement
.. read more
Multilayered Flexible Hybrid Screen Printed Circuits on Disposable Medical Grade Substrates
This paper details the realization of a multi-layered, printed, conformable hybrid circuit. The circuit was created using silver(Ag) flake ink as a conductive layer and UV acrylic-based ink
.. read more
Innovations for future RF designs
This Slide show presents RF Cap Layers to normal FR4 Dielectric materials. This material can be used in multiple configurations including Single sided, Double sided, and Hybrid.&n
.. read more
Board Level Reliability Testing of RF Packages
Board level reliability testing is becoming a requirement amongst users for acceptance of components and packages. Standard component level JEDEC tests are not sufficient to qualify a suppli
.. read more
Increasing Efficiency of Functional Test Through the Use of Modular Test Components and In-Situ Methods for Cleaning of Test Probes...
Instead of using a dedicated test platform, we are presenting methods of using modular and highly scalable components to perform functional testing on a printed circuit board assembly (PCBA)
.. read more
Alternative Concepts for High Speed,High Frequency and Signal Integration into the PCB
Transmission of data is a major driver in the electronics industry. Higher data volumes,high speed data transfer and short time signal transmission have to be realized to meet these requirement
.. read more