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Controlling Recrystallisation in Plated Layers Through the Use of Additives
This work compares the influence of a plating additive that has been applied to a commercially available electroless copper system and how its use impacts the morphology of the overall final
.. read more
Reliability and IMC Layer Evolution of Homogenous Lead-Free Solder Joints During Thermal Cycling
Many leading solder paste manufacturers are currently developing solder alloys for high reliability applications. These solder alloys are doped with elements such as bismuth (Bi), indium (In
.. read more
Recrystallisation and the Resulting Crystal Structures in Plated Microvias
Plated and filled microvias are a common feature in modern PCBs, so much so, that they are now considered as the industry norm as a means of achieving high-density designs for modern mobile
.. read more
Next Progression in Microvia Reliability Validation – Reflow Simulation of a PCB Design Attributes and Material Structural Properties During the...
As has long been known, each time there is a step up to the next level of PCB technology, the industry is faced with new or the broadening of existing challenges. Today, this is particularly
.. read more
Grain Refinement for Improved Lead-Free Solder Joint Reliability
The very small solder joints that now account for an increasing proportion of the connections on which modern electronics depends are typically made up of only a few grains,sometimes only a sin
.. read more
Comparison of Thermal Fatigue Performance of SAC105 (Sn-1.0Ag-0.5Cu),Sn- 3.5Ag,and SAC305 (Sn-3.0Ag-0.5Cu) BGA Components with SAC305 Solder Paste
Many BGA and CSP component suppliers have begun shipment of components with a variety of “second generation” Pb-free solder ball alloys. Much of the motivation for the alloy changes has been to
.. read more
Recrystallization Principles Applied to Whisker Growth in Tin
Tin whiskers found in electroplated deposits are known to be single crystals which spontaneously grow. Thus
whisker growth can be regarded as a grain growth phenomenon. In this paper we examine
.. read more
Controlling Recrystallisation in Plated Layers Through the Use of Additives
This work compares the influence of a plating additive that has been applied to a commercially available electroless copper system and how its use impacts the morphology of the overall final
.. read more
Reliability and IMC Layer Evolution of Homogenous Lead-Free Solder Joints During Thermal Cycling
Many leading solder paste manufacturers are currently developing solder alloys for high reliability applications. These solder alloys are doped with elements such as bismuth (Bi), indium (In
.. read more
Recrystallisation and the Resulting Crystal Structures in Plated Microvias
Plated and filled microvias are a common feature in modern PCBs, so much so, that they are now considered as the industry norm as a means of achieving high-density designs for modern mobile
.. read more
Next Progression in Microvia Reliability Validation – Reflow Simulation of a PCB Design Attributes and Material Structural Properties During the...
As has long been known, each time there is a step up to the next level of PCB technology, the industry is faced with new or the broadening of existing challenges. Today, this is particularly
.. read more
Grain Refinement for Improved Lead-Free Solder Joint Reliability
The very small solder joints that now account for an increasing proportion of the connections on which modern electronics depends are typically made up of only a few grains,sometimes only a sin
.. read more
Comparison of Thermal Fatigue Performance of SAC105 (Sn-1.0Ag-0.5Cu),Sn- 3.5Ag,and SAC305 (Sn-3.0Ag-0.5Cu) BGA Components with SAC305 Solder Paste
Many BGA and CSP component suppliers have begun shipment of components with a variety of “second generation” Pb-free solder ball alloys. Much of the motivation for the alloy changes has been to
.. read more
Recrystallization Principles Applied to Whisker Growth in Tin
Tin whiskers found in electroplated deposits are known to be single crystals which spontaneously grow. Thus
whisker growth can be regarded as a grain growth phenomenon. In this paper we examine
.. read more