Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Study of Various PCBA Surface Finishes
In this study various printed circuit board surface finishes were evaluated,including: organic solderability preservative (OSP),plasma finish (PF),immersion silver (IAg),electroless nickel / im
.. read more
Die Attach Solder Materials and Application Technology
Advancing technology frequently requires an accompanying advancement in materials technology. Recently,these advances are also driven by changes in environmental legislation as well. Specifical
.. read more
Effect of Soldering Method,Temperature,and Humidity on Whisker Growth in the Presence of Flux Residues
Since the electronics industry moved to lead-free solders that typically have a tin content of more than 95% there has been
concern about the possibility of circuit malfunctions due to whisker
.. read more
Comparative Assessment of Electrochemical Migration on Printed Circuit Boards with Lead-Free and Tin-Lead Solders
Current leakage on a printed circuit board (PCB) can occur due to a reduction in surface insulation resistance (SIR) between adjacent conductors. This is frequently caused by electrochemical mi
.. read more
Lead Free Assembly Qualification of Stacked MicroVia Boards
Beginning July 2006,the electronic industry will enter the age of lead –free assembly and products in Europe. The removal
of lead from electronics brings massive changes for all companies in th
.. read more
Qualification of ALIVH-G Boards for Handset Assembly
The trends of increased functionality and reduced size of portable wireless products,such as handsets; PDAs are demanding
increased routing densities for printed circuit boards. The handheld wi
.. read more
Optimization of Lead-Free Soldering Processes for Volume Manufacturing
In this paper,a comprehensive review is provided on the optimization of soldering processes (including reflow,wave
soldering,and rework),for different component types,different PCB sizes and fi
.. read more
Investigation of the Manufacturing Challenges of 2577 I/O Flip Chip Ball Grid Arrays
Higher I/O Ball Grid Arrays (BGAs) are high speed,high pin count,and high performance array packages. These BGAs are
also more complex in structure than “standard” BGAs and are generally target
.. read more
Effect of Lead-Free Alloys on Voiding at Microvia
For SnAgCu solders,the voiding rate at microvia was studied with the use of simulated microvia,and was the lowest with
95.5Sn3.8Ag0.7Cu and 95.5Sn3.5Ag1Cu. The voiding rate increased with decre
.. read more
Lead Free and Other Process Effects on Conductive Anodic Filamentation Resistance of Glass Reinforced Epoxy Laminates
Conductive Anodic Filamentation is a subsurface failure mode for woven glass reinforced laminates (FR4) materials,where a
copper salt filament allows bridging between via walls or other copper
.. read more
Key Application Issues for Implementing Package-Applied Underfill
Applying underfill materials to the bottom of components prior to shipping to the 2nd level end-user is very desirable
in that it would eliminate the underfill process from the end-users assemb
.. read more
Study of Assembly Processes for Solder Flip Chips on FR-4 Substrates
Flip chip assembly is a key capability to enable product miniaturization. Our previous studies have investigated several flip chip
interconnection types including anisotropic conductive film or
.. read more
Whisker Prevention
The electronic industry is under extreme pressure to remove tin-lead solders from electronic components. Pure tin is
one of the alternatives and may be the simplest system as a “drop-in” replac
.. read more
Finally! Practical Guidelines for Achieving Successful Lead-Free Assembly
With the Waste Electrical and Electronic Equipment
(WEEE) Directive in Europe outlawing lead from
many electronic devices produced and imported in
the EU by July 2006,as well as with foreign
co
.. read more
Implementation of No-Flow Underfills on Chip Scale Packages
Chip Scale Package (CSP) technology is growing at a rapid pace since its emergence in the electronics
manufacturing industry. As the solder joint size decreases,it has become apparent that unde
.. read more
Study of Various PCBA Surface Finishes
In this study various printed circuit board surface finishes were evaluated,including: organic solderability preservative (OSP),plasma finish (PF),immersion silver (IAg),electroless nickel / im
.. read more
Die Attach Solder Materials and Application Technology
Advancing technology frequently requires an accompanying advancement in materials technology. Recently,these advances are also driven by changes in environmental legislation as well. Specifical
.. read more
Effect of Soldering Method,Temperature,and Humidity on Whisker Growth in the Presence of Flux Residues
Since the electronics industry moved to lead-free solders that typically have a tin content of more than 95% there has been
concern about the possibility of circuit malfunctions due to whisker
.. read more
Comparative Assessment of Electrochemical Migration on Printed Circuit Boards with Lead-Free and Tin-Lead Solders
Current leakage on a printed circuit board (PCB) can occur due to a reduction in surface insulation resistance (SIR) between adjacent conductors. This is frequently caused by electrochemical mi
.. read more
Lead Free Assembly Qualification of Stacked MicroVia Boards
Beginning July 2006,the electronic industry will enter the age of lead –free assembly and products in Europe. The removal
of lead from electronics brings massive changes for all companies in th
.. read more
Qualification of ALIVH-G Boards for Handset Assembly
The trends of increased functionality and reduced size of portable wireless products,such as handsets; PDAs are demanding
increased routing densities for printed circuit boards. The handheld wi
.. read more
Optimization of Lead-Free Soldering Processes for Volume Manufacturing
In this paper,a comprehensive review is provided on the optimization of soldering processes (including reflow,wave
soldering,and rework),for different component types,different PCB sizes and fi
.. read more
Investigation of the Manufacturing Challenges of 2577 I/O Flip Chip Ball Grid Arrays
Higher I/O Ball Grid Arrays (BGAs) are high speed,high pin count,and high performance array packages. These BGAs are
also more complex in structure than “standard” BGAs and are generally target
.. read more
Effect of Lead-Free Alloys on Voiding at Microvia
For SnAgCu solders,the voiding rate at microvia was studied with the use of simulated microvia,and was the lowest with
95.5Sn3.8Ag0.7Cu and 95.5Sn3.5Ag1Cu. The voiding rate increased with decre
.. read more
Lead Free and Other Process Effects on Conductive Anodic Filamentation Resistance of Glass Reinforced Epoxy Laminates
Conductive Anodic Filamentation is a subsurface failure mode for woven glass reinforced laminates (FR4) materials,where a
copper salt filament allows bridging between via walls or other copper
.. read more
Key Application Issues for Implementing Package-Applied Underfill
Applying underfill materials to the bottom of components prior to shipping to the 2nd level end-user is very desirable
in that it would eliminate the underfill process from the end-users assemb
.. read more
Study of Assembly Processes for Solder Flip Chips on FR-4 Substrates
Flip chip assembly is a key capability to enable product miniaturization. Our previous studies have investigated several flip chip
interconnection types including anisotropic conductive film or
.. read more
Whisker Prevention
The electronic industry is under extreme pressure to remove tin-lead solders from electronic components. Pure tin is
one of the alternatives and may be the simplest system as a “drop-in” replac
.. read more
Finally! Practical Guidelines for Achieving Successful Lead-Free Assembly
With the Waste Electrical and Electronic Equipment
(WEEE) Directive in Europe outlawing lead from
many electronic devices produced and imported in
the EU by July 2006,as well as with foreign
co
.. read more
Implementation of No-Flow Underfills on Chip Scale Packages
Chip Scale Package (CSP) technology is growing at a rapid pace since its emergence in the electronics
manufacturing industry. As the solder joint size decreases,it has become apparent that unde
.. read more