Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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DFM Rules for Smartphones: An Analysis of Yield on Extremely Dense Assemblies
Handheld portable products such as smartphones are trending toward smaller form factors while simultaneously increasing in functionality to keep up with consumer demands. This is achieved in pa
.. read more
Solder Paste Residue Corrosivity Assessment: Bono Test
Lead free soldering with no clean solder pastes represent nowadays the most common process in electronic assembly. A solder paste is usually considered as no-clean if it passes all IPC J-STD-00
.. read more
Broadband Printing: The New SMT Challenge
The Surface Mount Technology (SMT) industry has overcome many challenges in the last 30 years,since its introduction in the 1980’s. One recent challenge has been the lead-free assembly. People
.. read more
Effects of Tin Mitigation Processes on Whisker Growth and Solder Joint Reliability for Chip and Small-Outline Package Components
This paper reports the results of an evaluation of tin mitigation processes for components,i.e. converting parts with pure tin (Sn) and other lead-free (Pb-free) finishes to tin-lead (SnPb) fin
.. read more
Testing and Analysis of Surface Mounted Lead Free Soldering Materials and Processes
The Massachusetts Toxics Use Reduction Institute (TURI) has sponsored a consortium of Massachusetts based
corporations to investigate lead-free (Pb-free) surface mount soldering technology. The
.. read more
Evaluating the Use of Next Generation Reflow Profile Control for High Volume Electronics Manufacturing
In recent years,technological advances in electronics manufacturing have allowed high volume manufacturers to
significantly improve process control and documentation. Manufacturers have acceler
.. read more
Robust Optimization of a Lead Free SMT Process
This paper will focus on Dr. Taguchi’s Robust Engineering methodology,measurement methods and experimental
results for the optimization of a lead free SMT process for use in an Automotive Elect
.. read more
DFM Rules for Smartphones: An Analysis of Yield on Extremely Dense Assemblies
Handheld portable products such as smartphones are trending toward smaller form factors while simultaneously increasing in functionality to keep up with consumer demands. This is achieved in pa
.. read more
Solder Paste Residue Corrosivity Assessment: Bono Test
Lead free soldering with no clean solder pastes represent nowadays the most common process in electronic assembly. A solder paste is usually considered as no-clean if it passes all IPC J-STD-00
.. read more
Broadband Printing: The New SMT Challenge
The Surface Mount Technology (SMT) industry has overcome many challenges in the last 30 years,since its introduction in the 1980’s. One recent challenge has been the lead-free assembly. People
.. read more
Effects of Tin Mitigation Processes on Whisker Growth and Solder Joint Reliability for Chip and Small-Outline Package Components
This paper reports the results of an evaluation of tin mitigation processes for components,i.e. converting parts with pure tin (Sn) and other lead-free (Pb-free) finishes to tin-lead (SnPb) fin
.. read more
Testing and Analysis of Surface Mounted Lead Free Soldering Materials and Processes
The Massachusetts Toxics Use Reduction Institute (TURI) has sponsored a consortium of Massachusetts based
corporations to investigate lead-free (Pb-free) surface mount soldering technology. The
.. read more
Evaluating the Use of Next Generation Reflow Profile Control for High Volume Electronics Manufacturing
In recent years,technological advances in electronics manufacturing have allowed high volume manufacturers to
significantly improve process control and documentation. Manufacturers have acceler
.. read more
Robust Optimization of a Lead Free SMT Process
This paper will focus on Dr. Taguchi’s Robust Engineering methodology,measurement methods and experimental
results for the optimization of a lead free SMT process for use in an Automotive Elect
.. read more