Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Soldering Process Improvement of Critical SMT Connectors and for the Retention of Press-fit SFP Cages
As Original Design Manufacturers (ODM) adopt the use of finer pitch connectors,with increased pin count on PCB assemblies. It becomes challenging for Electronic Contract Manufacturing Services
.. read more
Low-Silver BGA Assembly Phase I – Reflow Considerations and Joint Homogeneity Third Report: Comparison of Four Low-Silver Sphere Alloys and...
Some Ball Grid Array suppliers are migrating their sphere alloys from SAC305 (3% Ag) or 405 (4% Ag) to alloys with lower silver contents. There are a numerous perceived benefits to this move in
.. read more
Soldering Process Improvement of Critical SMT Connectors and for the Retention of Press-fit SFP Cages
As Original Design Manufacturers (ODM) adopt the use of finer pitch connectors,with increased pin count on PCB assemblies. It becomes challenging for Electronic Contract Manufacturing Services
.. read more
Low-Silver BGA Assembly Phase I – Reflow Considerations and Joint Homogeneity Third Report: Comparison of Four Low-Silver Sphere Alloys and...
Some Ball Grid Array suppliers are migrating their sphere alloys from SAC305 (3% Ag) or 405 (4% Ag) to alloys with lower silver contents. There are a numerous perceived benefits to this move in
.. read more