Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
Display
How to Manage Material Outgassing in Reflow Oven
In a lead-free reflow process, temperatures are higher, and materials use outgasses more than in a leaded reflow process. The trends toward higher density populated boards and more pin-in-pa
.. read more
An Experimental Approach to Characterising CAF
The electrochemical short,Conductive Anodic Filamentation,that that can develop within a PCB can be difficult to diagnose and detect,and there are many material and process issues that can lead
.. read more
Process Development for 01005 Lead-Free Passive Assembly: Stencil Printing
For some years now,an area ratio of 0.66 or greater has been the criterion for stencil apertures to achieve acceptable volume control in the printed solder paste “brick,” for small apertures Me
.. read more
Applied Research for Optimizing Process: Parameters for Cleaning Pb-Free Flux
As the electronics industry moves toward the implementation of Pb-free soldering,the impact on the assembly process must
be considered. One process that is often over looked is the cleaning of
.. read more
Qualification of Stacked Microvia Boards for Handset Assembly
The trends of increased functionality and reduced size of portable wireless products,such as handsets and PDAs,are
demanding increased routing densities for printed circuit boards. The handheld
.. read more
Lead-Free Implementation: Drop-In Manufacturing
The Lead-free electronics manufacturing has become a reality. As of this writing,a few manufacturers have rightfully
reported their total completion to Lead-free production across all facilitie
.. read more
Lead Free Reflow Process Control
All areas of manufacturing worldwide are impacted
by the lead free initiative; none more than the reflow
process. The higher melt temperatures and soak
duration of leadless solder formulas requ
.. read more
The Importance of Cooling Rate in the Developing the Totally Controlled Reflow Process for Lead Free and Eutectic Tin Lead...
The impact cooling rates exert on the reflow process is identified. The trends in shear strength and the
microstructural evolution of the solder joints are described. Lead free (Sn/3.5Ag/0.7Cu)
.. read more
Taking the Pain Out of Pb-Free Reflow
The introduction of Pb-free solder into the electronics industry has required changes to the standard surface mount process.
The largest changes are in the reflow process,as Pb-free pastes requ
.. read more
The Bumping of Wafer Level Packages
The relentless trend for smaller,lighter,cheaper consumer products continues to fuel the demand for new,smaller,
efficient electronic packages. In recent years wafer level packaging concepts ha
.. read more
An Efficient Test Model to Study the Board Level Reliability For High I/O Flip Chip BGA Packages
With the increasing demands of complex functions in a single chipset or microprocessor,the development of large
size high I/O Flip Chip BGA (FCBGA) package becomes very important in recent year
.. read more
Implementation of High I/O Count 1mm Pitch BGA Technology
Electronic package size reduction and demand for increased functions within less board space make a challenge for
the PCB designer to find smaller footprint components that will out perform lar
.. read more
Automated SPC for the Reflow Process
This paper will discuss the implementation of real-time automated SPC for the Reflow Process. Topics covered will include: a new statistical method for quantifying the thermal process performan
.. read more
How to Manage Material Outgassing in Reflow Oven
In a lead-free reflow process, temperatures are higher, and materials use outgasses more than in a leaded reflow process. The trends toward higher density populated boards and more pin-in-pa
.. read more
An Experimental Approach to Characterising CAF
The electrochemical short,Conductive Anodic Filamentation,that that can develop within a PCB can be difficult to diagnose and detect,and there are many material and process issues that can lead
.. read more
Process Development for 01005 Lead-Free Passive Assembly: Stencil Printing
For some years now,an area ratio of 0.66 or greater has been the criterion for stencil apertures to achieve acceptable volume control in the printed solder paste “brick,” for small apertures Me
.. read more
Applied Research for Optimizing Process: Parameters for Cleaning Pb-Free Flux
As the electronics industry moves toward the implementation of Pb-free soldering,the impact on the assembly process must
be considered. One process that is often over looked is the cleaning of
.. read more
Qualification of Stacked Microvia Boards for Handset Assembly
The trends of increased functionality and reduced size of portable wireless products,such as handsets and PDAs,are
demanding increased routing densities for printed circuit boards. The handheld
.. read more
Lead-Free Implementation: Drop-In Manufacturing
The Lead-free electronics manufacturing has become a reality. As of this writing,a few manufacturers have rightfully
reported their total completion to Lead-free production across all facilitie
.. read more
Lead Free Reflow Process Control
All areas of manufacturing worldwide are impacted
by the lead free initiative; none more than the reflow
process. The higher melt temperatures and soak
duration of leadless solder formulas requ
.. read more
The Importance of Cooling Rate in the Developing the Totally Controlled Reflow Process for Lead Free and Eutectic Tin Lead...
The impact cooling rates exert on the reflow process is identified. The trends in shear strength and the
microstructural evolution of the solder joints are described. Lead free (Sn/3.5Ag/0.7Cu)
.. read more
Taking the Pain Out of Pb-Free Reflow
The introduction of Pb-free solder into the electronics industry has required changes to the standard surface mount process.
The largest changes are in the reflow process,as Pb-free pastes requ
.. read more
The Bumping of Wafer Level Packages
The relentless trend for smaller,lighter,cheaper consumer products continues to fuel the demand for new,smaller,
efficient electronic packages. In recent years wafer level packaging concepts ha
.. read more
An Efficient Test Model to Study the Board Level Reliability For High I/O Flip Chip BGA Packages
With the increasing demands of complex functions in a single chipset or microprocessor,the development of large
size high I/O Flip Chip BGA (FCBGA) package becomes very important in recent year
.. read more
Implementation of High I/O Count 1mm Pitch BGA Technology
Electronic package size reduction and demand for increased functions within less board space make a challenge for
the PCB designer to find smaller footprint components that will out perform lar
.. read more
Automated SPC for the Reflow Process
This paper will discuss the implementation of real-time automated SPC for the Reflow Process. Topics covered will include: a new statistical method for quantifying the thermal process performan
.. read more