Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Energy Efficient Reflow Soldering Process Using Embedded Carbon Layers
As the reflow soldering process is the main energy consumer in a SMT assembly line, there is a high potential for cost reduction by significantly reducing the amount of energy needed. Meltin
.. read more
A Proposed Mechanism and Remedy for Ball-in-Socket and Foot-in-Mud Soldering Defects on Ball Grid Array and Quad Flat Pack Components
A common source of defects on area array components is the “ball-in-socket” (or “pillowhead”) defect. This defect is
defined as one or more connections that show physical contact but no wetting
.. read more
Energy Efficient Reflow Soldering Process Using Embedded Carbon Layers
As the reflow soldering process is the main energy consumer in a SMT assembly line, there is a high potential for cost reduction by significantly reducing the amount of energy needed. Meltin
.. read more
A Proposed Mechanism and Remedy for Ball-in-Socket and Foot-in-Mud Soldering Defects on Ball Grid Array and Quad Flat Pack Components
A common source of defects on area array components is the “ball-in-socket” (or “pillowhead”) defect. This defect is
defined as one or more connections that show physical contact but no wetting
.. read more