Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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A Lower-Temperature Lead-Free Solder Paste for Wafer-Level Package Application that Outperforms SAC305
An In-containing mid-temperature solder paste (MTS) has been developed and successfully used in mobile phone board-stack soldering with a 200°C peak temperature profile [1]. It is now being
.. read more
Energy Consumption Reduction Using Low-Temperature Solder Alloys
There has been increased interest in reducing energy consumption during SMT assembly over the past few years. Increasingly, the environmental, financial, and regulatory effects have been dem
.. read more
D-PAK Voiding: A Study to Determine the Origins of D-PAK Voiding
Voiding in bottom termination components (BTCs) like QFNs and LGAs have become quote the hot topic in the SMT industry. Surprisingly,one type of BTC component that is observed to have excess
.. read more
The Effect of Reflow Profiling on the Electrical Reliability of No-Clean Solder Paste Flux Residues
An estimated 80% of all SMT assembly in the world is performed with a no-clean soldering process,largely due to the
predominance of consumer-type electronics. The continuing trend of increasing
.. read more
Reduction of Voids in Solder Joints an Alternative to Vacuum Soldering
Voids in solder joints are representing one of the main problems especially for power electronics. A low and homogeneous
thermal resistance of solder joints is demanded for a quick and uniform
.. read more
Assembly Challenges of Bottom Terminated Components
Bottom terminated component (BTC) assembly has rapidly increased in recent years. This type of package is attractive due to its low cost and good functional performance (improved signal speeds
.. read more
Pad Design and Process for Voiding Control at QFN Assembly
Quad Flat No Leads (QFN) package designs receive more and more attention in electronic industry recently. This package offers a number of benefits including (1) small size,such as a near die si
.. read more
The Effects of Partially Activated No-Clean Flux Residues under Component Bodies and No-Clean Flux Residues Entrapped Under RF Cans on...
With the predominance of no-clean soldering processes and ever decreasing component standoff,the industry has had to consider the reliability of,what may be,partially activated or “gooey” flux
.. read more
Selection of Dip Transfer Fluxes and Solder Pastes for PoP Assembly
Consideration and selection of dip transfer flux and solder paste for PoP assembly are described,based on process consideration. The crucial properties vital for successful dip transfer include
.. read more
Low-Silver BGA Assembly Phase II – Reliability Assessment Fifth Report: Preliminary Thermal Cycling Results
Some ball grid array suppliers are migrating their sphere alloys from SAC305 (3% Ag) or SAC405 (4% Ag) to alloys with lower silver contents. There are numerous perceived reliability benefits to
.. read more
Using DMAIC Methodology for MLP Reflow Process Optimization
The widely publicized and studied implementation of lead free solders has led to increased scrutiny on the solder joint formation for surface mount technology electronic components. During the
.. read more
Reflow Process Control Monitoring,and Data Logging
With the introduction of lead free electronics assembly worldwide,greater concerns are raised over factory control of materials and processes. Due to the mix of both leaded and lead free produc
.. read more
Performance of China Alloy SnAgCuCe in Reflow Soldering
Work on assisting China's Ministry of Information Industry (MII) to assess the performance of a solder paste using the China alloy Sn3.0Ag0.5Cu0.019Ce (SACCe) was completed. Two Indium fluxes w
.. read more
The New Lead Free Assembly Rework Solution Using Low Melting Alloys
This paper describes a new lead-free SMT rework process which avoids component overheating,reduces board warpage and cratering,and prevents adjacent components from thermal damage. In the repla
.. read more
A Lower-Temperature Lead-Free Solder Paste for Wafer-Level Package Application that Outperforms SAC305
An In-containing mid-temperature solder paste (MTS) has been developed and successfully used in mobile phone board-stack soldering with a 200°C peak temperature profile [1]. It is now being
.. read more
Energy Consumption Reduction Using Low-Temperature Solder Alloys
There has been increased interest in reducing energy consumption during SMT assembly over the past few years. Increasingly, the environmental, financial, and regulatory effects have been dem
.. read more
D-PAK Voiding: A Study to Determine the Origins of D-PAK Voiding
Voiding in bottom termination components (BTCs) like QFNs and LGAs have become quote the hot topic in the SMT industry. Surprisingly,one type of BTC component that is observed to have excess
.. read more
The Effect of Reflow Profiling on the Electrical Reliability of No-Clean Solder Paste Flux Residues
An estimated 80% of all SMT assembly in the world is performed with a no-clean soldering process,largely due to the
predominance of consumer-type electronics. The continuing trend of increasing
.. read more
Reduction of Voids in Solder Joints an Alternative to Vacuum Soldering
Voids in solder joints are representing one of the main problems especially for power electronics. A low and homogeneous
thermal resistance of solder joints is demanded for a quick and uniform
.. read more
Assembly Challenges of Bottom Terminated Components
Bottom terminated component (BTC) assembly has rapidly increased in recent years. This type of package is attractive due to its low cost and good functional performance (improved signal speeds
.. read more
Pad Design and Process for Voiding Control at QFN Assembly
Quad Flat No Leads (QFN) package designs receive more and more attention in electronic industry recently. This package offers a number of benefits including (1) small size,such as a near die si
.. read more
The Effects of Partially Activated No-Clean Flux Residues under Component Bodies and No-Clean Flux Residues Entrapped Under RF Cans on...
With the predominance of no-clean soldering processes and ever decreasing component standoff,the industry has had to consider the reliability of,what may be,partially activated or “gooey” flux
.. read more
Selection of Dip Transfer Fluxes and Solder Pastes for PoP Assembly
Consideration and selection of dip transfer flux and solder paste for PoP assembly are described,based on process consideration. The crucial properties vital for successful dip transfer include
.. read more
Low-Silver BGA Assembly Phase II – Reliability Assessment Fifth Report: Preliminary Thermal Cycling Results
Some ball grid array suppliers are migrating their sphere alloys from SAC305 (3% Ag) or SAC405 (4% Ag) to alloys with lower silver contents. There are numerous perceived reliability benefits to
.. read more
Using DMAIC Methodology for MLP Reflow Process Optimization
The widely publicized and studied implementation of lead free solders has led to increased scrutiny on the solder joint formation for surface mount technology electronic components. During the
.. read more
Reflow Process Control Monitoring,and Data Logging
With the introduction of lead free electronics assembly worldwide,greater concerns are raised over factory control of materials and processes. Due to the mix of both leaded and lead free produc
.. read more
Performance of China Alloy SnAgCuCe in Reflow Soldering
Work on assisting China's Ministry of Information Industry (MII) to assess the performance of a solder paste using the China alloy Sn3.0Ag0.5Cu0.019Ce (SACCe) was completed. Two Indium fluxes w
.. read more
The New Lead Free Assembly Rework Solution Using Low Melting Alloys
This paper describes a new lead-free SMT rework process which avoids component overheating,reduces board warpage and cratering,and prevents adjacent components from thermal damage. In the repla
.. read more