Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Mixed Metals Impact on Reliability
With the adoption of RoHS and implementation of Lead Free solders a major concern is how this will impact reliability. Both commercial and military hardware are impacted by this change even tho
.. read more
Evaluating the Accuracy of a Nondestructive Thermo Couple Attach Method for Area Array Package Profiling
The oven recipe,which consists of the reflow oven zone temperature settings and the speed of the conveyor,will determine a specific time-temperature profile for a given PCB assembly. In order t
.. read more
Process Development with Temperature Sensitive Components in Server Applications
As the electronics industry prepares for the possibility of Pb-free Printed Circuit Board Assembly (PCBA) processing without the EU RoHS server Pb solder exemption,many studies continue to focu
.. read more
Printed Circuit Board Reliability in High Temperature
This paper will demonstrate the effect high reflow temperatures in lead free processes will have on the reliability of printed
circuit boards from a broad range of laminate materials for both t
.. read more
Mixed Metals Impact on Reliability
With the adoption of RoHS and implementation of Lead Free solders a major concern is how this will impact reliability. Both commercial and military hardware are impacted by this change even tho
.. read more
Evaluating the Accuracy of a Nondestructive Thermo Couple Attach Method for Area Array Package Profiling
The oven recipe,which consists of the reflow oven zone temperature settings and the speed of the conveyor,will determine a specific time-temperature profile for a given PCB assembly. In order t
.. read more
Process Development with Temperature Sensitive Components in Server Applications
As the electronics industry prepares for the possibility of Pb-free Printed Circuit Board Assembly (PCBA) processing without the EU RoHS server Pb solder exemption,many studies continue to focu
.. read more
Printed Circuit Board Reliability in High Temperature
This paper will demonstrate the effect high reflow temperatures in lead free processes will have on the reliability of printed
circuit boards from a broad range of laminate materials for both t
.. read more