Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Semi Quantitative Method for Assessing the Reworkability of Different Underfills
The choice and optimisation of underfills to maximise process productivity and end product performance has been widely studied,and generated numerous performance criteria,flow time cure schedul
.. read more
Rework Challenges for Smart Phones and Tablets
Smart phones are complex,costly devices and therefore need to be reworked correctly the first time.
In order to meet the ever-growing demand for performance,the complexity of mobile devices has
.. read more
Advanced Rework Technology and Processes for Next Generation Large Area Arrays,01005,PoP and QFN Devices
BGA Rework is now largely mature,although new supplemental processes that provide improved process control such as
Solder Paste Dipping and Non-Contact Site Cleaning can now be integrated into
.. read more
Low Temperature SMT Process Implementation
Low Temperature Conversion
•Substantial cost savings over regular processes
•Savings can outweigh paste cost differences
•Can be mechanically stronger if done right
•Involves more than just cha
.. read more
Copper Pad Dissolution and Microstructure Analysis of Reworked Plastic Grid Array Assemblies
An experimental study was conducted to examine the impact of rework processes on quality and reliability. In this study,676 IO plastic ball grid array packages were assembled with Sn3.0Ag0.5Cu
.. read more
Qualification of PWBs Outsourced from Asia
The growth of portable wireless products and related consumer electronics is fueling a major outsourcing effort towards Asia. Most OEM (original equipment manufacturers) are partnering with CMs
.. read more
Failure Analysis of Eutectic and Pb-Free Solder Alloys after High Stress Exposure
Failure analysis was performed on fourteen thermally cycled or vibration tested PDIP components from the JCAA-JG-PP Lead-Free Joint Test Project. The components differed in component finish,sol
.. read more
The New Lead Free Assembly Rework Solution Using Low Melting Alloys
This paper describes a new lead-free SMT rework process which avoids component overheating,reduces board warpage and cratering,and prevents adjacent components from thermal damage. In the repla
.. read more
Lead Free Assembly Qualification of Stacked MicroVia Boards
Beginning July 2006,the electronic industry will enter the age of lead –free assembly and products in Europe. The removal
of lead from electronics brings massive changes for all companies in th
.. read more
Optimization of Lead Free SMT Reflow & Rework Process Window
Elevated SMT reflow temperatures for Pb-free soldering are placing excessive thermal demands on certain families of
electronic components. The High Density Package Users Group,HDPUG,Consortium
.. read more
Optimization of Lead-Free Soldering Processes for Volume Manufacturing
In this paper,a comprehensive review is provided on the optimization of soldering processes (including reflow,wave
soldering,and rework),for different component types,different PCB sizes and fi
.. read more
Perspectives on Repaired Lead-Free Solder Joints
The use of lead-free (LF) solders as a replacement for traditional tin-lead (SnPb) solders in military and high reliability
applications has a number of technical challenges unique to the indus
.. read more
The Use of SAC Solder and Pb-Free Lead Materials in the Repair Scenario
Much work has been done involving the introduction of RoHS and WEEE Directives across the European Union and the
world. Although the use of Pb is limited in new products and equipment,older Pb-
.. read more
Qualification of ALIVH-G Boards for Handset Assembly
The trends of increased functionality and reduced size of portable wireless products,such as handsets; PDAs are demanding
increased routing densities for printed circuit boards. The handheld wi
.. read more
Qualification of Stacked Microvia Boards for Handset Assembly
The trends of increased functionality and reduced size of portable wireless products,such as handsets and PDAs,are
demanding increased routing densities for printed circuit boards. The handheld
.. read more
Investigation of the Manufacturing Challenges of 2577 I/O Flip Chip Ball Grid Arrays
Higher I/O Ball Grid Arrays (BGAs) are high speed,high pin count,and high performance array packages. These BGAs are
also more complex in structure than “standard” BGAs and are generally target
.. read more
Finally! Practical Guidelines for Achieving Successful Lead-Free Assembly
With the Waste Electrical and Electronic Equipment
(WEEE) Directive in Europe outlawing lead from
many electronic devices produced and imported in
the EU by July 2006,as well as with foreign
co
.. read more
Real-Life Tin-Silver-Copper Alloy Processing
The world is stating to focus on tin-silver copper as the lead-free alloy of choice. This paper discusses the
commercially available tin-silver-copper alloys and their processing and reliabilit
.. read more
Semi Quantitative Method for Assessing the Reworkability of Different Underfills
The choice and optimisation of underfills to maximise process productivity and end product performance has been widely studied,and generated numerous performance criteria,flow time cure schedul
.. read more
Rework Challenges for Smart Phones and Tablets
Smart phones are complex,costly devices and therefore need to be reworked correctly the first time.
In order to meet the ever-growing demand for performance,the complexity of mobile devices has
.. read more
Advanced Rework Technology and Processes for Next Generation Large Area Arrays,01005,PoP and QFN Devices
BGA Rework is now largely mature,although new supplemental processes that provide improved process control such as
Solder Paste Dipping and Non-Contact Site Cleaning can now be integrated into
.. read more
Low Temperature SMT Process Implementation
Low Temperature Conversion
•Substantial cost savings over regular processes
•Savings can outweigh paste cost differences
•Can be mechanically stronger if done right
•Involves more than just cha
.. read more
Copper Pad Dissolution and Microstructure Analysis of Reworked Plastic Grid Array Assemblies
An experimental study was conducted to examine the impact of rework processes on quality and reliability. In this study,676 IO plastic ball grid array packages were assembled with Sn3.0Ag0.5Cu
.. read more
Qualification of PWBs Outsourced from Asia
The growth of portable wireless products and related consumer electronics is fueling a major outsourcing effort towards Asia. Most OEM (original equipment manufacturers) are partnering with CMs
.. read more
Failure Analysis of Eutectic and Pb-Free Solder Alloys after High Stress Exposure
Failure analysis was performed on fourteen thermally cycled or vibration tested PDIP components from the JCAA-JG-PP Lead-Free Joint Test Project. The components differed in component finish,sol
.. read more
The New Lead Free Assembly Rework Solution Using Low Melting Alloys
This paper describes a new lead-free SMT rework process which avoids component overheating,reduces board warpage and cratering,and prevents adjacent components from thermal damage. In the repla
.. read more
Lead Free Assembly Qualification of Stacked MicroVia Boards
Beginning July 2006,the electronic industry will enter the age of lead –free assembly and products in Europe. The removal
of lead from electronics brings massive changes for all companies in th
.. read more
Optimization of Lead Free SMT Reflow & Rework Process Window
Elevated SMT reflow temperatures for Pb-free soldering are placing excessive thermal demands on certain families of
electronic components. The High Density Package Users Group,HDPUG,Consortium
.. read more
Optimization of Lead-Free Soldering Processes for Volume Manufacturing
In this paper,a comprehensive review is provided on the optimization of soldering processes (including reflow,wave
soldering,and rework),for different component types,different PCB sizes and fi
.. read more
Perspectives on Repaired Lead-Free Solder Joints
The use of lead-free (LF) solders as a replacement for traditional tin-lead (SnPb) solders in military and high reliability
applications has a number of technical challenges unique to the indus
.. read more
The Use of SAC Solder and Pb-Free Lead Materials in the Repair Scenario
Much work has been done involving the introduction of RoHS and WEEE Directives across the European Union and the
world. Although the use of Pb is limited in new products and equipment,older Pb-
.. read more
Qualification of ALIVH-G Boards for Handset Assembly
The trends of increased functionality and reduced size of portable wireless products,such as handsets; PDAs are demanding
increased routing densities for printed circuit boards. The handheld wi
.. read more
Qualification of Stacked Microvia Boards for Handset Assembly
The trends of increased functionality and reduced size of portable wireless products,such as handsets and PDAs,are
demanding increased routing densities for printed circuit boards. The handheld
.. read more
Investigation of the Manufacturing Challenges of 2577 I/O Flip Chip Ball Grid Arrays
Higher I/O Ball Grid Arrays (BGAs) are high speed,high pin count,and high performance array packages. These BGAs are
also more complex in structure than “standard” BGAs and are generally target
.. read more
Finally! Practical Guidelines for Achieving Successful Lead-Free Assembly
With the Waste Electrical and Electronic Equipment
(WEEE) Directive in Europe outlawing lead from
many electronic devices produced and imported in
the EU by July 2006,as well as with foreign
co
.. read more
Real-Life Tin-Silver-Copper Alloy Processing
The world is stating to focus on tin-silver copper as the lead-free alloy of choice. This paper discusses the
commercially available tin-silver-copper alloys and their processing and reliabilit
.. read more