Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Optimising Rheology for Package-on-Package Flux Dip Processes
The continued drive for more compact and lightweight handheld mobile devices has forcibly pushed the electronics assembly industry to look for novel packaging and assembly technologies. One of
.. read more
Thixotropy of Solder Paste Impacts Repeatability and Reproducibility of Rheometric Results
The widespread use of SAC-based (SnAgCu) lead-free solder paste drives the industry toward a smaller process window. This is due to higher reflow temperatures as well as the limited thermal res
.. read more
The Effect of Processing,Glass Finish,and Rheology on the Interlaminar Shear Strength of a Woven e-Glass Reinforced Polymer Matrix Composite
Laminated woven glass reinforced polymer matrix composites (PMC) are commonly used in the electronics industry as a
robust and effective substrate for circuit boards. In such applications,relia
.. read more
A Proposed Mechanism and Remedy for Ball-in-Socket and Foot-in-Mud Soldering Defects on Ball Grid Array and Quad Flat Pack Components
A common source of defects on area array components is the “ball-in-socket” (or “pillowhead”) defect. This defect is
defined as one or more connections that show physical contact but no wetting
.. read more
Oxidation and Topography of Powder in Pb-free Solder Paste
There are compelling reasons to study the relationship between oxidation and the topography of solder powder; these
include the following:
?? Customer requirements to reflow SAC-based (SnAgCu)
.. read more
Squeegee Blades vs. Pump Technology: A Comparison of Solder Paste Print Performance
Enclosed print heads have recently been available to circuit board manufacturers as an alternate technology to conventional
squeegee printing. By design,enclosed print heads offer several advan
.. read more
Effect of Alloy and Composition on Shelf Life of Water Soluble Solder Pastes
Shelf life is one of the most important characteristics of solder paste. Many pastes exhibit good print characteristics
when fresh but then suffer rapid degradation. Although rosin based pastes
.. read more
Optimization Study for Solder Pastes Used in Wafer Bumping Applications
Solder paste for use in wafer bumping applications is becoming an extremely viable technology. Yields from solder
paste printing applications are approaching that of typical bumping technologie
.. read more
Comparison of High-Tg-FR-4 Base Materials
Customer demands concerning thermal stability of PCB base materials are increasing. Rising complexity of
printed circuit boards requires an improved quality of the dielectric in terms of cleanl
.. read more
Optimising Rheology for Package-on-Package Flux Dip Processes
The continued drive for more compact and lightweight handheld mobile devices has forcibly pushed the electronics assembly industry to look for novel packaging and assembly technologies. One of
.. read more
Thixotropy of Solder Paste Impacts Repeatability and Reproducibility of Rheometric Results
The widespread use of SAC-based (SnAgCu) lead-free solder paste drives the industry toward a smaller process window. This is due to higher reflow temperatures as well as the limited thermal res
.. read more
The Effect of Processing,Glass Finish,and Rheology on the Interlaminar Shear Strength of a Woven e-Glass Reinforced Polymer Matrix Composite
Laminated woven glass reinforced polymer matrix composites (PMC) are commonly used in the electronics industry as a
robust and effective substrate for circuit boards. In such applications,relia
.. read more
A Proposed Mechanism and Remedy for Ball-in-Socket and Foot-in-Mud Soldering Defects on Ball Grid Array and Quad Flat Pack Components
A common source of defects on area array components is the “ball-in-socket” (or “pillowhead”) defect. This defect is
defined as one or more connections that show physical contact but no wetting
.. read more
Oxidation and Topography of Powder in Pb-free Solder Paste
There are compelling reasons to study the relationship between oxidation and the topography of solder powder; these
include the following:
?? Customer requirements to reflow SAC-based (SnAgCu)
.. read more
Squeegee Blades vs. Pump Technology: A Comparison of Solder Paste Print Performance
Enclosed print heads have recently been available to circuit board manufacturers as an alternate technology to conventional
squeegee printing. By design,enclosed print heads offer several advan
.. read more
Effect of Alloy and Composition on Shelf Life of Water Soluble Solder Pastes
Shelf life is one of the most important characteristics of solder paste. Many pastes exhibit good print characteristics
when fresh but then suffer rapid degradation. Although rosin based pastes
.. read more
Optimization Study for Solder Pastes Used in Wafer Bumping Applications
Solder paste for use in wafer bumping applications is becoming an extremely viable technology. Yields from solder
paste printing applications are approaching that of typical bumping technologie
.. read more
Comparison of High-Tg-FR-4 Base Materials
Customer demands concerning thermal stability of PCB base materials are increasing. Rising complexity of
printed circuit boards requires an improved quality of the dielectric in terms of cleanl
.. read more