Knowledge Hub

Your Gateway to Technical Knowledge Exchange for the Global Electronics Community

Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.

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Unique Implementation of a 15 Layer,Unboned/Looseleaf,Bookbinder Rigid Flex with Backdrill and LGA Interconnect

While flex and rigid flex (IPC-6013 Types 1 through 4i[1]) have always been important in 3D packaging to help resolve space constraints and meet other design requirements,the continued push for .. read more

Direct Plating for Flex and Rigid-Flex Boards

In manufacturing flexible and rigid-flex boards,the metallization step using electroless copper poses a major challenge,namely the leaching of polyimide base material into the plating bath. Lea .. read more

R/flex® 3000 Advanced Circuit Materials = LCP Stability & Performance from 1GHz to 110 GHz

This paper will discuss how R/flex® 3000 LCP materials from Rogers Corporation are "pushing the envelope" for high - frequency & flex designs by examining: 1. How the material set has now been .. read more

Unique Implementation of a 15 Layer,Unboned/Looseleaf,Bookbinder Rigid Flex with Backdrill and LGA Interconnect

While flex and rigid flex (IPC-6013 Types 1 through 4i[1]) have always been important in 3D packaging to help resolve space constraints and meet other design requirements,the continued push for .. read more

Direct Plating for Flex and Rigid-Flex Boards

In manufacturing flexible and rigid-flex boards,the metallization step using electroless copper poses a major challenge,namely the leaching of polyimide base material into the plating bath. Lea .. read more

R/flex® 3000 Advanced Circuit Materials = LCP Stability & Performance from 1GHz to 110 GHz

This paper will discuss how R/flex® 3000 LCP materials from Rogers Corporation are "pushing the envelope" for high - frequency & flex designs by examining: 1. How the material set has now been .. read more