Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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The Gap Dilemma in the Technical Cleanliness of Electronic Assemblies – Why Foreign Object Debris on Electronic Assemblies is not...
Technical Cleanliness, i.e., the quantification, control and mitigation of deleterious effects of foreign object debris (FOD), is a common challenge in engineering. In the context of electro
.. read more
Prediction of Whisker Growth Positions at Press-Fit Connections Using Finite Element Analysis
Compliant press-fit connections using a pure tin finish are prone to spontaneous long whisker growth after press-in, which may result in malfunction of the electronic circuits. The origin of
.. read more
FEA Study of Solder Hole Fill Impact on the Reliability of PTH Solder Joints
This paper is focused on the impact of solder hole fill on the reliability of the plated-through-hole (PTH) solder joints with different board thicknesses. Finite element analysis (FEA) is empl
.. read more
BGA Solder Joint Mechanical Risk Assessment during System Level Shock Test
The pressure to reduce overall form-factor size in the high volume chassis desktop market is driving the need to integrate components at the system level. Adding to the challenge of size reduct
.. read more
A Case Study of an OEM's Program to Assess Supplier Capabilities,Technology Availability,and Reliability for Advanced Printed Circuit Boards
Teradyne,Inc. has been involved with Conductor Analysis Technologies,Inc. (CAT Inc.) for over 4 years and the
IPC D-36 Subcommittee for over 2 years. This paper describes the initial motivation
.. read more
The Gap Dilemma in the Technical Cleanliness of Electronic Assemblies – Why Foreign Object Debris on Electronic Assemblies is not...
Technical Cleanliness, i.e., the quantification, control and mitigation of deleterious effects of foreign object debris (FOD), is a common challenge in engineering. In the context of electro
.. read more
Prediction of Whisker Growth Positions at Press-Fit Connections Using Finite Element Analysis
Compliant press-fit connections using a pure tin finish are prone to spontaneous long whisker growth after press-in, which may result in malfunction of the electronic circuits. The origin of
.. read more
FEA Study of Solder Hole Fill Impact on the Reliability of PTH Solder Joints
This paper is focused on the impact of solder hole fill on the reliability of the plated-through-hole (PTH) solder joints with different board thicknesses. Finite element analysis (FEA) is empl
.. read more
BGA Solder Joint Mechanical Risk Assessment during System Level Shock Test
The pressure to reduce overall form-factor size in the high volume chassis desktop market is driving the need to integrate components at the system level. Adding to the challenge of size reduct
.. read more
A Case Study of an OEM's Program to Assess Supplier Capabilities,Technology Availability,and Reliability for Advanced Printed Circuit Boards
Teradyne,Inc. has been involved with Conductor Analysis Technologies,Inc. (CAT Inc.) for over 4 years and the
IPC D-36 Subcommittee for over 2 years. This paper describes the initial motivation
.. read more