Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Solder Alloy Contribution to Robust Selective Soldering Process
The number of components and functionality on a printed circuit board increases continuously. Surface mount device (SMD) components become smaller, pitch dimensions shrink, but there are sti
.. read more
Evaluations onThe Mixing andReliability Testingof Tin-Bismuth Pastes withSnAgCu BGA Components andReliability Failure Analysis Comparing CT (Computed Tomography) Inspection andCross-Sectioning
Recently there has been an increase in the evaluation of low temperature lead-free soldering materials, such as tin-bismuth, in a process known as “hybrid assembly” in which higher temperatu
.. read more
Reliability of New SAC-Bi Solder Alloys in Thermal Cycling with Aging
Drive towards lead-free electronics began in the early 2000s. Solder pastes based on tin (Sn), copper (Cu), and silver (Ag) were the initial replacement for the traditional SnPb solder. With
.. read more
Implementing Pb-Free Process
European directive2002/95/EC (RoHS) bans the use of several substances for electronic assemblies by July 2006. These
regulations have a great impact on the Electronic Packaging and Interconnect
.. read more
Solder Alloy Contribution to Robust Selective Soldering Process
The number of components and functionality on a printed circuit board increases continuously. Surface mount device (SMD) components become smaller, pitch dimensions shrink, but there are sti
.. read more
Evaluations onThe Mixing andReliability Testingof Tin-Bismuth Pastes withSnAgCu BGA Components andReliability Failure Analysis Comparing CT (Computed Tomography) Inspection andCross-Sectioning
Recently there has been an increase in the evaluation of low temperature lead-free soldering materials, such as tin-bismuth, in a process known as “hybrid assembly” in which higher temperatu
.. read more
Reliability of New SAC-Bi Solder Alloys in Thermal Cycling with Aging
Drive towards lead-free electronics began in the early 2000s. Solder pastes based on tin (Sn), copper (Cu), and silver (Ag) were the initial replacement for the traditional SnPb solder. With
.. read more
Implementing Pb-Free Process
European directive2002/95/EC (RoHS) bans the use of several substances for electronic assemblies by July 2006. These
regulations have a great impact on the Electronic Packaging and Interconnect
.. read more