Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Nondestructive Inspection of Underfill Layers Stacked up in Ceramics-Organics-Ceramics Packages with Scanning Acoustic Tomography (SAT)
Ceramics packages are being used in the electronics industry to operate the devices in harsh environments. In this paper we report a study on acoustic imaging technology for nondestructively in
.. read more
Development of a Design & Manufacturing Environment for Reliable and Cost- Effective PCB Embedding Technology
The desire to have more functionality into increasingly smaller size end products has been pushing the PCB and IC
Packaging industry towards High Density Interconnect (HDI) and 3D Packaging (st
.. read more
Nondestructive Inspection of Underfill Layers Stacked up in Ceramics-Organics-Ceramics Packages with Scanning Acoustic Tomography (SAT)
Ceramics packages are being used in the electronics industry to operate the devices in harsh environments. In this paper we report a study on acoustic imaging technology for nondestructively in
.. read more
Development of a Design & Manufacturing Environment for Reliable and Cost- Effective PCB Embedding Technology
The desire to have more functionality into increasingly smaller size end products has been pushing the PCB and IC
Packaging industry towards High Density Interconnect (HDI) and 3D Packaging (st
.. read more