Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Selective Solder Nozzles: Insight Into Wear Mechanisms and Future Developments
Selective soldering utilizes wettable metal nozzles for controlled application of solder to components. The wetting of solder to the nozzles is part of a complex mechanism that causes wear o
.. read more
New Soldering Technology for High and Mixed-Volume Through-Hole Pin Devices
Surface mount technology was developed in the 1960s and implemented on printed circuit boards in the 1980s. High-density electronic assemblies are dominated nowadays by surface mount devices
.. read more
Use of Photonic Soldering to Rework Chip Components
Rework of assembled boards is often a necessary but difficult proposition. The complexity of the rework increases with the number of components to be reworked. A specific case involves where
.. read more
Selective Soldering with Alternative Lead-Free Alloys
The electronics industry is still searching for alternative lead-free alloys. Selective soldering requires relatively high solder temperatures to get proper hole filling. Alternative alloys
.. read more
Elimination of Wave Soldering Process
Wave soldering of pin through hole devices has been around for a very long time. It is a process that everyone says will go away and each year it is still being used. In the industry,wave solde
.. read more
Design Improvements for Selective Soldering Assemblies
Selective soldering,along with pin-in-paste reflow and press fit,is the primary assembly method for through-hole components. The reflow process is limited by component dimensions and heat resis
.. read more
How to Use the Right Flux for the Selective Soldering Application
The selective soldering application requires a combination of performance attributes that traditional liquid fluxes designed for wave soldering applications cannot fulfill. First,the flux depos
.. read more
Position Accuracy Machines for Selective Soldering Fine Pitch Components
The drive towards fine pitch technology also affects the soldering processes. Selective soldering is a reliable soldering process for THT (through hole) connectors and offers a wide process win
.. read more
Liquid Flux Selection and Process Optimization for Selective Soldering Applications
There has been a rapid increase in the use of selective soldering equipment for PCB assembly
–Lower equipment costs
–Smaller equipment footprint
–Lower solder “inventory” cost (smaller pots)
–D
.. read more
How to Manage Wave Solder Alloy Contaminations
European electronics industry is soldering with lead-free alloys for one decade now. In this period not only the knowledge of the alloys in the assembly process has been improved,but also a hig
.. read more
Down-Selecting Low Solids Fluxes for Pb-free Selective Soldering
Although many predicted the demise of through-hole components,they are alive and well with tens of billions used each year. In mixed SMT/through-hole PCBs,through-hole components,and especially
.. read more
Selective Soldering for Interconnection Technology Used in Enterprise Communication Apparatuses
At times,wave soldering or reflow involving the entire assembly are not applicable for soldering of components. Selective soldering techniques vary widely in their ability to produce high quali
.. read more
Productivity and Cost Efficiency of Lead-Free Selective Soldering
With the advent of widespread lead-free soldering,the issue of copper erosion has surfaced as a major quality concern when
soldering RoHS compliant through-hole devices. Many contract electroni
.. read more
NEMI Update on Optoelectronics Initiatives
National Electronics Manufacturing Initiative (NEMI) initiated six projects in late 2001 and 2002 addressing key
issues identified by the industry. These cover the areas of Fiber Management,Sig
.. read more
Selective Soldering Of Flexible Circuits Using Diode Lasers
The use of laser technology has found increasing applications in the electronics assembly industry. This non-contact
heating technique is ideal for components that require careful handling whic
.. read more
New Challenges in Selective Soldering
Current circuit board designs,particularly those in telecommunications,are so densely populated that they do not
provide enough clearance between SMT components and through-hole components to a
.. read more
Selective Solder Nozzles: Insight Into Wear Mechanisms and Future Developments
Selective soldering utilizes wettable metal nozzles for controlled application of solder to components. The wetting of solder to the nozzles is part of a complex mechanism that causes wear o
.. read more
New Soldering Technology for High and Mixed-Volume Through-Hole Pin Devices
Surface mount technology was developed in the 1960s and implemented on printed circuit boards in the 1980s. High-density electronic assemblies are dominated nowadays by surface mount devices
.. read more
Use of Photonic Soldering to Rework Chip Components
Rework of assembled boards is often a necessary but difficult proposition. The complexity of the rework increases with the number of components to be reworked. A specific case involves where
.. read more
Selective Soldering with Alternative Lead-Free Alloys
The electronics industry is still searching for alternative lead-free alloys. Selective soldering requires relatively high solder temperatures to get proper hole filling. Alternative alloys
.. read more
Elimination of Wave Soldering Process
Wave soldering of pin through hole devices has been around for a very long time. It is a process that everyone says will go away and each year it is still being used. In the industry,wave solde
.. read more
Design Improvements for Selective Soldering Assemblies
Selective soldering,along with pin-in-paste reflow and press fit,is the primary assembly method for through-hole components. The reflow process is limited by component dimensions and heat resis
.. read more
How to Use the Right Flux for the Selective Soldering Application
The selective soldering application requires a combination of performance attributes that traditional liquid fluxes designed for wave soldering applications cannot fulfill. First,the flux depos
.. read more
Position Accuracy Machines for Selective Soldering Fine Pitch Components
The drive towards fine pitch technology also affects the soldering processes. Selective soldering is a reliable soldering process for THT (through hole) connectors and offers a wide process win
.. read more
Liquid Flux Selection and Process Optimization for Selective Soldering Applications
There has been a rapid increase in the use of selective soldering equipment for PCB assembly
–Lower equipment costs
–Smaller equipment footprint
–Lower solder “inventory” cost (smaller pots)
–D
.. read more
How to Manage Wave Solder Alloy Contaminations
European electronics industry is soldering with lead-free alloys for one decade now. In this period not only the knowledge of the alloys in the assembly process has been improved,but also a hig
.. read more
Down-Selecting Low Solids Fluxes for Pb-free Selective Soldering
Although many predicted the demise of through-hole components,they are alive and well with tens of billions used each year. In mixed SMT/through-hole PCBs,through-hole components,and especially
.. read more
Selective Soldering for Interconnection Technology Used in Enterprise Communication Apparatuses
At times,wave soldering or reflow involving the entire assembly are not applicable for soldering of components. Selective soldering techniques vary widely in their ability to produce high quali
.. read more
Productivity and Cost Efficiency of Lead-Free Selective Soldering
With the advent of widespread lead-free soldering,the issue of copper erosion has surfaced as a major quality concern when
soldering RoHS compliant through-hole devices. Many contract electroni
.. read more
NEMI Update on Optoelectronics Initiatives
National Electronics Manufacturing Initiative (NEMI) initiated six projects in late 2001 and 2002 addressing key
issues identified by the industry. These cover the areas of Fiber Management,Sig
.. read more
Selective Soldering Of Flexible Circuits Using Diode Lasers
The use of laser technology has found increasing applications in the electronics assembly industry. This non-contact
heating technique is ideal for components that require careful handling whic
.. read more
New Challenges in Selective Soldering
Current circuit board designs,particularly those in telecommunications,are so densely populated that they do not
provide enough clearance between SMT components and through-hole components to a
.. read more