Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Applications of Semi-Additive Process Technology to PCB Design and Production
Traditional Subtractive Etch (SE) processes used to manufacture Printed Circuit Boards (PCBs) are adequate for many of today’s circuit designs. However, certain parts of PCBs, and more gener
.. read more
Semi-Additive Process for Variant Polyimide Substrates in Ultra-Fine Flexible Circuitry
Ultra-fine flexible circuitry has been more and more applied in electronic devices due to their fast innovation and the increasing demand on miniaturization,light weight and flexibility in some
.. read more
Next Generation Pattern Electroplating Process for Microvia Filling and Through Hole Plating
The use of electrodeposited copper for filling blind microvias has grown rapidly to become an essential and widely adopted
process used by various Printed Circuit Board (PCB) and package substr
.. read more
The Latest Technical Trend of Dry Film Photo Resist
This paper describes the performance of several types of the most advanced Dry Film photo Resist (DFR),for producing
high-density package substrates and chip on films (COF).
1) High resolution
.. read more
New Circuit Formation Technology for High Density PWB
To meet future requirements for PWBs,various technologies of processes,materials and tools of PWBs have been discussed.
Especially important are technologies of circuit formation for high-end P
.. read more
Insulation Material for Next Generation Packaging Substrates
With the progress of miniaturizing electronic equipment with higher performance,packaging substrates for semiconductor
devices are required to cope with finer patterning and higher wiring densi
.. read more
Direct Laser Drillable Ultra Thin Copper Foils for Advanced PCB Manufacture
The demand for small packaging for portable electronic equipment and reduced chip form factor with higher interconnect fan-out,is driving printed circuit substrate technology rapidly forward. T
.. read more
Applications of Semi-Additive Process Technology to PCB Design and Production
Traditional Subtractive Etch (SE) processes used to manufacture Printed Circuit Boards (PCBs) are adequate for many of today’s circuit designs. However, certain parts of PCBs, and more gener
.. read more
Semi-Additive Process for Variant Polyimide Substrates in Ultra-Fine Flexible Circuitry
Ultra-fine flexible circuitry has been more and more applied in electronic devices due to their fast innovation and the increasing demand on miniaturization,light weight and flexibility in some
.. read more
Next Generation Pattern Electroplating Process for Microvia Filling and Through Hole Plating
The use of electrodeposited copper for filling blind microvias has grown rapidly to become an essential and widely adopted
process used by various Printed Circuit Board (PCB) and package substr
.. read more
The Latest Technical Trend of Dry Film Photo Resist
This paper describes the performance of several types of the most advanced Dry Film photo Resist (DFR),for producing
high-density package substrates and chip on films (COF).
1) High resolution
.. read more
New Circuit Formation Technology for High Density PWB
To meet future requirements for PWBs,various technologies of processes,materials and tools of PWBs have been discussed.
Especially important are technologies of circuit formation for high-end P
.. read more
Insulation Material for Next Generation Packaging Substrates
With the progress of miniaturizing electronic equipment with higher performance,packaging substrates for semiconductor
devices are required to cope with finer patterning and higher wiring densi
.. read more
Direct Laser Drillable Ultra Thin Copper Foils for Advanced PCB Manufacture
The demand for small packaging for portable electronic equipment and reduced chip form factor with higher interconnect fan-out,is driving printed circuit substrate technology rapidly forward. T
.. read more