Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Oxidation Resistant Nano-Cu Sintering Paste for Die Attach Applications
A nano-Cu pressureless sinterable paste was developed for joint formation applications. The material was further engineered in both chemistry and process for enhanced oxidation resistance. T
.. read more
Low Temperature Soldering: Thermal Cycling Reliability Performance
The technical and economic benefits derived from lowering the reflow temperatures have motivated the evaluation of new Sn-Bi low temperature alloys for soldering. Eutectic Sn-Bi alloy is usu
.. read more
Low Cost High Reliability Assembly of POP with Novel Epoxy Flux on Solder Paste
A novel epoxy flux was developed with good compatibility with no-clean solder pastes,which imparts high reliability for BGA assembly at a low cost. This compatibility with solder pastes is achi
.. read more
Effect of BGA Reballing and its Influence on Ball Shear Strength
As more components are becoming lead free and not available in the tin lead alloy,there is an industry wide interest when it comes to the reballing and the subsequent effects it has on the stre
.. read more
Effect of Toughening and E-Glass Sizing on Fracture Toughness and Delamination in High Thermal Stability Electrical Laminates
In this work we report results of the fracture toughness of a high thermal stability resin system toughened by The Dow Chemical Company proprietary particulate-type toughening material. Results
.. read more
A Plasma Deposited Surface Finish for Printed Circuit Boards
This paper will discuss a new approach to the final finishing for the PCB industry which is based on the use of an ultra-thin
fluoropolymer film as a protective coating to preserve solderabilit
.. read more
Solder Charge Grid Array: Advancements in the Technology of Surface Mount Area Array Solder Joint Attachment
Surface mount area arrays (SMAA) have been in existence for decades and are increasingly becoming more important as printed circuit board (PCB) assemblies become further complex with package mi
.. read more
Bridging Supply Chain Gap for Exempt High-Reliability OEM’s
RoHS exempt high reliability OEMs breathed a sign of relief for not having to go through the grind of revising their processes and material to be RoHS compliant. However,this was short lived be
.. read more
An Investigation into Hand Sanitizers and Hand Lotions and Potential Risks to High Performance Electronics
As people become more concerned about the global outbreaks of various strains of influenza,more precautions are being taken with respect to personal hygiene. A common precaution involves the us
.. read more
Examination of Common Delamination Resistance Tests for Electrical Grade
The delamination of electrical grade laminates continues to be a vexing problem for the printed circuit board industry. Laminates are commonly tailored to meet specific thickness and dielectric
.. read more
A Comparison Study on Sn3.5Ag and Sn3.8Ag0.7Cu C5 Lead Free Solder System
A comparison study was carried out with Sn3.5Ag and Sn3.8Ag0.7Cu solder balls on Ball Grid Array (BGA) components
with Cu/Ni/Au pad finishing. This study shows that Sn3.5Ag C5 solder system per
.. read more
Production Experience and Performance Characterization of a Novel Immersion Silver
Following previous reports by the authors on the general properties of a novel immersion silver process,this paper presents
the production experience in typical horizontal lines to demonstrate
.. read more
The Importance of Cooling Rate in the Developing the Totally Controlled Reflow Process for Lead Free and Eutectic Tin Lead...
The impact cooling rates exert on the reflow process is identified. The trends in shear strength and the
microstructural evolution of the solder joints are described. Lead free (Sn/3.5Ag/0.7Cu)
.. read more
Taking the Pain Out of Pb-Free Reflow
The introduction of Pb-free solder into the electronics industry has required changes to the standard surface mount process.
The largest changes are in the reflow process,as Pb-free pastes requ
.. read more
Oxidation Resistant Nano-Cu Sintering Paste for Die Attach Applications
A nano-Cu pressureless sinterable paste was developed for joint formation applications. The material was further engineered in both chemistry and process for enhanced oxidation resistance. T
.. read more
Low Temperature Soldering: Thermal Cycling Reliability Performance
The technical and economic benefits derived from lowering the reflow temperatures have motivated the evaluation of new Sn-Bi low temperature alloys for soldering. Eutectic Sn-Bi alloy is usu
.. read more
Low Cost High Reliability Assembly of POP with Novel Epoxy Flux on Solder Paste
A novel epoxy flux was developed with good compatibility with no-clean solder pastes,which imparts high reliability for BGA assembly at a low cost. This compatibility with solder pastes is achi
.. read more
Effect of BGA Reballing and its Influence on Ball Shear Strength
As more components are becoming lead free and not available in the tin lead alloy,there is an industry wide interest when it comes to the reballing and the subsequent effects it has on the stre
.. read more
Effect of Toughening and E-Glass Sizing on Fracture Toughness and Delamination in High Thermal Stability Electrical Laminates
In this work we report results of the fracture toughness of a high thermal stability resin system toughened by The Dow Chemical Company proprietary particulate-type toughening material. Results
.. read more
A Plasma Deposited Surface Finish for Printed Circuit Boards
This paper will discuss a new approach to the final finishing for the PCB industry which is based on the use of an ultra-thin
fluoropolymer film as a protective coating to preserve solderabilit
.. read more
Solder Charge Grid Array: Advancements in the Technology of Surface Mount Area Array Solder Joint Attachment
Surface mount area arrays (SMAA) have been in existence for decades and are increasingly becoming more important as printed circuit board (PCB) assemblies become further complex with package mi
.. read more
Bridging Supply Chain Gap for Exempt High-Reliability OEM’s
RoHS exempt high reliability OEMs breathed a sign of relief for not having to go through the grind of revising their processes and material to be RoHS compliant. However,this was short lived be
.. read more
An Investigation into Hand Sanitizers and Hand Lotions and Potential Risks to High Performance Electronics
As people become more concerned about the global outbreaks of various strains of influenza,more precautions are being taken with respect to personal hygiene. A common precaution involves the us
.. read more
Examination of Common Delamination Resistance Tests for Electrical Grade
The delamination of electrical grade laminates continues to be a vexing problem for the printed circuit board industry. Laminates are commonly tailored to meet specific thickness and dielectric
.. read more
A Comparison Study on Sn3.5Ag and Sn3.8Ag0.7Cu C5 Lead Free Solder System
A comparison study was carried out with Sn3.5Ag and Sn3.8Ag0.7Cu solder balls on Ball Grid Array (BGA) components
with Cu/Ni/Au pad finishing. This study shows that Sn3.5Ag C5 solder system per
.. read more
Production Experience and Performance Characterization of a Novel Immersion Silver
Following previous reports by the authors on the general properties of a novel immersion silver process,this paper presents
the production experience in typical horizontal lines to demonstrate
.. read more
The Importance of Cooling Rate in the Developing the Totally Controlled Reflow Process for Lead Free and Eutectic Tin Lead...
The impact cooling rates exert on the reflow process is identified. The trends in shear strength and the
microstructural evolution of the solder joints are described. Lead free (Sn/3.5Ag/0.7Cu)
.. read more
Taking the Pain Out of Pb-Free Reflow
The introduction of Pb-free solder into the electronics industry has required changes to the standard surface mount process.
The largest changes are in the reflow process,as Pb-free pastes requ
.. read more