Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Surface Treatment Enabling Low Temperature Soldering to Aluminum
The majority of flexible circuits are made by patterning copper metal that is laminated to a flexible substrate, which is usually polyimide film of varying thickness. An increasingly popular
.. read more
High Temperature Thermal Cycling Reliability Testing of a High Reliability Lead-free Solder Alloy
In recent years there has been an increased demand for electronic products with high reliability solder alloys having improved performance in thermal cycle resistance for harsh working envir
.. read more
Evaluation of Solder Pastes for Flux Residue Mitigation in Cleaning Machines*
Recently new semi-aqueous in-line cleaning machines (CM) were installed; however, the associated increased volumes of circuit card assemblies (CCAs) being cleaned after SMT surface mount tec
.. read more
Impact of Lead Contamination on Reliability of Lead Free Alloys
Meeting the RoHS directive will require the transition from the historical tin-lead based system of materials to one that
does not contain lead. This is of course is not straight forward as it
.. read more
Solderability Testing Methodologies for BGA Packages
Solderability testing is carried out at the IC (Integrated Circuit) manufacturer’s end to evaluate the quality of the IC
package terminals in terms of solder wetting ability. Current industrial
.. read more
Evaluating the Use of Next Generation Reflow Profile Control for High Volume Electronics Manufacturing
In recent years,technological advances in electronics manufacturing have allowed high volume manufacturers to
significantly improve process control and documentation. Manufacturers have acceler
.. read more
Surface Treatment Enabling Low Temperature Soldering to Aluminum
The majority of flexible circuits are made by patterning copper metal that is laminated to a flexible substrate, which is usually polyimide film of varying thickness. An increasingly popular
.. read more
High Temperature Thermal Cycling Reliability Testing of a High Reliability Lead-free Solder Alloy
In recent years there has been an increased demand for electronic products with high reliability solder alloys having improved performance in thermal cycle resistance for harsh working envir
.. read more
Evaluation of Solder Pastes for Flux Residue Mitigation in Cleaning Machines*
Recently new semi-aqueous in-line cleaning machines (CM) were installed; however, the associated increased volumes of circuit card assemblies (CCAs) being cleaned after SMT surface mount tec
.. read more
Impact of Lead Contamination on Reliability of Lead Free Alloys
Meeting the RoHS directive will require the transition from the historical tin-lead based system of materials to one that
does not contain lead. This is of course is not straight forward as it
.. read more
Solderability Testing Methodologies for BGA Packages
Solderability testing is carried out at the IC (Integrated Circuit) manufacturer’s end to evaluate the quality of the IC
package terminals in terms of solder wetting ability. Current industrial
.. read more
Evaluating the Use of Next Generation Reflow Profile Control for High Volume Electronics Manufacturing
In recent years,technological advances in electronics manufacturing have allowed high volume manufacturers to
significantly improve process control and documentation. Manufacturers have acceler
.. read more