Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Fabric Weaving and Circuit Orientations Impact for Skew / Signal Integrity
This Presentation discusses Improvements for signal integrity. Signal integrity is based on the copper surface roughness, the oxides on the copper, and the Dielectric constant of the D
.. read more
Nano Structuring Photoresist Adhesion Promoter for Improved Signal Integrity in the Modern HDI-PCB Fabrication
The euphoria associated with the biggest technological step in the field of telecommunications in recent history, the new 5G mobile communications standard, not only made it necessary for OE
.. read more
Adhesion Enhancement System for Next Generation High Speed IC Substrate
Driven by the demand for advanced electronic devices where massive wireless data transfer is required, a new generation of communication system, so called 5G has been developed. This new tec
.. read more
Signal Integrity, Reliability, and Cost Evaluation of PCB Interlayer Crosstalk Reduction
The push for faster data rates and increased signal density in printed circuit boards (PCBs) increases the risk of signal crosstalk on high-speed communication busses which can be highly det
.. read more
Semi-AdditivePCBProcessing: Process, Reliability Testing andApplications
The continued miniaturization of both packaging and component size in next-generation electronics presents a significant challenge for PCB designers and PCB fabricators. To effectively navig
.. read more
Why Signal Always Be Loss in a High Speed Frequency Transmission Line
The high speed transmission applications in the electronic product become inevitable developing trend. The signal integrity becomes the most important issue in the electronic industry. The mate
.. read more
Behavior of Materials in the Manufacturing Environment
This study was conducted to understand seven materials reliability,behavior of Dielectric constant and Dissipation factor over medium to high frequencies. A modified version of HDPUG design was
.. read more
iNEMI HFR-Free Signal Integrity Project: An Investigation to Identify Degradation of Electrical Signals in HFR-Free PCB Materials
Recent environmental concerns over the safety of the halogenated flame retardants (HFR) used in commonplace FR4 printed
circuit boards (PCB) have prompted market demand for HFR-free computer sy
.. read more
Next Generation Test Methodologies and Analysis for Physical Layer Structures
Printed circuit board (PCB) material properties and surface roughness directly influence attenuation and NEXT/FEXT crosstalk signal integrity of high speed digital interconnect design. Balancin
.. read more
PCB Board Design Considerations for Impedance Control and Optimal Signal Integrity in High Speed Digital and RF Systems
For the electronics on PCB’s,dielectric materials provide not only material and media support for the high-speed digital and RF systems,but also electrical performance. Impedance control and si
.. read more
3D Interconnection Technologies for Electronic Products: A Perspective View of Electronic Interconnection Technologies from Chip to System
3D is the shorthand term for the three dimensions of Cartesian coordinate space X,Y and Z. With that definition in mind,one will find with little or no stretching of the imagination,that the fi
.. read more
Thermal Effects on PCB Laminate Material Dielectric Constant and Dissipation Factor
Values for printed circuit board (PCB) laminate dielectric constant (Dk) and dissipation factor (Df) used in circuit design and signal integrity (SI) modeling are typically those presented on l
.. read more
Improvements in Microwave Laminates for Power Amplifier Reliability and Efficiency
Demands for higher data rates and capacity have continued to drive RF and Microwave electronics continue toward higher
frequency and higher power requirements. These power and frequency demands
.. read more
A Novel Halogen-Free Material for High Speed PCB
The mobile communication devices such as cell phones require high speed transmission of large volume data as well as reduction in size and weight. When signal is transmitted in high speed and f
.. read more
The Influence of Material Reactivity in Dk/Df Electrical Performance
Over the years,signal integrity performance and bandwidth gets more critical for today’s higher signal transmission speeds and bandwidth demand in every field of applications such as computing,
.. read more
Base Material Consideration for High Speed Printed Circuit Boards
Over the years,the EU RoHS restriction and lead-free capability is the hottest environmental protection subject. In technology trends,signal integrity performance gets more critical based upon
.. read more
Image Rotation to Mitigate the Fiberweave Effect its Impact on PCB Manufacturing
Typical PCB materials have inherent properties (the “Fiberweave Effect”) which can be detrimental to the Signal Integrity of the physical link. This presentation describes the effect and a mean
.. read more
BGA Breakout Challenges
The routing of large pin-count and dense BGAs has a significant impact on the cost of the PCB,primarily in terms of layer count and via technology. This paper is the result of considerable rese
.. read more
3-Dimensional Partitioning of Printed Circuit Design for High Speed Interconnections
When using standard approaches to PCB design and manufacture,there are a number of different elements that can impact
signal integrity at high data rates including: inconsistencies in dielectri
.. read more
Backdrilling Technology for Backpanel
In order to get excellent signal Integrity,half PTH holes will be a new trend in high frequency backpanel designing.
Backdrilling is necessary for this application. This paper explores the appl
.. read more
Electrical Characteristics of High Speed Materials
This paper will discuss the two primary transmission components that concern designers today. These components affect the
signal integrity of all high-speed transmissions in printed circuit boa
.. read more
Advanced Microvia Design
Microvias are the fastest growing new technology for printed circuits. Once you understand the basics,the advanced topics
bring the real advantage to light. This talk will highlight the procedu
.. read more
Signal Integrity Analysis Techniques used to Characterize PCB Substrates
The electrical properties of PCB substrates are one of the primary factors used in designing high-frequency printed circuit
boards. The loss tangent is the electrical property used by material
.. read more
Are Lead-free Assemblies Especially Endangered by Climatic Safety?
The ever-increasing use of high frequency in high density interconnect (HDI) assemblies,combined with the worldwide
move toward lead-free manufacturing,has initiated a closer scrutiny towards e
.. read more
“Built-In-Trace” Resistors
The newly developed Ohmega-Ply “Resistor-Built-in-Trace” technology uses low-ohmic resistive materials for embedded
resistors congruent to the circuitry in a multilayer PCB or HDI substrate. Hi
.. read more
NEMI Update on Optoelectronics Initiatives
National Electronics Manufacturing Initiative (NEMI) initiated six projects in late 2001 and 2002 addressing key
issues identified by the industry. These cover the areas of Fiber Management,Sig
.. read more
HID's Technology Influence on Signal Integrity
Highs Density Interconnects (HDI) printed circuits are now being designed in ever increasing quantities. HDI brings
some interesting new solutions to age-old signal integrity (SI) concerns,and
.. read more
Fabric Weaving and Circuit Orientations Impact for Skew / Signal Integrity
This Presentation discusses Improvements for signal integrity. Signal integrity is based on the copper surface roughness, the oxides on the copper, and the Dielectric constant of the D
.. read more
Nano Structuring Photoresist Adhesion Promoter for Improved Signal Integrity in the Modern HDI-PCB Fabrication
The euphoria associated with the biggest technological step in the field of telecommunications in recent history, the new 5G mobile communications standard, not only made it necessary for OE
.. read more
Adhesion Enhancement System for Next Generation High Speed IC Substrate
Driven by the demand for advanced electronic devices where massive wireless data transfer is required, a new generation of communication system, so called 5G has been developed. This new tec
.. read more
Signal Integrity, Reliability, and Cost Evaluation of PCB Interlayer Crosstalk Reduction
The push for faster data rates and increased signal density in printed circuit boards (PCBs) increases the risk of signal crosstalk on high-speed communication busses which can be highly det
.. read more
Semi-AdditivePCBProcessing: Process, Reliability Testing andApplications
The continued miniaturization of both packaging and component size in next-generation electronics presents a significant challenge for PCB designers and PCB fabricators. To effectively navig
.. read more
Why Signal Always Be Loss in a High Speed Frequency Transmission Line
The high speed transmission applications in the electronic product become inevitable developing trend. The signal integrity becomes the most important issue in the electronic industry. The mate
.. read more
Behavior of Materials in the Manufacturing Environment
This study was conducted to understand seven materials reliability,behavior of Dielectric constant and Dissipation factor over medium to high frequencies. A modified version of HDPUG design was
.. read more
iNEMI HFR-Free Signal Integrity Project: An Investigation to Identify Degradation of Electrical Signals in HFR-Free PCB Materials
Recent environmental concerns over the safety of the halogenated flame retardants (HFR) used in commonplace FR4 printed
circuit boards (PCB) have prompted market demand for HFR-free computer sy
.. read more
Next Generation Test Methodologies and Analysis for Physical Layer Structures
Printed circuit board (PCB) material properties and surface roughness directly influence attenuation and NEXT/FEXT crosstalk signal integrity of high speed digital interconnect design. Balancin
.. read more
PCB Board Design Considerations for Impedance Control and Optimal Signal Integrity in High Speed Digital and RF Systems
For the electronics on PCB’s,dielectric materials provide not only material and media support for the high-speed digital and RF systems,but also electrical performance. Impedance control and si
.. read more
3D Interconnection Technologies for Electronic Products: A Perspective View of Electronic Interconnection Technologies from Chip to System
3D is the shorthand term for the three dimensions of Cartesian coordinate space X,Y and Z. With that definition in mind,one will find with little or no stretching of the imagination,that the fi
.. read more
Thermal Effects on PCB Laminate Material Dielectric Constant and Dissipation Factor
Values for printed circuit board (PCB) laminate dielectric constant (Dk) and dissipation factor (Df) used in circuit design and signal integrity (SI) modeling are typically those presented on l
.. read more
Improvements in Microwave Laminates for Power Amplifier Reliability and Efficiency
Demands for higher data rates and capacity have continued to drive RF and Microwave electronics continue toward higher
frequency and higher power requirements. These power and frequency demands
.. read more
A Novel Halogen-Free Material for High Speed PCB
The mobile communication devices such as cell phones require high speed transmission of large volume data as well as reduction in size and weight. When signal is transmitted in high speed and f
.. read more
The Influence of Material Reactivity in Dk/Df Electrical Performance
Over the years,signal integrity performance and bandwidth gets more critical for today’s higher signal transmission speeds and bandwidth demand in every field of applications such as computing,
.. read more
Base Material Consideration for High Speed Printed Circuit Boards
Over the years,the EU RoHS restriction and lead-free capability is the hottest environmental protection subject. In technology trends,signal integrity performance gets more critical based upon
.. read more
Image Rotation to Mitigate the Fiberweave Effect its Impact on PCB Manufacturing
Typical PCB materials have inherent properties (the “Fiberweave Effect”) which can be detrimental to the Signal Integrity of the physical link. This presentation describes the effect and a mean
.. read more
BGA Breakout Challenges
The routing of large pin-count and dense BGAs has a significant impact on the cost of the PCB,primarily in terms of layer count and via technology. This paper is the result of considerable rese
.. read more
3-Dimensional Partitioning of Printed Circuit Design for High Speed Interconnections
When using standard approaches to PCB design and manufacture,there are a number of different elements that can impact
signal integrity at high data rates including: inconsistencies in dielectri
.. read more
Backdrilling Technology for Backpanel
In order to get excellent signal Integrity,half PTH holes will be a new trend in high frequency backpanel designing.
Backdrilling is necessary for this application. This paper explores the appl
.. read more
Electrical Characteristics of High Speed Materials
This paper will discuss the two primary transmission components that concern designers today. These components affect the
signal integrity of all high-speed transmissions in printed circuit boa
.. read more
Advanced Microvia Design
Microvias are the fastest growing new technology for printed circuits. Once you understand the basics,the advanced topics
bring the real advantage to light. This talk will highlight the procedu
.. read more
Signal Integrity Analysis Techniques used to Characterize PCB Substrates
The electrical properties of PCB substrates are one of the primary factors used in designing high-frequency printed circuit
boards. The loss tangent is the electrical property used by material
.. read more
Are Lead-free Assemblies Especially Endangered by Climatic Safety?
The ever-increasing use of high frequency in high density interconnect (HDI) assemblies,combined with the worldwide
move toward lead-free manufacturing,has initiated a closer scrutiny towards e
.. read more
“Built-In-Trace” Resistors
The newly developed Ohmega-Ply “Resistor-Built-in-Trace” technology uses low-ohmic resistive materials for embedded
resistors congruent to the circuitry in a multilayer PCB or HDI substrate. Hi
.. read more
NEMI Update on Optoelectronics Initiatives
National Electronics Manufacturing Initiative (NEMI) initiated six projects in late 2001 and 2002 addressing key
issues identified by the industry. These cover the areas of Fiber Management,Sig
.. read more
HID's Technology Influence on Signal Integrity
Highs Density Interconnects (HDI) printed circuits are now being designed in ever increasing quantities. HDI brings
some interesting new solutions to age-old signal integrity (SI) concerns,and
.. read more