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Solder Creep-Fatigue Model Parameters for SAC & SnAg Lead-Free Solder Joint Reliability Estimation

For many of the Pb-free solders required under the European RoHS directive,there is now sufficient information,primarily in the form of the results of accelerated thermal cycling of various lev .. read more

Thermal Cycling Reliability Screening of Multiple Pb-free Solder Ball Alloys

Thermal cycling tests were conducted using two different ceramic ball grid array (CBGA) test vehicles having balls comprised of nine different Pb free solder alloys. The experiment was designed .. read more

Solder Creep-Fatigue Model Parameters for SAC & Snag Lead-Free Solder Joint Reliability Estimation

For many of the Pb-free solders required under the European RoHS directive,there is now sufficient information,primarily in the form of the results of accelerated thermal cycling of various lev .. read more

A Study of Reliability between Solder Alloy and Pad Materials

The low Ag solder alloy shows higher drop performance than the high Ag solder alloy in the every kind of package and board combinations. This is related to the ductility of solder and the surfa .. read more

Novel SACX Solders with Drop Test Performance Outperforming Eutectic Tin-Lead

A family of SACX alloys has been developed with significant improvement in drop test performance on NiAu surface finish. Dopants such as Mn,Bi,Ti,Ce,and to a less extent Y for SAC105 have been .. read more

VERIFYING MICROVOID ELIMINATION AND PREVENTION VIA AN OPTIMIZED IMMERSION SILVER PROCESS

The Pb-free transition in the electronics industry has seen immersion silver emerge as a leading circuit board finish for RoHS compliant processes and products. It is utilized in a wide cross-s .. read more

Solder Creep-Fatigue Model Parameters for SAC & SnAg Lead-Free Solder Joint Reliability Estimation

For many of the Pb-free solders required under the European RoHS directive,there is now sufficient information,primarily in the form of the results of accelerated thermal cycling of various lev .. read more

Thermal Cycling Reliability Screening of Multiple Pb-free Solder Ball Alloys

Thermal cycling tests were conducted using two different ceramic ball grid array (CBGA) test vehicles having balls comprised of nine different Pb free solder alloys. The experiment was designed .. read more

Solder Creep-Fatigue Model Parameters for SAC & Snag Lead-Free Solder Joint Reliability Estimation

For many of the Pb-free solders required under the European RoHS directive,there is now sufficient information,primarily in the form of the results of accelerated thermal cycling of various lev .. read more

A Study of Reliability between Solder Alloy and Pad Materials

The low Ag solder alloy shows higher drop performance than the high Ag solder alloy in the every kind of package and board combinations. This is related to the ductility of solder and the surfa .. read more

Novel SACX Solders with Drop Test Performance Outperforming Eutectic Tin-Lead

A family of SACX alloys has been developed with significant improvement in drop test performance on NiAu surface finish. Dopants such as Mn,Bi,Ti,Ce,and to a less extent Y for SAC105 have been .. read more

VERIFYING MICROVOID ELIMINATION AND PREVENTION VIA AN OPTIMIZED IMMERSION SILVER PROCESS

The Pb-free transition in the electronics industry has seen immersion silver emerge as a leading circuit board finish for RoHS compliant processes and products. It is utilized in a wide cross-s .. read more