Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Wettable-Flanks: Enabler for the Use of Bottom-Termination Components in Mass Production of High-Reliability Electronic Control Units
Driven by miniaturization,cost reduction and tighter requirements for electrical and thermal performance,the use of lead-frame based bottom-termination components (LF-BTC) as small-outline no-l
.. read more
Optimizing the Insulated Metal Substrate Application with Proper Material Selection and Circuit Fabrication
The ever expanding growth in the use of insulated metal substrates (IMS) in power electronics requires a focus on material and mechanical configuration for each application. By optimizing the m
.. read more
Advanced Thermal Management Solutions on PCBs for High Power Applications
With increasing power loss of electrical components,thermal performance of an assembled device becomes one of the most important quality factors in electronic packaging. Due to the rapid advanc
.. read more
3-D Packaging: Innovative Solutions for Multiple Die Applications
A vertically configured package technology developed by Tessera is proving to be a practical multi-die solution for any
number of single and multiple functional combinations. The enabling techn
.. read more
Mems Packaging: Challenges and Opportunities
One of the greatest obstacles in commercialization of MEMS is the cost of packaging and assembly. Packaging
needs for MicroSystems and MEMS technology vary by structure and application. Major i
.. read more
Wettable-Flanks: Enabler for the Use of Bottom-Termination Components in Mass Production of High-Reliability Electronic Control Units
Driven by miniaturization,cost reduction and tighter requirements for electrical and thermal performance,the use of lead-frame based bottom-termination components (LF-BTC) as small-outline no-l
.. read more
Optimizing the Insulated Metal Substrate Application with Proper Material Selection and Circuit Fabrication
The ever expanding growth in the use of insulated metal substrates (IMS) in power electronics requires a focus on material and mechanical configuration for each application. By optimizing the m
.. read more
Advanced Thermal Management Solutions on PCBs for High Power Applications
With increasing power loss of electrical components,thermal performance of an assembled device becomes one of the most important quality factors in electronic packaging. Due to the rapid advanc
.. read more
3-D Packaging: Innovative Solutions for Multiple Die Applications
A vertically configured package technology developed by Tessera is proving to be a practical multi-die solution for any
number of single and multiple functional combinations. The enabling techn
.. read more
Mems Packaging: Challenges and Opportunities
One of the greatest obstacles in commercialization of MEMS is the cost of packaging and assembly. Packaging
needs for MicroSystems and MEMS technology vary by structure and application. Major i
.. read more