Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Nanocopper Based Paste for Solid Copper Via Fill
This paper discusses a nano copper based paste for use in via filling. The company manufactures nano copper and disperses the coated nano copper into a paste in combination with micron copper.
.. read more
Assembly Materials for High Temperature Application
Based on the trend for new technology in the automotive market including high power modules for e-mobility,and a combination of logic and power which will be developed for the future market wit
.. read more
Phototonic Curing: Broad Implications in Printed Electronics
•Photonic curing uses high-intensity flash lamps to selectively heat target materials.
•The PulseForge tools are based on the patented use of photonic curing and are designed for use in develop
.. read more
Building HDI Structures using Thin Films and Low Temperature Sintering Paste
Circuit complexity and density requirements continue to push PCB fabrication capability limits. Component pitch and routing requirements are continually becoming more aggressive and difficult t
.. read more
Nano- and Micro-Filled Conducting Adhesives for Z-axis Interconnections
This paper discusses micro-filled epoxy-based conducting adhesives modified with nanoparticles for z-axis interconnections,
especially as it relates to package level fabrication,integration,and
.. read more
High Dielectric Constant Thin-Films for Embedded Passive Components
Pure and doped barium titanate thin films have been prepared by chemical solution deposition on 18 µm thick,industry standard copper foils. Films are approximately 0.6 µm thickness and exhibit
.. read more
Nanocopper Based Paste for Solid Copper Via Fill
This paper discusses a nano copper based paste for use in via filling. The company manufactures nano copper and disperses the coated nano copper into a paste in combination with micron copper.
.. read more
Assembly Materials for High Temperature Application
Based on the trend for new technology in the automotive market including high power modules for e-mobility,and a combination of logic and power which will be developed for the future market wit
.. read more
Phototonic Curing: Broad Implications in Printed Electronics
•Photonic curing uses high-intensity flash lamps to selectively heat target materials.
•The PulseForge tools are based on the patented use of photonic curing and are designed for use in develop
.. read more
Building HDI Structures using Thin Films and Low Temperature Sintering Paste
Circuit complexity and density requirements continue to push PCB fabrication capability limits. Component pitch and routing requirements are continually becoming more aggressive and difficult t
.. read more
Nano- and Micro-Filled Conducting Adhesives for Z-axis Interconnections
This paper discusses micro-filled epoxy-based conducting adhesives modified with nanoparticles for z-axis interconnections,
especially as it relates to package level fabrication,integration,and
.. read more
High Dielectric Constant Thin-Films for Embedded Passive Components
Pure and doped barium titanate thin films have been prepared by chemical solution deposition on 18 µm thick,industry standard copper foils. Films are approximately 0.6 µm thickness and exhibit
.. read more