Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Anti-Slump SiP Solder Paste Enables Further Miniaturization
In this study, a patent-pending new solder paste material has been developed for assembly of System in Package (SiP) with outstanding slump resistance without compromising the paste volume p
.. read more
Device Miniaturization - The Impact of a High Density SoC Direct Chip Attach on Surface Mount and PCB Technologies
To keep up with shrinking system volume requirements for the Internet of Things and wearable devices while maintaining maximum device functionality requires an integrated approach to SoC and Si
.. read more
Development of a Design & Manufacturing Environment for Reliable and Cost- Effective PCB Embedding Technology
The desire to have more functionality into increasingly smaller size end products has been pushing the PCB and IC
Packaging industry towards High Density Interconnect (HDI) and 3D Packaging (st
.. read more
Market Forecast and Applications for 3D Packaging using Package-on-Package (PoP)
- 3D Manufacturing solutions: Flexible integration
- 3D/SiP Cost of Ownership
- Die vs. Package Stack Analysis
- Smartphone
- Package evolution
- Handheld Processor Roadmap
- PoP
- TMV
- Future
.. read more
PCB Assembly System Set-Up for Pop
Traditional SMT assembly is a two dimensional process. Each component is placed on the same horizontal plane in different
X and Y locations. In Package on Package (PoP) assembly,components are
.. read more
Fine Powder Solder Paste Applications for Semiconductor Packaging
Fine solder powder paste applications continue to grow as a cost effective solution to many semiconductor packaging needs. Applications for solder paste continue to evolve from the standard SMT
.. read more
The Evolution of 3D IC Packaging for Portable and Hand Held Electronics
Increased electronic functionality can be achieved through the development of more complex silicon integration but that course generally requires a great deal of capital resources and an excess
.. read more
Stacked Array Packaging A Flex Based IC Packaging Solution for Single and 3D Multiple Die Applications
The challenge manufactures face when competing in the world marketplace is to offer a product that will meet all performance and functionality expectations without increasing product size or co
.. read more
System in Package: Identified Technology Needs from the 2994 iNEMI Roadmap
System in package (SiP) technology has grown significantly in the past several years. It was barely mentioned in the National
Electronics Manufacturing Initiative’s (NEMI’s) 2000 roadmap,but by
.. read more
Japan’s JISSO Technology Roadmaps
Japan has a long history of publishing very important technology roadmaps. Some of the Japanese roadmaps published in the
past are:
JPCA Roadmaps
Report on the Technology Roadmap for Advanced S
.. read more
Flip Chip Processing Solutions as used in System in Package Applications
Dramatic changes are underway in the computer,telecommunication,automotive,and consumer electronics
industries. Changes that demand common and pervasive requirements for active assemblies such
.. read more
Anti-Slump SiP Solder Paste Enables Further Miniaturization
In this study, a patent-pending new solder paste material has been developed for assembly of System in Package (SiP) with outstanding slump resistance without compromising the paste volume p
.. read more
Device Miniaturization - The Impact of a High Density SoC Direct Chip Attach on Surface Mount and PCB Technologies
To keep up with shrinking system volume requirements for the Internet of Things and wearable devices while maintaining maximum device functionality requires an integrated approach to SoC and Si
.. read more
Development of a Design & Manufacturing Environment for Reliable and Cost- Effective PCB Embedding Technology
The desire to have more functionality into increasingly smaller size end products has been pushing the PCB and IC
Packaging industry towards High Density Interconnect (HDI) and 3D Packaging (st
.. read more
Market Forecast and Applications for 3D Packaging using Package-on-Package (PoP)
- 3D Manufacturing solutions: Flexible integration
- 3D/SiP Cost of Ownership
- Die vs. Package Stack Analysis
- Smartphone
- Package evolution
- Handheld Processor Roadmap
- PoP
- TMV
- Future
.. read more
PCB Assembly System Set-Up for Pop
Traditional SMT assembly is a two dimensional process. Each component is placed on the same horizontal plane in different
X and Y locations. In Package on Package (PoP) assembly,components are
.. read more
Fine Powder Solder Paste Applications for Semiconductor Packaging
Fine solder powder paste applications continue to grow as a cost effective solution to many semiconductor packaging needs. Applications for solder paste continue to evolve from the standard SMT
.. read more
The Evolution of 3D IC Packaging for Portable and Hand Held Electronics
Increased electronic functionality can be achieved through the development of more complex silicon integration but that course generally requires a great deal of capital resources and an excess
.. read more
Stacked Array Packaging A Flex Based IC Packaging Solution for Single and 3D Multiple Die Applications
The challenge manufactures face when competing in the world marketplace is to offer a product that will meet all performance and functionality expectations without increasing product size or co
.. read more
System in Package: Identified Technology Needs from the 2994 iNEMI Roadmap
System in package (SiP) technology has grown significantly in the past several years. It was barely mentioned in the National
Electronics Manufacturing Initiative’s (NEMI’s) 2000 roadmap,but by
.. read more
Japan’s JISSO Technology Roadmaps
Japan has a long history of publishing very important technology roadmaps. Some of the Japanese roadmaps published in the
past are:
JPCA Roadmaps
Report on the Technology Roadmap for Advanced S
.. read more
Flip Chip Processing Solutions as used in System in Package Applications
Dramatic changes are underway in the computer,telecommunication,automotive,and consumer electronics
industries. Changes that demand common and pervasive requirements for active assemblies such
.. read more