Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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A Critical Evaluation of ROSE Testing as Compared to SIR for Monitoring PCB Cleanliness
Resistance of Solvent Extract (ROSE) testing has been grandfathered not only into the modern IPC standards without validation on modern materials, but it has also become grandfathered into t
.. read more
Can a PCBA with a Modern No-Clean Solder Paste Flux Residue Offer Electrical Reliability Comparable to a Cleaned PCBA?
Certain high-reliability pockets of the electronics industry, such as telecommunications, defense, aerospace, and medical, often put great weight on the cleanliness of the finished PCBA. The
.. read more
SIR Intercomparison to Validate the use of a Fine Pitch Pattern
It is well known that structures at fine pitches with flux residues are more susceptible to corrosion issues and electrochemical migration (ECM) problems. Characterization of flux residues in t
.. read more
A Critical Evaluation of ROSE Testing as Compared to SIR for Monitoring PCB Cleanliness
Resistance of Solvent Extract (ROSE) testing has been grandfathered not only into the modern IPC standards without validation on modern materials, but it has also become grandfathered into t
.. read more
Can a PCBA with a Modern No-Clean Solder Paste Flux Residue Offer Electrical Reliability Comparable to a Cleaned PCBA?
Certain high-reliability pockets of the electronics industry, such as telecommunications, defense, aerospace, and medical, often put great weight on the cleanliness of the finished PCBA. The
.. read more
SIR Intercomparison to Validate the use of a Fine Pitch Pattern
It is well known that structures at fine pitches with flux residues are more susceptible to corrosion issues and electrochemical migration (ECM) problems. Characterization of flux residues in t
.. read more