Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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A New Approach to Conformal Coating Demonstrates Significantly Improved Ruggedization Performance
IPC-TR-587 technical report, ‘Conformal Coating Material and Application ‘‘State of the Industry’’ Assessment’ [1] outlines an IPC study of major conformal coating types, coating application
.. read more
An Efficient and Innovative Cleaning Solution with Low Environmental Impact
Contamination of electronic assemblies can occur at any process steps and can be of different natures such as oxides, organic residues, or dusts. Those contaminations could reduce the reliab
.. read more
Investigation of the Electrochemical Reliability of Conformal Coatings Under High Voltage
The surface insulation resistance (SIR) of conformal coatings was investigated using increased stress by high voltage bias up to 1000V. Test boards had been prepared according to IPC-9202, u
.. read more
3D Printing of Plastic Structures onto PCBs for Circuit Protection Strategies
This paper describes the novel use of Fused Filament Fabrication (FFF) 3D-printing technology to create plastic, positioning and retaining structures directly onto the surface of standard FR
.. read more
Outgassing Behaviour of SMT Flux Residue During Reflow Soldering
SMT-flux residues are feared to be a potential risk factor for quality issues in electronic assembly and interconnect technology. This work shows how the amount of no clean flux residues can
.. read more
Methodology for Developing Cleaning Process Parameters
Electronic assembly processes range from simple to complex and involve a wide range of materials to produce. Each step in the process and each assembly material used will have some impact on
.. read more
IPC-J-STD-001 Rev G, Amendment 1, Section 8 Cleanliness SectionSIR Test Method for Developing Objective Evidence for the Production Assembly
Since the 1970s, ROSE testing was used to determine “clean enough.” In 2015, the J-STD-001 committee assigned a team to develop the next generation of “cleanliness” requirements. Section 8 d
.. read more
Conformal Coatings: State of the Industry Versus State of the Art
The excellent IPC-TR-587 technical report, ‘Conformal Coating Material and Application ‘‘State of the Industry’’ Assessment’ delivers the results of a recent major study on conformal coating
.. read more
Surface Treatment for Soldering Aluminum PCBs to Conventional Copper PCBs
Use of low-cost Aluminum based flexible printed circuit boards or Al-PCBs has been growing in popularity. Integrating them with conventional Copper based PCBs or Cu-PCBs is essential for the
.. read more
Comprehensive SIR Testing for Platform Release in the Automotive Industry
A comprehensive SIR test-protocol for the release of materials and processes in the automotive industry is presented. In this way, by a combination of comprehensive SIR testing and intensive
.. read more
Process Characterization that Results in Acceptable Levels of Flux and Other Residues
Surface Insulation Resistance (SIR) testing is a standard method used to characterize soldering and cleaning processes that result in acceptable levels of flux and other residues. Several di
.. read more
Can a PCBA with a Modern No-Clean Solder Paste Flux Residue Offer Electrical Reliability Comparable to a Cleaned PCBA?
Certain high-reliability pockets of the electronics industry, such as telecommunications, defense, aerospace, and medical, often put great weight on the cleanliness of the finished PCBA. The
.. read more
Qualified Manufacturing Process Development by Applying IPC J-STD-001G Cleanliness Standard
J-STD-001G Amendment 1 standard requires an OEM and EMS to qualify soldering and/or cleaning processes that result in acceptable levels of flux and other residues. Objective evidence shall b
.. read more
SIR Test Vehicles - Comparison from a Cleaning Perspective
PCB design has evolved greatly in recent years becoming ever more complex. Board density is increasing,component standoff heights are decreasing and long term reliability requirements are great
.. read more
Conformal Coating over No Clean Flux
As the proliferation of modern day electronics continues to drive miniaturization and functionality,electronic designers/assemblers face the issue of environmental exposure and uncommon applica
.. read more
The Effects of Human-Induced Contamination on PCB Assembly Electrical Reliability
With the ever-present pressure toward miniaturization in electronic devices,smaller distances between traces and component terminations are likely to increase the devices’ sensitivity to contam
.. read more
An Evaluation of the Insulation Resistance and Surface Contamination of Printed Circuit Board Assemblies
The overall effectiveness of 20 circuit board assembly processes,made up of 4 solder/flux combinations and 6 cleaning processes was investigated by using in-situ surface insulation resistance m
.. read more
Effect of Silicone Conformal Coating on Surface Insulation Resistance (SIR) For Printed Circuit Board Assemblies.
Conformal coatings are considered a method of providing corrosion protection to electrical assemblies used in high-humidity or harsh environments. They are applied to PCBs for various reasons:
.. read more
Cleanliness Comparison – C3 Localized Versus Total Board Extractions
In this evaluation we will show an ionic residue comparison using Umpire 2 boards that were top and bottom surface mounted with standard reflow and selective wave soldered on the connector and
.. read more
The Digital Solder Paste
Since the beginning of Surface Mount Technology over 40 years ago solder paste has been an integral element in electronics assembly. Historically solder paste design and development has been,in
.. read more
Cleaning a No-Clean Flux on Contaminated Hardware as a Recovery Plan
There is a growing problem in the industry with no-clean flux technology and the after effects it can have on reliability. If the
fluxes are not fully complexed (not fully heat activated) there
.. read more
Soldering Fluxes and the Repair Process
Wave soldering fluxes are currently used in hand soldering operations as a matter of course and with little
regard for flux deposition amounts. This use has led to the investigation of fluxes u
.. read more
Does the Presence of Components Make a Difference? A New SIR Test Protocol to Characterize a Lead-Free,Electronic Production Process
Surface Insulation Resistance (SIR) Testing,has been used traditionally to characterise process materials,
particularly solder fluxes. Existing Surface Insulation resistance (SIR) test methods
.. read more
A New Approach to Conformal Coating Demonstrates Significantly Improved Ruggedization Performance
IPC-TR-587 technical report, ‘Conformal Coating Material and Application ‘‘State of the Industry’’ Assessment’ [1] outlines an IPC study of major conformal coating types, coating application
.. read more
An Efficient and Innovative Cleaning Solution with Low Environmental Impact
Contamination of electronic assemblies can occur at any process steps and can be of different natures such as oxides, organic residues, or dusts. Those contaminations could reduce the reliab
.. read more
Investigation of the Electrochemical Reliability of Conformal Coatings Under High Voltage
The surface insulation resistance (SIR) of conformal coatings was investigated using increased stress by high voltage bias up to 1000V. Test boards had been prepared according to IPC-9202, u
.. read more
3D Printing of Plastic Structures onto PCBs for Circuit Protection Strategies
This paper describes the novel use of Fused Filament Fabrication (FFF) 3D-printing technology to create plastic, positioning and retaining structures directly onto the surface of standard FR
.. read more
Outgassing Behaviour of SMT Flux Residue During Reflow Soldering
SMT-flux residues are feared to be a potential risk factor for quality issues in electronic assembly and interconnect technology. This work shows how the amount of no clean flux residues can
.. read more
Methodology for Developing Cleaning Process Parameters
Electronic assembly processes range from simple to complex and involve a wide range of materials to produce. Each step in the process and each assembly material used will have some impact on
.. read more
IPC-J-STD-001 Rev G, Amendment 1, Section 8 Cleanliness SectionSIR Test Method for Developing Objective Evidence for the Production Assembly
Since the 1970s, ROSE testing was used to determine “clean enough.” In 2015, the J-STD-001 committee assigned a team to develop the next generation of “cleanliness” requirements. Section 8 d
.. read more
Conformal Coatings: State of the Industry Versus State of the Art
The excellent IPC-TR-587 technical report, ‘Conformal Coating Material and Application ‘‘State of the Industry’’ Assessment’ delivers the results of a recent major study on conformal coating
.. read more
Surface Treatment for Soldering Aluminum PCBs to Conventional Copper PCBs
Use of low-cost Aluminum based flexible printed circuit boards or Al-PCBs has been growing in popularity. Integrating them with conventional Copper based PCBs or Cu-PCBs is essential for the
.. read more
Comprehensive SIR Testing for Platform Release in the Automotive Industry
A comprehensive SIR test-protocol for the release of materials and processes in the automotive industry is presented. In this way, by a combination of comprehensive SIR testing and intensive
.. read more
Process Characterization that Results in Acceptable Levels of Flux and Other Residues
Surface Insulation Resistance (SIR) testing is a standard method used to characterize soldering and cleaning processes that result in acceptable levels of flux and other residues. Several di
.. read more
Can a PCBA with a Modern No-Clean Solder Paste Flux Residue Offer Electrical Reliability Comparable to a Cleaned PCBA?
Certain high-reliability pockets of the electronics industry, such as telecommunications, defense, aerospace, and medical, often put great weight on the cleanliness of the finished PCBA. The
.. read more
Qualified Manufacturing Process Development by Applying IPC J-STD-001G Cleanliness Standard
J-STD-001G Amendment 1 standard requires an OEM and EMS to qualify soldering and/or cleaning processes that result in acceptable levels of flux and other residues. Objective evidence shall b
.. read more
SIR Test Vehicles - Comparison from a Cleaning Perspective
PCB design has evolved greatly in recent years becoming ever more complex. Board density is increasing,component standoff heights are decreasing and long term reliability requirements are great
.. read more
Conformal Coating over No Clean Flux
As the proliferation of modern day electronics continues to drive miniaturization and functionality,electronic designers/assemblers face the issue of environmental exposure and uncommon applica
.. read more
The Effects of Human-Induced Contamination on PCB Assembly Electrical Reliability
With the ever-present pressure toward miniaturization in electronic devices,smaller distances between traces and component terminations are likely to increase the devices’ sensitivity to contam
.. read more
An Evaluation of the Insulation Resistance and Surface Contamination of Printed Circuit Board Assemblies
The overall effectiveness of 20 circuit board assembly processes,made up of 4 solder/flux combinations and 6 cleaning processes was investigated by using in-situ surface insulation resistance m
.. read more
Effect of Silicone Conformal Coating on Surface Insulation Resistance (SIR) For Printed Circuit Board Assemblies.
Conformal coatings are considered a method of providing corrosion protection to electrical assemblies used in high-humidity or harsh environments. They are applied to PCBs for various reasons:
.. read more
Cleanliness Comparison – C3 Localized Versus Total Board Extractions
In this evaluation we will show an ionic residue comparison using Umpire 2 boards that were top and bottom surface mounted with standard reflow and selective wave soldered on the connector and
.. read more
The Digital Solder Paste
Since the beginning of Surface Mount Technology over 40 years ago solder paste has been an integral element in electronics assembly. Historically solder paste design and development has been,in
.. read more
Cleaning a No-Clean Flux on Contaminated Hardware as a Recovery Plan
There is a growing problem in the industry with no-clean flux technology and the after effects it can have on reliability. If the
fluxes are not fully complexed (not fully heat activated) there
.. read more
Soldering Fluxes and the Repair Process
Wave soldering fluxes are currently used in hand soldering operations as a matter of course and with little
regard for flux deposition amounts. This use has led to the investigation of fluxes u
.. read more
Does the Presence of Components Make a Difference? A New SIR Test Protocol to Characterize a Lead-Free,Electronic Production Process
Surface Insulation Resistance (SIR) Testing,has been used traditionally to characterise process materials,
particularly solder fluxes. Existing Surface Insulation resistance (SIR) test methods
.. read more