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Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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High Frequency Due to Copper Topology Phase 2 Project –Final Report High Density Packaging User Group (HDP)
The High Density Packaging (HDP) User Group has completed a project based upon an earlier project evaluating the different types of high frequency test methods used in the industry for measu
.. read more
Insertion Loss Performance Differences Due to Plated Finish and Different Circuit Structures
Many different final plated finishes are used in the PCB industry, each with its own influence on insertion loss. The impact of an applied finish on insertion loss is generally dependent upo
.. read more
Adhesion Enhancement System for Next Generation High Speed IC Substrate
Driven by the demand for advanced electronic devices where massive wireless data transfer is required, a new generation of communication system, so called 5G has been developed. This new tec
.. read more
Copper Foil Elements Affecting Transmission Loss with High Speed Circuits
Large data transmission continues to increase at the rate of 20% worldwide annually due to live video streaming, cloud storage, PDA usage, IOT, and other technologies. Elect
.. read more
Oxide Alternative Process Development for High Frequency Bonding Applications
The demand for smaller, faster and smarter electronic devices that can communicate to each other via wireless networks is stretching current communication systems to their limits. This rapid
.. read more
Signal Transmission Loss due to Copper Surface Roughness in
Higher-speed signal transmission is increasingly required on a printed circuit board to handle massive data in electronic systems. So,signal transmission loss of copper wiring on a printed circ
.. read more
Comparative Analysis of Solder Joint Degradation Using RF Impedance and Event Detectors
Under cycling loading conditions,solder joints are susceptible to fatigue cracking,which often initiates at the surface where the strain range is maximized. Event detectors have been widely use
.. read more
Base Material Consideration for High Speed Printed Circuit Boards
Over the years,the EU RoHS restriction and lead-free capability is the hottest environmental protection subject. In technology trends,signal integrity performance gets more critical based upon
.. read more
Base Material Consideration for High Speed Printed Circuit Boards
Over the years,the EU RoHS restriction and lead-free capability is the hottest environmental protection subject. In technology trends,signal integrity performance gets more critical based upon
.. read more
Effects of Adhesion Promotion Treatment On Electrical Signal Attenuation
Oxide alternatives,as well as traditional and reduced oxide chemistries,are coatings or “adhesion promoters” used to enhance the bond between imaged and etched inner layer copper surfaces and t
.. read more
Non-Classical Conductor Losses due to Copper Foil Roughness and Treatment
In high speed digital interconnects; signal attenuation is a result of both dielectric losses and conductor losses. Previous
works have showed in detail,the characterization and modeling effort
.. read more
Copper Foil Technology for High-Frequency Applications
Advances in information/communications technology are transforming the Internet from a medium for searching for information into a medium for providing and receiving various types of informatio
.. read more
High Frequency Due to Copper Topology Phase 2 Project –Final Report High Density Packaging User Group (HDP)
The High Density Packaging (HDP) User Group has completed a project based upon an earlier project evaluating the different types of high frequency test methods used in the industry for measu
.. read more
Insertion Loss Performance Differences Due to Plated Finish and Different Circuit Structures
Many different final plated finishes are used in the PCB industry, each with its own influence on insertion loss. The impact of an applied finish on insertion loss is generally dependent upo
.. read more
Adhesion Enhancement System for Next Generation High Speed IC Substrate
Driven by the demand for advanced electronic devices where massive wireless data transfer is required, a new generation of communication system, so called 5G has been developed. This new tec
.. read more
Copper Foil Elements Affecting Transmission Loss with High Speed Circuits
Large data transmission continues to increase at the rate of 20% worldwide annually due to live video streaming, cloud storage, PDA usage, IOT, and other technologies. Elect
.. read more
Oxide Alternative Process Development for High Frequency Bonding Applications
The demand for smaller, faster and smarter electronic devices that can communicate to each other via wireless networks is stretching current communication systems to their limits. This rapid
.. read more
Signal Transmission Loss due to Copper Surface Roughness in
Higher-speed signal transmission is increasingly required on a printed circuit board to handle massive data in electronic systems. So,signal transmission loss of copper wiring on a printed circ
.. read more
Comparative Analysis of Solder Joint Degradation Using RF Impedance and Event Detectors
Under cycling loading conditions,solder joints are susceptible to fatigue cracking,which often initiates at the surface where the strain range is maximized. Event detectors have been widely use
.. read more
Base Material Consideration for High Speed Printed Circuit Boards
Over the years,the EU RoHS restriction and lead-free capability is the hottest environmental protection subject. In technology trends,signal integrity performance gets more critical based upon
.. read more
Base Material Consideration for High Speed Printed Circuit Boards
Over the years,the EU RoHS restriction and lead-free capability is the hottest environmental protection subject. In technology trends,signal integrity performance gets more critical based upon
.. read more
Effects of Adhesion Promotion Treatment On Electrical Signal Attenuation
Oxide alternatives,as well as traditional and reduced oxide chemistries,are coatings or “adhesion promoters” used to enhance the bond between imaged and etched inner layer copper surfaces and t
.. read more
Non-Classical Conductor Losses due to Copper Foil Roughness and Treatment
In high speed digital interconnects; signal attenuation is a result of both dielectric losses and conductor losses. Previous
works have showed in detail,the characterization and modeling effort
.. read more
Copper Foil Technology for High-Frequency Applications
Advances in information/communications technology are transforming the Internet from a medium for searching for information into a medium for providing and receiving various types of informatio
.. read more