Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Selectively Assembling High Value Components Based on Warpage in Order to Improve Reliability
Increasingly larger surface mount components are being developed in today’s SMT industry. With increasing footprints, maintaining acceptable warpage levels through reflow and/or real-world u
.. read more
Study on Solder Joint Reliability of Fine Pitch CSP
Nowadays,consumer electronic product is characterized with miniature,portable,light and high performance,especially for 3G mobile products. More and more fine pitch CSPs (0.4mm) come forth as t
.. read more
Mechanical Reliability – A New Method to Forecast Drop Shock Performance
In light of the recent technological trends within PCB manufacturing industry,there is an increasing degree of interest in understanding the influence factors of mechanical stress on the durabi
.. read more
Improving Yields and Quality: Two Case Studies: Graping and the Head-on-Pillow defect
HoP Mitigation is addressed with respect to solder paste,components,inspection,process and the environment.
Graping minimization recommendations are given with data driven suggestions.
.. read more
Printing and Assembly Challenges for QFN Devices
Although QFN devices present a challenge to the SMT assembly process with proper stencil design,proper stencil technology selection (Laser,Electroform,Nano-Coat),and proper PCB solder mask layo
.. read more
Printing and Assembly Challenges for QFN Devices
QFN’s offer advantages in reducing size and weight and have excellent thermal and electrical Conductivity related to the ground plane. QFN’s also present printing and assembly challenges includ
.. read more
The Surface Finish Effect on the Creep Corrosion in PCB
Creep corrosion normally happens in the end system,PCB,connectors and components are widely noted due to the exposure of
high sulfur environments under elevated humidity. In this study,the majo
.. read more
Investigation of Pad Cratering in Large Flip-Chip BGA using Acoustic Emission
Electronics assemblies with large flip-chip BGA packages can be prone to either pad cratering or brittle intermetallic (IMC)
failures under excessive PCB bending. Pad cratering cracks are not d
.. read more
Assembly Challenges of Bottom Terminated Components
Bottom terminated component (BTC) assembly has rapidly increased in recent years. This type of package is attractive due to its low cost and good functional performance (improved signal speeds
.. read more
Thermal Pad Design at QFN Assembly for Voiding Control
Quad Flat No Leads (QFN) package designs receive more and more attention in electronic industry recently. This package offers a number of benefits including (1) small size,such as a near die si
.. read more
Pad Design and Process for Voiding Control at QFN Assembly
Quad Flat No Leads (QFN) package designs receive more and more attention in electronic industry recently. This package offers a number of benefits including (1) small size,such as a near die si
.. read more
PCB Design Principles for QFN and Other Bottom Termination Components
Although many of the QFN and bottom termination products are small in outline and utilize a plastic encapsulated copper
lead-frame structure they do not resemble the more traditional small outl
.. read more
DFM Rules for Smartphones: An Analysis of Yield on Extremely Dense Assemblies
Handheld portable products such as smartphones are trending toward smaller form factors while simultaneously increasing in functionality to keep up with consumer demands. This is achieved in pa
.. read more
Embedded Components: A Comparative Analysis of Reliability
In light of new process and product technologies in the field of embedded components,questions arise with respect to
advantages and potential disadvantages to standard SMT component placement w
.. read more
Nano Technology Improve Critical Printing Process
The challenges of successful solder printing in the High Volume / Low Mix cell phone environment,which is linked with the continuing trend to miniaturize electronic assemblies,requires a new ap
.. read more
Pad Cratering Evaluation of PCB
Pad cratering in the PCB is a new failure mode encountered in electronic assemblies,particularly in lead-free products. The
failure mechanisms and root causes are not yet fully understood,and l
.. read more
Creep Corrosion of PWB Final Finishes: Its Cause and Prevention
As the electronic industry moves to lead-free assembly and finer-pitch circuits,widely used printed wiring board (PWB) finish,SnPb HASL,has been replaced with lead-free and coplanar PWB finishe
.. read more
Establishing a Precision Stencil Printing Process for Miniaturized Electronics Assembly
The advent of miniaturized electronics for mobile phones and other portable devices has required the assembly of smaller and smaller components. Currently 01005 passives and 0.3 mm CSPs are som
.. read more
Fine Powder Solder Paste Applications for Semiconductor Packaging
Fine solder powder paste applications continue to grow as a cost effective solution to many semiconductor packaging needs. Applications for solder paste continue to evolve from the standard SMT
.. read more
01005 Assembly Process – From the Board Design to the Reflow Process
The trend towards ever smaller components and more function density continues unabated in the SMT field. Manufacturers and users must increasingly coordinate their activities to develop usable
.. read more
Board Level Interconnect Reliability Assessment of High I/O BGA Packages
To meet the complex design requirements of the electronics industry,there is an increased need for large size high
I/O BGA packages. The size of these large BGA packages (up to 50 mm2 and 1157+
.. read more
Selectively Assembling High Value Components Based on Warpage in Order to Improve Reliability
Increasingly larger surface mount components are being developed in today’s SMT industry. With increasing footprints, maintaining acceptable warpage levels through reflow and/or real-world u
.. read more
Study on Solder Joint Reliability of Fine Pitch CSP
Nowadays,consumer electronic product is characterized with miniature,portable,light and high performance,especially for 3G mobile products. More and more fine pitch CSPs (0.4mm) come forth as t
.. read more
Mechanical Reliability – A New Method to Forecast Drop Shock Performance
In light of the recent technological trends within PCB manufacturing industry,there is an increasing degree of interest in understanding the influence factors of mechanical stress on the durabi
.. read more
Improving Yields and Quality: Two Case Studies: Graping and the Head-on-Pillow defect
HoP Mitigation is addressed with respect to solder paste,components,inspection,process and the environment.
Graping minimization recommendations are given with data driven suggestions.
.. read more
Printing and Assembly Challenges for QFN Devices
Although QFN devices present a challenge to the SMT assembly process with proper stencil design,proper stencil technology selection (Laser,Electroform,Nano-Coat),and proper PCB solder mask layo
.. read more
Printing and Assembly Challenges for QFN Devices
QFN’s offer advantages in reducing size and weight and have excellent thermal and electrical Conductivity related to the ground plane. QFN’s also present printing and assembly challenges includ
.. read more
The Surface Finish Effect on the Creep Corrosion in PCB
Creep corrosion normally happens in the end system,PCB,connectors and components are widely noted due to the exposure of
high sulfur environments under elevated humidity. In this study,the majo
.. read more
Investigation of Pad Cratering in Large Flip-Chip BGA using Acoustic Emission
Electronics assemblies with large flip-chip BGA packages can be prone to either pad cratering or brittle intermetallic (IMC)
failures under excessive PCB bending. Pad cratering cracks are not d
.. read more
Assembly Challenges of Bottom Terminated Components
Bottom terminated component (BTC) assembly has rapidly increased in recent years. This type of package is attractive due to its low cost and good functional performance (improved signal speeds
.. read more
Thermal Pad Design at QFN Assembly for Voiding Control
Quad Flat No Leads (QFN) package designs receive more and more attention in electronic industry recently. This package offers a number of benefits including (1) small size,such as a near die si
.. read more
Pad Design and Process for Voiding Control at QFN Assembly
Quad Flat No Leads (QFN) package designs receive more and more attention in electronic industry recently. This package offers a number of benefits including (1) small size,such as a near die si
.. read more
PCB Design Principles for QFN and Other Bottom Termination Components
Although many of the QFN and bottom termination products are small in outline and utilize a plastic encapsulated copper
lead-frame structure they do not resemble the more traditional small outl
.. read more
DFM Rules for Smartphones: An Analysis of Yield on Extremely Dense Assemblies
Handheld portable products such as smartphones are trending toward smaller form factors while simultaneously increasing in functionality to keep up with consumer demands. This is achieved in pa
.. read more
Embedded Components: A Comparative Analysis of Reliability
In light of new process and product technologies in the field of embedded components,questions arise with respect to
advantages and potential disadvantages to standard SMT component placement w
.. read more
Nano Technology Improve Critical Printing Process
The challenges of successful solder printing in the High Volume / Low Mix cell phone environment,which is linked with the continuing trend to miniaturize electronic assemblies,requires a new ap
.. read more
Pad Cratering Evaluation of PCB
Pad cratering in the PCB is a new failure mode encountered in electronic assemblies,particularly in lead-free products. The
failure mechanisms and root causes are not yet fully understood,and l
.. read more
Creep Corrosion of PWB Final Finishes: Its Cause and Prevention
As the electronic industry moves to lead-free assembly and finer-pitch circuits,widely used printed wiring board (PWB) finish,SnPb HASL,has been replaced with lead-free and coplanar PWB finishe
.. read more
Establishing a Precision Stencil Printing Process for Miniaturized Electronics Assembly
The advent of miniaturized electronics for mobile phones and other portable devices has required the assembly of smaller and smaller components. Currently 01005 passives and 0.3 mm CSPs are som
.. read more
Fine Powder Solder Paste Applications for Semiconductor Packaging
Fine solder powder paste applications continue to grow as a cost effective solution to many semiconductor packaging needs. Applications for solder paste continue to evolve from the standard SMT
.. read more
01005 Assembly Process – From the Board Design to the Reflow Process
The trend towards ever smaller components and more function density continues unabated in the SMT field. Manufacturers and users must increasingly coordinate their activities to develop usable
.. read more
Board Level Interconnect Reliability Assessment of High I/O BGA Packages
To meet the complex design requirements of the electronics industry,there is an increased need for large size high
I/O BGA packages. The size of these large BGA packages (up to 50 mm2 and 1157+
.. read more