Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Performance Improvement Through Lean Best Practices
On March 13, 2024, this webinar explored the critical role of solder paste printing in surface mount technology (SMT). The session covered key process factors, common defects, and best pract
.. read more
CCA SMT Cleaning Processes and Solder-flux Effects For Mil/Aero Applications
Held on April 18, 2023, this webinar explored how surface mount component and package design can impact the effectiveness of cleaning circuit card assemblies (CCAs), especially for Mil/Aero
.. read more
CPH – The Hidden Loss
The surface mount technology (SMT) process is well known and mostly measured in terms of efficiency, cycle time (CT) and first time quality (FTQ). Once the Customer’s needs are fulfilled (de
.. read more
Synchronizing the Stencil Printing Process for Successful Central Database Recipe Control
This paper will focus on the requirements needed to implement a central database for printer recipes and minimize setup time required to begin production. The SMT process works best the more
.. read more
Line Controller as Collaborative Agent to Orchestrate Processes and Taking Automation to the Next Level
SMT and electronics manufacturing industry experts are unanimously moving forward to have line controlling and automation in their digital transformation journey. Typical A typical SMT line
.. read more
Soft and Pliable Circuit Boards Made with a Novel Thermoset Polymer
The ongoing COVID-19 pandemic has highlighted the importance of remote healthcare for the well-being of society. On-body devices designed to detect vital signals, dispense medications, and p
.. read more
Component Packaging Technologies And Printed Board Design Driven SMT Assembly Yields Issues
This slide show discusses the different categories of SMT components including, BTCs, dual and quad leaded packages, and passives. The component use cases and typical challenges are ex
.. read more
New Requirements for Sir- Measurement
During the last period of newly assembled electrical devices (pcbs),new component types like LGA and QFN were also qualified as well as smaller passive components with reliability requirements
.. read more
The Effect of Reflow Profiling on the Electrical Reliability of No-Clean Solder Paste Flux Residues
An estimated 80% of all SMT assembly in the world is performed with a no-clean soldering process,largely due to the
predominance of consumer-type electronics. The continuing trend of increasing
.. read more
Assembly Challenges of Bottom Terminated Components
Bottom terminated component (BTC) assembly has rapidly increased in recent years. This type of package is attractive due to its low cost and good functional performance (improved signal speeds
.. read more
Lead Free Process Development with Thick Multilayer PCBA Density in Server Applications
Although the EU RoHS legislation restricts the use of lead in electronics equipment,many high-end multi layer server printed circuit board assemblies (PCBAs) continue to be built with lead unde
.. read more
Understanding the Requirements of a Mass-Imaging Platform with Reference to the Impact of Interconnect Miniaturisation
As the frontiers of feature size and interspace between devices become ever challenging,we as an industry have to start revaluating the performance of the toolsets that are used in the SMT aren
.. read more
Investigation of the Effectiveness of Automated X-ray Inspection Systems in a High Volume – Low Mix SMT Line
The advent of miniature surface mount components coupled with increasing lead counts has posed tremendous
challenges during assembly. This is especially true in an Electronics Manufacturing Ser
.. read more
Performance Improvement Through Lean Best Practices
On March 13, 2024, this webinar explored the critical role of solder paste printing in surface mount technology (SMT). The session covered key process factors, common defects, and best pract
.. read more
CCA SMT Cleaning Processes and Solder-flux Effects For Mil/Aero Applications
Held on April 18, 2023, this webinar explored how surface mount component and package design can impact the effectiveness of cleaning circuit card assemblies (CCAs), especially for Mil/Aero
.. read more
CPH – The Hidden Loss
The surface mount technology (SMT) process is well known and mostly measured in terms of efficiency, cycle time (CT) and first time quality (FTQ). Once the Customer’s needs are fulfilled (de
.. read more
Synchronizing the Stencil Printing Process for Successful Central Database Recipe Control
This paper will focus on the requirements needed to implement a central database for printer recipes and minimize setup time required to begin production. The SMT process works best the more
.. read more
Line Controller as Collaborative Agent to Orchestrate Processes and Taking Automation to the Next Level
SMT and electronics manufacturing industry experts are unanimously moving forward to have line controlling and automation in their digital transformation journey. Typical A typical SMT line
.. read more
Soft and Pliable Circuit Boards Made with a Novel Thermoset Polymer
The ongoing COVID-19 pandemic has highlighted the importance of remote healthcare for the well-being of society. On-body devices designed to detect vital signals, dispense medications, and p
.. read more
Component Packaging Technologies And Printed Board Design Driven SMT Assembly Yields Issues
This slide show discusses the different categories of SMT components including, BTCs, dual and quad leaded packages, and passives. The component use cases and typical challenges are ex
.. read more
New Requirements for Sir- Measurement
During the last period of newly assembled electrical devices (pcbs),new component types like LGA and QFN were also qualified as well as smaller passive components with reliability requirements
.. read more
The Effect of Reflow Profiling on the Electrical Reliability of No-Clean Solder Paste Flux Residues
An estimated 80% of all SMT assembly in the world is performed with a no-clean soldering process,largely due to the
predominance of consumer-type electronics. The continuing trend of increasing
.. read more
Assembly Challenges of Bottom Terminated Components
Bottom terminated component (BTC) assembly has rapidly increased in recent years. This type of package is attractive due to its low cost and good functional performance (improved signal speeds
.. read more
Lead Free Process Development with Thick Multilayer PCBA Density in Server Applications
Although the EU RoHS legislation restricts the use of lead in electronics equipment,many high-end multi layer server printed circuit board assemblies (PCBAs) continue to be built with lead unde
.. read more
Understanding the Requirements of a Mass-Imaging Platform with Reference to the Impact of Interconnect Miniaturisation
As the frontiers of feature size and interspace between devices become ever challenging,we as an industry have to start revaluating the performance of the toolsets that are used in the SMT aren
.. read more
Investigation of the Effectiveness of Automated X-ray Inspection Systems in a High Volume – Low Mix SMT Line
The advent of miniature surface mount components coupled with increasing lead counts has posed tremendous
challenges during assembly. This is especially true in an Electronics Manufacturing Ser
.. read more