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Comparison of Thermal Fatigue Performance of SAC105 (Sn-1.0Ag-0.5Cu),Sn- 3.5Ag,and SAC305 (Sn-3.0Ag-0.5Cu) BGA Components with SAC305 Solder Paste
Many BGA and CSP component suppliers have begun shipment of components with a variety of “second generation” Pb-free solder ball alloys. Much of the motivation for the alloy changes has been to
.. read more
Formation and Growth of Intermetallics at the Interface between Lead-free Solders and Copper Substrates
Intermetallic formation and growth were studied for the alloys Sn-3.2Ag-0.8Cu,Sn-3.5Ag,Sn-0.7Cu,and Sn-9Zn.
Coupons of solder joints (prepared by melting some of each solder alloy on a copper-p
.. read more
Comparison of Thermal Fatigue Performance of SAC105 (Sn-1.0Ag-0.5Cu),Sn- 3.5Ag,and SAC305 (Sn-3.0Ag-0.5Cu) BGA Components with SAC305 Solder Paste
Many BGA and CSP component suppliers have begun shipment of components with a variety of “second generation” Pb-free solder ball alloys. Much of the motivation for the alloy changes has been to
.. read more
Formation and Growth of Intermetallics at the Interface between Lead-free Solders and Copper Substrates
Intermetallic formation and growth were studied for the alloys Sn-3.2Ag-0.8Cu,Sn-3.5Ag,Sn-0.7Cu,and Sn-9Zn.
Coupons of solder joints (prepared by melting some of each solder alloy on a copper-p
.. read more