Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Thermal Cycling Reliability Screening of Multiple Pb-free Solder Ball Alloys
Thermal cycling tests were conducted using two different ceramic ball grid array (CBGA) test vehicles having balls comprised of nine different Pb free solder alloys. The experiment was designed
.. read more
A Comparison Study on Sn3.5Ag and Sn3.8Ag0.7Cu C5 Lead Free Solder System
A comparison study was carried out with Sn3.5Ag and Sn3.8Ag0.7Cu solder balls on Ball Grid Array (BGA) components
with Cu/Ni/Au pad finishing. This study shows that Sn3.5Ag C5 solder system per
.. read more
Thermal Cycling Reliability Screening of Multiple Pb-free Solder Ball Alloys
Thermal cycling tests were conducted using two different ceramic ball grid array (CBGA) test vehicles having balls comprised of nine different Pb free solder alloys. The experiment was designed
.. read more
A Comparison Study on Sn3.5Ag and Sn3.8Ag0.7Cu C5 Lead Free Solder System
A comparison study was carried out with Sn3.5Ag and Sn3.8Ag0.7Cu solder balls on Ball Grid Array (BGA) components
with Cu/Ni/Au pad finishing. This study shows that Sn3.5Ag C5 solder system per
.. read more