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Manufacturability and Reliability Screening of Lower Melting Point Pb-Free Alloys Containing Bi

This paper is the first of two papers discussing the Celestica/Honeywell Lower Melt Alloy program. The program explores the manufacturability and reliability for Pb-freethree Bi-containing allo .. read more

Influence of Microstructure on Mechanical Behavior of Bi-Containing Pb-Free Solders

SAC-Bi and Sn-Ag-Bi alloys have demonstrated superior performance in thermal cycling reliability tests of printed circuit boards,such as the National Center for Manufacturing Sciences programs .. read more

The New Lead Free Assembly Rework Solution Using Low Melting Alloys

This paper describes a new lead-free SMT rework process which avoids component overheating,reduces board warpage and cratering,and prevents adjacent components from thermal damage. In the repla .. read more

Manufacturability and Reliability Screening of Lower Melting Point Pb-Free Alloys Containing Bi

This paper is the first of two papers discussing the Celestica/Honeywell Lower Melt Alloy program. The program explores the manufacturability and reliability for Pb-freethree Bi-containing allo .. read more

Influence of Microstructure on Mechanical Behavior of Bi-Containing Pb-Free Solders

SAC-Bi and Sn-Ag-Bi alloys have demonstrated superior performance in thermal cycling reliability tests of printed circuit boards,such as the National Center for Manufacturing Sciences programs .. read more

The New Lead Free Assembly Rework Solution Using Low Melting Alloys

This paper describes a new lead-free SMT rework process which avoids component overheating,reduces board warpage and cratering,and prevents adjacent components from thermal damage. In the repla .. read more