Knowledge Hub
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Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Manufacturability and Reliability Screening of Lower Melting Point Pb-Free Alloys Containing Bi
This paper is the first of two papers discussing the Celestica/Honeywell Lower Melt Alloy program. The program explores the manufacturability and reliability for Pb-freethree Bi-containing allo
.. read more
The Last Will and Testaments of Tin/Lead and Lead-free BGA Voids
Conclusions:
•Tin/Lead BGAs: The location of the void within the solder joint was the primary root cause for the loss of solder joint integrity.
•Lead-free BGAs: The statistical analysis and th
.. read more
Testing Intermetallic Fragility on Enig upon Addition of Limitless Cu
As reliability requirements increase,especially for defense and aerospace applications,the need to characterize components used in electronic assembly also increases. OEM and EMS companies look
.. read more
Assessment of Reterminated RoHS Components for SnPb Applications
The banning of Pb in electronic component termination finishes has flushed through the supply chain making it impossible in some cases for hi-reliability users to purchase Pb containing interco
.. read more
Growth Mechanisms of Tin Whiskers at Press-in Technology
Compliant press-fit zones apply external mechanical stress to copper and tin surfaces of plated through holes at printed circuit boards during and after performing the press-in process. This ex
.. read more
Evaluation of Laminates in Pb-free HASL Process and Pb-free Assembly Environment
An evaluation of four FR4 laminates in commonly used stack-ups was done to determine their survivability for the Pb-free HASL process followed by a worst case Pb-free manufacturing environment
.. read more
Pb-Free Selective Wave Solder Guidelines for Thermally Challenging PCBs
As the use of lead-free alloys has increased in electronic assemblies,much work has been done to develop Design for Manufacturability (DFM) guidelines for the new materials. However,there are s
.. read more
The Application of Spherical Bend Testing to Predict Safe Working Manufacturing Process Strains
The increased temperatures associated with lead free processes have produced significant challenges for PWB laminates.
Newly developed laminates have different curing processes,are commonly fil
.. read more
New Cleaning Agent Designs for Removing No-Clean Lead-Free Flux Residues
The process cleaning rate theorem holds that the static rate (chemical forces) plus the dynamic cleaning rate (mechanical forces) equals the process cleaning rate. New lead-free flux residues r
.. read more
Meeting the Challenge of Removing Flux Residues from Electronic Circuitry Utilizing Low Standoff Heights
Our insatiable desire for smaller,faster and highly functional electronic devices presents numerous challenges for package designers and manufacturers. Current day popular approaches include st
.. read more
Low-Silver BGA Assembly Phase II – Reliability Assessment Seventh Report: Mixed Metallurgy Solder Joint Thermal Cycling Results
Some ball grid array suppliers are migrating their sphere alloys from SAC305 (3% Ag) or SAC405 (4% Ag) to alloys with lower silver contents and often with “micro alloying” additions. There are
.. read more
NASA-DoD Lead-Free Electronics Project: Mechanical Shock Test
Mechanical shock testing was conducted by Boeing Research and Technology (Seattle) for the NASA-DoD Lead-Free Electronics Solder Project. This project is follow-on to the Joint Council on Aging
.. read more
Achieving High Reliability Low Cost Lead-Free SAC Solder Joints Via Mn Or Ce Doping
In this study,the reliabilities of low Ag SAC alloys doped with Mn or Ce (SACM or SACC) were evaluated under JEDEC drop,dynamic bending,thermal cycling,and cyclic bending test conditions agains
.. read more
Copper Pad Dissolution and Microstructure Analysis of Reworked Plastic Grid Array Assemblies
An experimental study was conducted to examine the impact of rework processes on quality and reliability. In this study,676 IO plastic ball grid array packages were assembled with Sn3.0Ag0.5Cu
.. read more
Comparative Assessment of Electrochemical Migration on Printed Circuit Boards with Lead-Free and Tin-Lead Solders
Current leakage on a printed circuit board (PCB) can occur due to a reduction in surface insulation resistance (SIR) between adjacent conductors. This is frequently caused by electrochemical mi
.. read more
Reliability and Microstructure of Lead-Free Solder Joints in Industrial Electronics after Accelerated Thermal Aging
The reliability of lead-free (LF) solder joints in surface-mounted device components (SMD) has been investigated after thermo-cycle testing. Kirkendall voids have been observed at the interface
.. read more
Effect of Design Variables on the Reliability of Lead Free Area Array Connectors
As the use of area array connectors has become more widespread in electronic assemblies,the need to evaluate their reliability has increased. There is,however,limited information on how best to
.. read more
THE EFFECT OF FILLING VIA-IN-PAD ON VOIDING RATES IN PWB ASSEMBLY FOR BGA COMPONENTS
The debate on the effect of voiding on BGA reliability has continued for years. Many PWB assemblers strive to minimize voiding,particularly with the advent of lead-free processing and in fine f
.. read more
Effects of Reflow Profile and Thermal Shock on Intermetallic Compound Thickness for SnPb and SnAgCu Solder Joints
During the solder reflow processes many reactions occur. There is the reduction of oxides on the metal surfaces,metal dissolution,wetting to different surfaces,and intermetallic compound format
.. read more
Novel SACX Solders with Drop Test Performance Outperforming Eutectic Tin-Lead
A family of SACX alloys has been developed with significant improvement in drop test performance on NiAu surface finish. Dopants such as Mn,Bi,Ti,Ce,and to a less extent Y for SAC105 have been
.. read more
Wafer Bumping Stenciling Techniques with Solder Paste
Wafer bumping using thin electroformed nickel stencils with ultra fine powder solder paste continues to gain popularity as a cost effective alternative to ball drop and electroplated technologi
.. read more
Mass Reflow Assembly of 01005 Components
As the electronics assembly industry adjusts to building boards with 0201 components,the next level of shrinkage for chip components is just around the corner with the emergence of 01005s. A ke
.. read more
Manufacturability and Reliability Screening of Lower Melting Point Pb-Free Alloys Containing Bi
This paper is the first of two papers discussing the Celestica/Honeywell Lower Melt Alloy program. The program explores the manufacturability and reliability for Pb-freethree Bi-containing allo
.. read more
The Last Will and Testaments of Tin/Lead and Lead-free BGA Voids
Conclusions:
•Tin/Lead BGAs: The location of the void within the solder joint was the primary root cause for the loss of solder joint integrity.
•Lead-free BGAs: The statistical analysis and th
.. read more
Testing Intermetallic Fragility on Enig upon Addition of Limitless Cu
As reliability requirements increase,especially for defense and aerospace applications,the need to characterize components used in electronic assembly also increases. OEM and EMS companies look
.. read more
Assessment of Reterminated RoHS Components for SnPb Applications
The banning of Pb in electronic component termination finishes has flushed through the supply chain making it impossible in some cases for hi-reliability users to purchase Pb containing interco
.. read more
Growth Mechanisms of Tin Whiskers at Press-in Technology
Compliant press-fit zones apply external mechanical stress to copper and tin surfaces of plated through holes at printed circuit boards during and after performing the press-in process. This ex
.. read more
Evaluation of Laminates in Pb-free HASL Process and Pb-free Assembly Environment
An evaluation of four FR4 laminates in commonly used stack-ups was done to determine their survivability for the Pb-free HASL process followed by a worst case Pb-free manufacturing environment
.. read more
Pb-Free Selective Wave Solder Guidelines for Thermally Challenging PCBs
As the use of lead-free alloys has increased in electronic assemblies,much work has been done to develop Design for Manufacturability (DFM) guidelines for the new materials. However,there are s
.. read more
The Application of Spherical Bend Testing to Predict Safe Working Manufacturing Process Strains
The increased temperatures associated with lead free processes have produced significant challenges for PWB laminates.
Newly developed laminates have different curing processes,are commonly fil
.. read more
New Cleaning Agent Designs for Removing No-Clean Lead-Free Flux Residues
The process cleaning rate theorem holds that the static rate (chemical forces) plus the dynamic cleaning rate (mechanical forces) equals the process cleaning rate. New lead-free flux residues r
.. read more
Meeting the Challenge of Removing Flux Residues from Electronic Circuitry Utilizing Low Standoff Heights
Our insatiable desire for smaller,faster and highly functional electronic devices presents numerous challenges for package designers and manufacturers. Current day popular approaches include st
.. read more
Low-Silver BGA Assembly Phase II – Reliability Assessment Seventh Report: Mixed Metallurgy Solder Joint Thermal Cycling Results
Some ball grid array suppliers are migrating their sphere alloys from SAC305 (3% Ag) or SAC405 (4% Ag) to alloys with lower silver contents and often with “micro alloying” additions. There are
.. read more
NASA-DoD Lead-Free Electronics Project: Mechanical Shock Test
Mechanical shock testing was conducted by Boeing Research and Technology (Seattle) for the NASA-DoD Lead-Free Electronics Solder Project. This project is follow-on to the Joint Council on Aging
.. read more
Achieving High Reliability Low Cost Lead-Free SAC Solder Joints Via Mn Or Ce Doping
In this study,the reliabilities of low Ag SAC alloys doped with Mn or Ce (SACM or SACC) were evaluated under JEDEC drop,dynamic bending,thermal cycling,and cyclic bending test conditions agains
.. read more
Copper Pad Dissolution and Microstructure Analysis of Reworked Plastic Grid Array Assemblies
An experimental study was conducted to examine the impact of rework processes on quality and reliability. In this study,676 IO plastic ball grid array packages were assembled with Sn3.0Ag0.5Cu
.. read more
Comparative Assessment of Electrochemical Migration on Printed Circuit Boards with Lead-Free and Tin-Lead Solders
Current leakage on a printed circuit board (PCB) can occur due to a reduction in surface insulation resistance (SIR) between adjacent conductors. This is frequently caused by electrochemical mi
.. read more
Reliability and Microstructure of Lead-Free Solder Joints in Industrial Electronics after Accelerated Thermal Aging
The reliability of lead-free (LF) solder joints in surface-mounted device components (SMD) has been investigated after thermo-cycle testing. Kirkendall voids have been observed at the interface
.. read more
Effect of Design Variables on the Reliability of Lead Free Area Array Connectors
As the use of area array connectors has become more widespread in electronic assemblies,the need to evaluate their reliability has increased. There is,however,limited information on how best to
.. read more
THE EFFECT OF FILLING VIA-IN-PAD ON VOIDING RATES IN PWB ASSEMBLY FOR BGA COMPONENTS
The debate on the effect of voiding on BGA reliability has continued for years. Many PWB assemblers strive to minimize voiding,particularly with the advent of lead-free processing and in fine f
.. read more
Effects of Reflow Profile and Thermal Shock on Intermetallic Compound Thickness for SnPb and SnAgCu Solder Joints
During the solder reflow processes many reactions occur. There is the reduction of oxides on the metal surfaces,metal dissolution,wetting to different surfaces,and intermetallic compound format
.. read more
Novel SACX Solders with Drop Test Performance Outperforming Eutectic Tin-Lead
A family of SACX alloys has been developed with significant improvement in drop test performance on NiAu surface finish. Dopants such as Mn,Bi,Ti,Ce,and to a less extent Y for SAC105 have been
.. read more
Wafer Bumping Stenciling Techniques with Solder Paste
Wafer bumping using thin electroformed nickel stencils with ultra fine powder solder paste continues to gain popularity as a cost effective alternative to ball drop and electroplated technologi
.. read more
Mass Reflow Assembly of 01005 Components
As the electronics assembly industry adjusts to building boards with 0201 components,the next level of shrinkage for chip components is just around the corner with the emergence of 01005s. A ke
.. read more