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The Relationship between Backward Compatible Assembly and Microstructure on the Thermal Fatigue Reliability of an Extremely Large Ball Grid Array
Accelerated temperature cycling was used to evaluate the thermal fatigue reliability for the case of backward compatible
assembly (mixed alloy,Pb-free BGA/SnPb paste) of a 3162 pin count,extrem
.. read more
Reliability of BGA Solder Joints after Re-Balling Process
Due to the obsolescence of SnPb BGA components,electronics manufacturers that use SnPb solder paste either have to use
lead-free BGAs and adjust the reflow process or re-ball these components w
.. read more
The Relationship between Backward Compatible Assembly and Microstructure on the Thermal Fatigue Reliability of an Extremely Large Ball Grid Array
Accelerated temperature cycling was used to evaluate the thermal fatigue reliability for the case of backward compatible
assembly (mixed alloy,Pb-free BGA/SnPb paste) of a 3162 pin count,extrem
.. read more
Reliability of BGA Solder Joints after Re-Balling Process
Due to the obsolescence of SnPb BGA components,electronics manufacturers that use SnPb solder paste either have to use
lead-free BGAs and adjust the reflow process or re-ball these components w
.. read more