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How to Manage Wave Solder Alloy Contaminations

European electronics industry is soldering with lead-free alloys for one decade now. In this period not only the knowledge of the alloys in the assembly process has been improved,but also a hig .. read more

Solder Creep-Fatigue Model Parameters for SAC & Snag Lead-Free Solder Joint Reliability Estimation

For many of the Pb-free solders required under the European RoHS directive,there is now sufficient information,primarily in the form of the results of accelerated thermal cycling of various lev .. read more

RoHS and Green Compliance in IC Packaging

In this report,BGA packages with conventional and green material combination were selected as test vehicles for the investigation of MSL/temperature rating at the packaging level. The IC packag .. read more

How to Manage Wave Solder Alloy Contaminations

European electronics industry is soldering with lead-free alloys for one decade now. In this period not only the knowledge of the alloys in the assembly process has been improved,but also a hig .. read more

Solder Creep-Fatigue Model Parameters for SAC & Snag Lead-Free Solder Joint Reliability Estimation

For many of the Pb-free solders required under the European RoHS directive,there is now sufficient information,primarily in the form of the results of accelerated thermal cycling of various lev .. read more

RoHS and Green Compliance in IC Packaging

In this report,BGA packages with conventional and green material combination were selected as test vehicles for the investigation of MSL/temperature rating at the packaging level. The IC packag .. read more