Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
Display
The Effect of Reflow Profiling on the Electrical Reliability of No-Clean Solder Paste Flux Residues
An estimated 80% of all SMT assembly in the world is performed with a no-clean soldering process,largely due to the
predominance of consumer-type electronics. The continuing trend of increasing
.. read more
Improving Yields and Quality: Two Case Studies: Graping and the Head-on-Pillow defect
HoP Mitigation is addressed with respect to solder paste,components,inspection,process and the environment.
Graping minimization recommendations are given with data driven suggestions.
.. read more
Before & After Reflow Characterization of FCBGA Voiding Utilizing High Resolution CT Scan,X-ray (2D & 3D) Imaging,and Cross Section with...
A joint project between Flextronics Inc. and North Star Imaging Inc. is being conducted to correlate current x-ray imaging and cross-section analysis of BGA voiding with state of the art high r
.. read more
Investigating the 01005-Component Assembly Process Requirements
In 2006 we conducted two formal detailed experiments on the 01005-component assembly process. Two of the most significant findings from those experiments were that a 0.003” thick stencil is req
.. read more
THE EFFECT OF FILLING VIA-IN-PAD ON VOIDING RATES IN PWB ASSEMBLY FOR BGA COMPONENTS
The debate on the effect of voiding on BGA reliability has continued for years. Many PWB assemblers strive to minimize voiding,particularly with the advent of lead-free processing and in fine f
.. read more
The Effect of Reflow Profiling on the Electrical Reliability of No-Clean Solder Paste Flux Residues
An estimated 80% of all SMT assembly in the world is performed with a no-clean soldering process,largely due to the
predominance of consumer-type electronics. The continuing trend of increasing
.. read more
Improving Yields and Quality: Two Case Studies: Graping and the Head-on-Pillow defect
HoP Mitigation is addressed with respect to solder paste,components,inspection,process and the environment.
Graping minimization recommendations are given with data driven suggestions.
.. read more
Before & After Reflow Characterization of FCBGA Voiding Utilizing High Resolution CT Scan,X-ray (2D & 3D) Imaging,and Cross Section with...
A joint project between Flextronics Inc. and North Star Imaging Inc. is being conducted to correlate current x-ray imaging and cross-section analysis of BGA voiding with state of the art high r
.. read more
Investigating the 01005-Component Assembly Process Requirements
In 2006 we conducted two formal detailed experiments on the 01005-component assembly process. Two of the most significant findings from those experiments were that a 0.003” thick stencil is req
.. read more
THE EFFECT OF FILLING VIA-IN-PAD ON VOIDING RATES IN PWB ASSEMBLY FOR BGA COMPONENTS
The debate on the effect of voiding on BGA reliability has continued for years. Many PWB assemblers strive to minimize voiding,particularly with the advent of lead-free processing and in fine f
.. read more