Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Low Temperature SMT Solder Evaluation
The electronics industry could benefit greatly from using a reliable, manufacturable, reduced temperature, SMT solder material (alloy-composition) which is cost competitive with traditional
.. read more
Validated Test Method to Characterize and Quantify Pad Cratering Under Bga Pads on Printed Circuit Boards
The conversion to lead free Ball Grid Array (BGA) packages has raised several new assembly and reliability issues. One reliability concern becoming more prevalent is the increased propensity fo
.. read more
Effects of Reflow Profile and Thermal Shock on Intermetallic Compound Thickness for SnPb and SnAgCu Solder Joints
During the solder reflow processes many reactions occur. There is the reduction of oxides on the metal surfaces,metal dissolution,wetting to different surfaces,and intermetallic compound format
.. read more
Optimization of Lead-Free Soldering Processes for Volume Manufacturing
In this paper,a comprehensive review is provided on the optimization of soldering processes (including reflow,wave
soldering,and rework),for different component types,different PCB sizes and fi
.. read more
Life-Cycle Comparison of Energy Use during the Application of Lead-Free Solders
The energy consumed during the reflow assembly of printed wiring board assemblies is expected to be environmentally
significant within the solder product life-cycle. Wide differences in the mel
.. read more
Selective Soldering Of Flexible Circuits Using Diode Lasers
The use of laser technology has found increasing applications in the electronics assembly industry. This non-contact
heating technique is ideal for components that require careful handling whic
.. read more
Low Temperature SMT Solder Evaluation
The electronics industry could benefit greatly from using a reliable, manufacturable, reduced temperature, SMT solder material (alloy-composition) which is cost competitive with traditional
.. read more
Validated Test Method to Characterize and Quantify Pad Cratering Under Bga Pads on Printed Circuit Boards
The conversion to lead free Ball Grid Array (BGA) packages has raised several new assembly and reliability issues. One reliability concern becoming more prevalent is the increased propensity fo
.. read more
Effects of Reflow Profile and Thermal Shock on Intermetallic Compound Thickness for SnPb and SnAgCu Solder Joints
During the solder reflow processes many reactions occur. There is the reduction of oxides on the metal surfaces,metal dissolution,wetting to different surfaces,and intermetallic compound format
.. read more
Optimization of Lead-Free Soldering Processes for Volume Manufacturing
In this paper,a comprehensive review is provided on the optimization of soldering processes (including reflow,wave
soldering,and rework),for different component types,different PCB sizes and fi
.. read more
Life-Cycle Comparison of Energy Use during the Application of Lead-Free Solders
The energy consumed during the reflow assembly of printed wiring board assemblies is expected to be environmentally
significant within the solder product life-cycle. Wide differences in the mel
.. read more
Selective Soldering Of Flexible Circuits Using Diode Lasers
The use of laser technology has found increasing applications in the electronics assembly industry. This non-contact
heating technique is ideal for components that require careful handling whic
.. read more