Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Size Matters - The Effects of Solder Powder Size on Solder Paste Performance
Solder powder size is a popular topic in the electronics industry due to the continuing trend of miniaturization of electronics. The question commonly asked is “when we should switch from Ty
.. read more
Water Soluble Solder Paste,Wet Behind the Ears or Wave of the Future?
Water soluble lead-free solder paste is widely used in today’s SMT processes,but the industry is slowly moving away from water soluble solder pastes in favor of no-clean solder pastes. This shi
.. read more
Design Improvements for Selective Soldering Assemblies
Selective soldering,along with pin-in-paste reflow and press fit,is the primary assembly method for through-hole components. The reflow process is limited by component dimensions and heat resis
.. read more
An Interesting Approach to Yield Improvement for the Solder Paste Printing and Reflow Process
Whilst many companies invest time,effort and cost into up front work to fix snags which would lead to issues with yield during production,this paper shows the efforts of the company who looks t
.. read more
Dispelling the Black Magic of Solder Paste
Solder paste has long been viewed as “black magic”. This “black magic” can easily be dispelled through a solder paste evaluation. Unfortunately,solder paste evaluation can be a challenge for el
.. read more
Effects of an Appropriate PCB Layout and Soldering Nozzle Design on Quality and Cost Structure in Selective Soldering Processes
The globalization of markets results in stronger competition with clearly noticeably cost pressure. For companies producing electronic equipment it is therefore of existential importance to red
.. read more
Performance of China Alloy SnAgCuCe in Reflow Soldering
Work on assisting China's Ministry of Information Industry (MII) to assess the performance of a solder paste using the China alloy Sn3.0Ag0.5Cu0.019Ce (SACCe) was completed. Two Indium fluxes w
.. read more
Optimizing Your Reflow Profile for Maximum Productivity and Profitability
Successful reflow soldering is a key to productivity and profitability,yet many assemblers may be using a nonoptimized
reflow profile.
Years ago,when IR ovens were the norm and solder pastes we
.. read more
Development of Lead-Free Wave Soldering Process
Lead-free wave soldering was studied in this work using Sn/Ag/Cu alloy. A process DOE was developed,with three
variables (solder bath temperature,conveyor speed,and soldering atmosphere),using
.. read more
Size Matters - The Effects of Solder Powder Size on Solder Paste Performance
Solder powder size is a popular topic in the electronics industry due to the continuing trend of miniaturization of electronics. The question commonly asked is “when we should switch from Ty
.. read more
Water Soluble Solder Paste,Wet Behind the Ears or Wave of the Future?
Water soluble lead-free solder paste is widely used in today’s SMT processes,but the industry is slowly moving away from water soluble solder pastes in favor of no-clean solder pastes. This shi
.. read more
Design Improvements for Selective Soldering Assemblies
Selective soldering,along with pin-in-paste reflow and press fit,is the primary assembly method for through-hole components. The reflow process is limited by component dimensions and heat resis
.. read more
An Interesting Approach to Yield Improvement for the Solder Paste Printing and Reflow Process
Whilst many companies invest time,effort and cost into up front work to fix snags which would lead to issues with yield during production,this paper shows the efforts of the company who looks t
.. read more
Dispelling the Black Magic of Solder Paste
Solder paste has long been viewed as “black magic”. This “black magic” can easily be dispelled through a solder paste evaluation. Unfortunately,solder paste evaluation can be a challenge for el
.. read more
Effects of an Appropriate PCB Layout and Soldering Nozzle Design on Quality and Cost Structure in Selective Soldering Processes
The globalization of markets results in stronger competition with clearly noticeably cost pressure. For companies producing electronic equipment it is therefore of existential importance to red
.. read more
Performance of China Alloy SnAgCuCe in Reflow Soldering
Work on assisting China's Ministry of Information Industry (MII) to assess the performance of a solder paste using the China alloy Sn3.0Ag0.5Cu0.019Ce (SACCe) was completed. Two Indium fluxes w
.. read more
Optimizing Your Reflow Profile for Maximum Productivity and Profitability
Successful reflow soldering is a key to productivity and profitability,yet many assemblers may be using a nonoptimized
reflow profile.
Years ago,when IR ovens were the norm and solder pastes we
.. read more
Development of Lead-Free Wave Soldering Process
Lead-free wave soldering was studied in this work using Sn/Ag/Cu alloy. A process DOE was developed,with three
variables (solder bath temperature,conveyor speed,and soldering atmosphere),using
.. read more