Knowledge Hub
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Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Predicting Fatigue of Solder Joints Subjected to High Number of Power Cycles
Solder joint reliability of SMT components connected to printed circuit boards is well documented. However,much of the
testing and data is related to high-strain energy thermal cycling experime
.. read more
Effect of Cooling Rate on the Intermetallic Layer in Solder Joints
While it has long been known that the Cu6Sn5 intermetallic that plays a critical role in the reliability of solder joints made with tin-containing alloys on copper substrates exists in two diff
.. read more
Observations on the Influences of Various Parameters on Pb-free Solder Joint Appearance and Strength
A designed experiment evaluated the influence of several variables on visual appearance and strength of Pb-free solder joints.
Components,with leads finished with nickel-palladium-gold (NiPdAu)
.. read more
Effect of Area Array Package Types on Assembly Reliability and Comments on IPC-9701A
Status of thermal cycle test results for a nonfunctional daisy-chained peripheral ceramic column grid array (CCGA) and its
plastic ball grid array (PBGA) version,both having 560 I/Os,were prese
.. read more
Reliability of CCGA and PBGA Assemblies
Area Array Packages (AAPs) with 1.27 mm pitch have been the packages of choice for commercial applications; they are now
starting to be implemented for use in military and aerospace application
.. read more
Solder Joint Reliability Qualification of Various Component Mounting Modification Configurations Using Thermal Cycle Testing
The selection and use of solder joint modification configurations for printed wiring assemblies has traditionally been a design
specific activity. The implementation and use of a standardized s
.. read more
Investigation of the Effectiveness of Automated X-ray Inspection Systems in a High Volume – Low Mix SMT Line
The advent of miniature surface mount components coupled with increasing lead counts has posed tremendous
challenges during assembly. This is especially true in an Electronics Manufacturing Ser
.. read more
Predicting Fatigue of Solder Joints Subjected to High Number of Power Cycles
Solder joint reliability of SMT components connected to printed circuit boards is well documented. However,much of the
testing and data is related to high-strain energy thermal cycling experime
.. read more
Effect of Cooling Rate on the Intermetallic Layer in Solder Joints
While it has long been known that the Cu6Sn5 intermetallic that plays a critical role in the reliability of solder joints made with tin-containing alloys on copper substrates exists in two diff
.. read more
Observations on the Influences of Various Parameters on Pb-free Solder Joint Appearance and Strength
A designed experiment evaluated the influence of several variables on visual appearance and strength of Pb-free solder joints.
Components,with leads finished with nickel-palladium-gold (NiPdAu)
.. read more
Effect of Area Array Package Types on Assembly Reliability and Comments on IPC-9701A
Status of thermal cycle test results for a nonfunctional daisy-chained peripheral ceramic column grid array (CCGA) and its
plastic ball grid array (PBGA) version,both having 560 I/Os,were prese
.. read more
Reliability of CCGA and PBGA Assemblies
Area Array Packages (AAPs) with 1.27 mm pitch have been the packages of choice for commercial applications; they are now
starting to be implemented for use in military and aerospace application
.. read more
Solder Joint Reliability Qualification of Various Component Mounting Modification Configurations Using Thermal Cycle Testing
The selection and use of solder joint modification configurations for printed wiring assemblies has traditionally been a design
specific activity. The implementation and use of a standardized s
.. read more
Investigation of the Effectiveness of Automated X-ray Inspection Systems in a High Volume – Low Mix SMT Line
The advent of miniature surface mount components coupled with increasing lead counts has posed tremendous
challenges during assembly. This is especially true in an Electronics Manufacturing Ser
.. read more