Knowledge Hub
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Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Evaluating Solder Joint Failures and Solder Joint Reliability: A Side-by-Side Comparison of Direct Current and Microwave Based Monitoring Techniques
Historically, evaluations of solder joint failures and solder joint reliability have been done with direct current (DC) methods, using event detectors or data loggers for high-frequency circ
.. read more
Solder Joints Failure Under Low Strain-rate Cyclic Loading
Solder joint reliability has been a key issue for electronic assemblies and microelectronic packaging for many years. Many different factors can affect the solder joint reliability,such as pack
.. read more
Soldering and Plating for Tin-Lead and Lead-Free Connection Reliability
Aerospace Defense High Performance (ADHP) electronics products primarily use tin-lead solders,but electrical and electronic component finishes (i.e.,platings) increasingly are designed for lead
.. read more
Comparison of Finite Elements Based Thermal Shock Test Reliability Assessment with a Specimen Based Test Approach
When it comes to reliability assessment of an electronic system,consisting of several components,such as an assembled printed circuit board (PCBA),this often turns out to be a challenging task.
.. read more
Reliability Study of Bottom Terminated Components
Bottom terminated components (BTC) are leadless components where terminations are protectively plated on the underside of the package. They are all slightly different and have different names,s
.. read more
Selective Soldering for Interconnection Technology Used in Enterprise Communication Apparatuses
At times,wave soldering or reflow involving the entire assembly are not applicable for soldering of components. Selective soldering techniques vary widely in their ability to produce high quali
.. read more
Prediction of Digital Circuit Board Reliability Using Computational Reliability Modeling
A process called computational reliability modeling is described herein as well as how the reliability predictions from this
modeling approach match experimental data (both lead and lead-free s
.. read more
Dynamic Testing and Modeling for Solder Joint Reliability Evaluation
The behavior of BGA solder joints under dynamic loads has become more significant in recent years. This work explored test
methodologies for solder joint failure evaluation under dynamic loads.
.. read more
Evaluating Solder Joint Failures and Solder Joint Reliability: A Side-by-Side Comparison of Direct Current and Microwave Based Monitoring Techniques
Historically, evaluations of solder joint failures and solder joint reliability have been done with direct current (DC) methods, using event detectors or data loggers for high-frequency circ
.. read more
Solder Joints Failure Under Low Strain-rate Cyclic Loading
Solder joint reliability has been a key issue for electronic assemblies and microelectronic packaging for many years. Many different factors can affect the solder joint reliability,such as pack
.. read more
Soldering and Plating for Tin-Lead and Lead-Free Connection Reliability
Aerospace Defense High Performance (ADHP) electronics products primarily use tin-lead solders,but electrical and electronic component finishes (i.e.,platings) increasingly are designed for lead
.. read more
Comparison of Finite Elements Based Thermal Shock Test Reliability Assessment with a Specimen Based Test Approach
When it comes to reliability assessment of an electronic system,consisting of several components,such as an assembled printed circuit board (PCBA),this often turns out to be a challenging task.
.. read more
Reliability Study of Bottom Terminated Components
Bottom terminated components (BTC) are leadless components where terminations are protectively plated on the underside of the package. They are all slightly different and have different names,s
.. read more
Selective Soldering for Interconnection Technology Used in Enterprise Communication Apparatuses
At times,wave soldering or reflow involving the entire assembly are not applicable for soldering of components. Selective soldering techniques vary widely in their ability to produce high quali
.. read more
Prediction of Digital Circuit Board Reliability Using Computational Reliability Modeling
A process called computational reliability modeling is described herein as well as how the reliability predictions from this
modeling approach match experimental data (both lead and lead-free s
.. read more
Dynamic Testing and Modeling for Solder Joint Reliability Evaluation
The behavior of BGA solder joints under dynamic loads has become more significant in recent years. This work explored test
methodologies for solder joint failure evaluation under dynamic loads.
.. read more