Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Nanotechnology for Lead-Free PWB Final Finishes with Organic Metal
The use of an Organic Metal finish only a few nano-meters deposited onto copper pads of printed circuit boards provides effective protection against oxidation and preserves solderability. The N
.. read more
Economic and Technical Advantages of Chemical Dross Elimination and Prevention
Dross generation has always been a costly issue for the electronics assembly industry. At least half,and in many cases,more than half of the metal (solder) purchased for electronic manufacture
.. read more
Assembly of Large PWBs in a RoHS Environment
As early as 2001,leading cellular phone manufacturers had established stable assembly processes that were RoHS compliant for their cellular phone products. Since this time,the products manufact
.. read more
Understanding the Impact of Accelerated Temperature Profiles on Lead-Free Soldering
Traditional reflow profiles for lead-free soldering typically require longer processing times due to elevated peak temperatures
and flux activation times defined by solder paste suppliers. Thes
.. read more
Evaluating the Use of Next Generation Reflow Profile Control for High Volume Electronics Manufacturing
In recent years,technological advances in electronics manufacturing have allowed high volume manufacturers to
significantly improve process control and documentation. Manufacturers have acceler
.. read more
Implementation of High I/O Count 1mm Pitch BGA Technology
Electronic package size reduction and demand for increased functions within less board space make a challenge for
the PCB designer to find smaller footprint components that will out perform lar
.. read more
Nanotechnology for Lead-Free PWB Final Finishes with Organic Metal
The use of an Organic Metal finish only a few nano-meters deposited onto copper pads of printed circuit boards provides effective protection against oxidation and preserves solderability. The N
.. read more
Economic and Technical Advantages of Chemical Dross Elimination and Prevention
Dross generation has always been a costly issue for the electronics assembly industry. At least half,and in many cases,more than half of the metal (solder) purchased for electronic manufacture
.. read more
Assembly of Large PWBs in a RoHS Environment
As early as 2001,leading cellular phone manufacturers had established stable assembly processes that were RoHS compliant for their cellular phone products. Since this time,the products manufact
.. read more
Understanding the Impact of Accelerated Temperature Profiles on Lead-Free Soldering
Traditional reflow profiles for lead-free soldering typically require longer processing times due to elevated peak temperatures
and flux activation times defined by solder paste suppliers. Thes
.. read more
Evaluating the Use of Next Generation Reflow Profile Control for High Volume Electronics Manufacturing
In recent years,technological advances in electronics manufacturing have allowed high volume manufacturers to
significantly improve process control and documentation. Manufacturers have acceler
.. read more
Implementation of High I/O Count 1mm Pitch BGA Technology
Electronic package size reduction and demand for increased functions within less board space make a challenge for
the PCB designer to find smaller footprint components that will out perform lar
.. read more