Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Reflow Soldering Equals Wave Soldering Plus One
Lead-free solder is more than a swap for SnPb and more than simply an alternative alloy. Five years after implementation discussion remains regarding which alloy is the best for which applicati
.. read more
Broadband Printing – A Paradigm
The SMT industry is going through a challenging phase of assembling miniature components,such as micro BGA,0.3mm CSP and 01005 passives onto Printed Circuit Boards (PCB). This effort is primari
.. read more
Production Experience and Performance Characterization of a Novel Immersion Silver
Following previous reports by the authors on the general properties of a novel immersion silver process,this paper presents
the production experience in typical horizontal lines to demonstrate
.. read more
The Characterization of Novel High Temperature Resistant OSP Coatings for Lead free Processes by Comparing to Other Commercial OSP Coatings
In order to meet the growing requirement of eliminating lead from electronics,the printed wiring board (PWB) industry is
migrating from hot-air-leveled solder (Sn/Pb) to lead free compatible al
.. read more
Next Generation Organic Solderability Preservatives (OSP) for Lead-free soldering and Mixed Metal Finish PWB’s and BGA Substrates
With the electronics industry rapidly moving to lead-free soldering and requirements for long term reliability of the assembly
becoming more critical,fabricators and OEM’s must determine the mo
.. read more
Reliability Testing and Failure Analysis of Lead-Free Solder Joints under Thermo-Mechanical Stress
The commercial use of lead-free solder has been making significant gains worldwide in recent years. To identify the effects
of thermo-mechanical stress on Sn-Ag-Cu and Sn-Zn-Bi solder with diff
.. read more
A Reliability Comparison of Different Lead-Free Alloys and Surface Finishes in SMT Assembly
As we inch towards the somewhat shifting deadlines towards lead (Pb) restriction in Japan and Europe,there is an increase
seen in the amount of studies performed for electronics assemblies sold
.. read more
Solderability Testing Methodologies for BGA Packages
Solderability testing is carried out at the IC (Integrated Circuit) manufacturer’s end to evaluate the quality of the IC
package terminals in terms of solder wetting ability. Current industrial
.. read more
Solderability Testing Methodologies for BGA Packages
Solderability testing is carried out at the IC (Integrated Circuit) manufacturer’s end to evaluate the quality of the IC
package terminals in terms of solder wetting ability. Current industrial
.. read more
Reflow Soldering Equals Wave Soldering Plus One
Lead-free solder is more than a swap for SnPb and more than simply an alternative alloy. Five years after implementation discussion remains regarding which alloy is the best for which applicati
.. read more
Broadband Printing – A Paradigm
The SMT industry is going through a challenging phase of assembling miniature components,such as micro BGA,0.3mm CSP and 01005 passives onto Printed Circuit Boards (PCB). This effort is primari
.. read more
Production Experience and Performance Characterization of a Novel Immersion Silver
Following previous reports by the authors on the general properties of a novel immersion silver process,this paper presents
the production experience in typical horizontal lines to demonstrate
.. read more
The Characterization of Novel High Temperature Resistant OSP Coatings for Lead free Processes by Comparing to Other Commercial OSP Coatings
In order to meet the growing requirement of eliminating lead from electronics,the printed wiring board (PWB) industry is
migrating from hot-air-leveled solder (Sn/Pb) to lead free compatible al
.. read more
Next Generation Organic Solderability Preservatives (OSP) for Lead-free soldering and Mixed Metal Finish PWB’s and BGA Substrates
With the electronics industry rapidly moving to lead-free soldering and requirements for long term reliability of the assembly
becoming more critical,fabricators and OEM’s must determine the mo
.. read more
Reliability Testing and Failure Analysis of Lead-Free Solder Joints under Thermo-Mechanical Stress
The commercial use of lead-free solder has been making significant gains worldwide in recent years. To identify the effects
of thermo-mechanical stress on Sn-Ag-Cu and Sn-Zn-Bi solder with diff
.. read more
A Reliability Comparison of Different Lead-Free Alloys and Surface Finishes in SMT Assembly
As we inch towards the somewhat shifting deadlines towards lead (Pb) restriction in Japan and Europe,there is an increase
seen in the amount of studies performed for electronics assemblies sold
.. read more
Solderability Testing Methodologies for BGA Packages
Solderability testing is carried out at the IC (Integrated Circuit) manufacturer’s end to evaluate the quality of the IC
package terminals in terms of solder wetting ability. Current industrial
.. read more
Solderability Testing Methodologies for BGA Packages
Solderability testing is carried out at the IC (Integrated Circuit) manufacturer’s end to evaluate the quality of the IC
package terminals in terms of solder wetting ability. Current industrial
.. read more