Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Voids in Solder Joints and Their Impact on Assembly Reliability
This informative webinar, held on May 3, 2023, explained the significance of measuring both voiding and coverage of solder joints. The session explored the data behind IPC J-STD-001HA/-A-610
.. read more
Reliability Study of Low Silver Alloy Solder Pastes
Sn3.0Ag0.5Cu (SAC305) is currently the most popular near eutectic lead-free alloy used in the manufacturing processes. Over the last several years,the price of silver has dramatically increased
.. read more
Embedded Fibers Enhance Nano-Scale Interconnections
While the density of chip-to-chip and chip-to-package component interconnections increases and their size decreases the ease
of manufacture and the interconnection reliability are being reduced
.. read more
HALT Testing of Backward Soldered BGAs on a Military Product
The move to lead free (Pb-free) electronics by the commercial industry has resulted in an increasing number of ball grid array components (BGAs) which are only available with Pb-free solder bal
.. read more
Stereo Vision Based Automated Solder Ball Height Detection
Solder ball height inspection is essential to the detection of potential connectivity issues in semi-conductor units. Current ball height inspection tools such as laser profiling,fringe project
.. read more
Grain Refinement for Improved Lead-Free Solder Joint Reliability
The very small solder joints that now account for an increasing proportion of the connections on which modern electronics depends are typically made up of only a few grains,sometimes only a sin
.. read more
Solder Creep-Fatigue Model Parameters for SAC & Snag Lead-Free Solder Joint Reliability Estimation
For many of the Pb-free solders required under the European RoHS directive,there is now sufficient information,primarily in the form of the results of accelerated thermal cycling of various lev
.. read more
Assembly of Large PWBs in a RoHS Environment
As early as 2001,leading cellular phone manufacturers had established stable assembly processes that were RoHS compliant for their cellular phone products. Since this time,the products manufact
.. read more
Failure Analysis of Eutectic and Pb-Free Solder Alloys after High Stress Exposure
Failure analysis was performed on fourteen thermally cycled or vibration tested PDIP components from the JCAA-JG-PP Lead-Free Joint Test Project. The components differed in component finish,sol
.. read more
A Comparison of the Isothermal Fatigue Behavior of Sn-Ag-Cu to Sn-Pb Solder
The movement to Pb-free soldering will result in solder joints that are significantly stiffer than those made of SnPb. This
paper presents the results from the first phase of a two-part study t
.. read more
Voids in Solder Joints and Their Impact on Assembly Reliability
This informative webinar, held on May 3, 2023, explained the significance of measuring both voiding and coverage of solder joints. The session explored the data behind IPC J-STD-001HA/-A-610
.. read more
Reliability Study of Low Silver Alloy Solder Pastes
Sn3.0Ag0.5Cu (SAC305) is currently the most popular near eutectic lead-free alloy used in the manufacturing processes. Over the last several years,the price of silver has dramatically increased
.. read more
Embedded Fibers Enhance Nano-Scale Interconnections
While the density of chip-to-chip and chip-to-package component interconnections increases and their size decreases the ease
of manufacture and the interconnection reliability are being reduced
.. read more
HALT Testing of Backward Soldered BGAs on a Military Product
The move to lead free (Pb-free) electronics by the commercial industry has resulted in an increasing number of ball grid array components (BGAs) which are only available with Pb-free solder bal
.. read more
Stereo Vision Based Automated Solder Ball Height Detection
Solder ball height inspection is essential to the detection of potential connectivity issues in semi-conductor units. Current ball height inspection tools such as laser profiling,fringe project
.. read more
Grain Refinement for Improved Lead-Free Solder Joint Reliability
The very small solder joints that now account for an increasing proportion of the connections on which modern electronics depends are typically made up of only a few grains,sometimes only a sin
.. read more
Solder Creep-Fatigue Model Parameters for SAC & Snag Lead-Free Solder Joint Reliability Estimation
For many of the Pb-free solders required under the European RoHS directive,there is now sufficient information,primarily in the form of the results of accelerated thermal cycling of various lev
.. read more
Assembly of Large PWBs in a RoHS Environment
As early as 2001,leading cellular phone manufacturers had established stable assembly processes that were RoHS compliant for their cellular phone products. Since this time,the products manufact
.. read more
Failure Analysis of Eutectic and Pb-Free Solder Alloys after High Stress Exposure
Failure analysis was performed on fourteen thermally cycled or vibration tested PDIP components from the JCAA-JG-PP Lead-Free Joint Test Project. The components differed in component finish,sol
.. read more
A Comparison of the Isothermal Fatigue Behavior of Sn-Ag-Cu to Sn-Pb Solder
The movement to Pb-free soldering will result in solder joints that are significantly stiffer than those made of SnPb. This
paper presents the results from the first phase of a two-part study t
.. read more