Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Using Flux-Coated Solder Preforms to Repeatably Achieve Low Voiding in Power ICs: An Automotive Case Study
For an automotive transmission control unit (TCU) platform, the bottom ground pad of a high power low-profile quad flat package (LQFP) component soldered to the thermal pad of the PCB had a
.. read more
Miniaturization with Help of Reduced Component to Component Spacing
Miniaturization and the integration of a growing number of functions in portable electronic devices require an extremely high packaging density for the active and passive components. There are
.. read more
Solder Paste Stencil Design for Optimal QFN Yield and Reliability
The use of bottom terminated components (BTC) has become widespread,specifically the use of Quad Flat No-lead (QFN) packages. The small outline and low height of this package type,improved elec
.. read more
Quantifying Stencil Aperture Wall Quality
The goal of this study was to develop a method by which stencil aperture wall quality can be inspected,and the results quantified. Additionally,we hope to establish a correlation between the st
.. read more
Qualification of Solder Beading and Tombstoning in Passive Devices using Designed Experiments
Solder beading and tombstoning are observed increasingly with chip components as their size decreases. This is
even more crucial in today’s packaging,due to the high ratio of passive components
.. read more
Evaluation of Lead Free Solder Paste Materials for PCBA
Most of electronic components on a printed circuit board assembly (PCBA) are surface mount components assembled using solder paste material. Having a good solder paste material is very critical
.. read more
Broadband Printing: The New SMT Challenge
The Surface Mount Technology (SMT) industry has overcome many challenges in the last 30 years,since its introduction in the 1980’s. One recent challenge has been the lead-free assembly. People
.. read more
Low-Silver BGA Assembly Phase I – Reflow Considerations and Joint Homogeneity Initial Report
Some Ball Grid Array suppliers are migrating their sphere alloys from SAC305 (3% Ag) or 405 (4% Ag) to alloys with lower silver contents. There are a numerous perceived benefits to this move in
.. read more
Case Study on the Validation of SAC305 and SnCu Based Solders in SMT,Wave and Hand-soldering at the Contract Assembler Level
insure the same quality a customer has been accustomed to with a Sn63Pb37 process is achieved. The reflow,wave soldering
and hand assembly processes must all be optimized carefully to insure go
.. read more
0.3mm W.L CSP Assembly
Due to the ever-aggressive
miniaturization program that is rolling
through the electronics industry,the
next component that is fast approaching
this horizon is the 0.3mm CSP
• This paper will r
.. read more
Determining Area Ratio Rule for Type 4 and Type 5 Solder Paste
Stencil design is one of the key factors in determining how well any particular stencil will print solder paste. Today’s high volume,24 hour a day,seven days a week manufacturing operations req
.. read more
Lead Free BGA Rework: A comparison of the effect on reliability of reworked BGAs that have been processed with solder...
The use of the Area Array Package and in particular,Ball Grid Array (BGA) technology in the electronics industry continues
to increase due to the fact that this package type allows for a greate
.. read more
Lead Free Process Transition Solder Paste Characteristic Assessment
The migration to Lead Free raw materials in the Electronics Industry will happen faster than the date proposed in the original
draft of the legislation. A true Pb-free solution for product such
.. read more
Effect of No-clean Solder Paste and Flux on Reliability of High Frequency Circuits
The use of no-clean solder paste and flux has become widely accepted as a cost saver in the SMT assembly process.
The presence of solder flux residues,solder mask,underfill or any SMT material
.. read more
Qualification of Solder Beading and Tombstoning in Passive Devices using Designed Experiments
Solder beading and tombstoning are observed increasingly with chip components as their size decreases. This is
even more crucial in today’s packaging,due to the high ratio of passive components
.. read more
A Materials Based Solution for the Elimination of Tombstones
The drive for electronic devices to become lightweight,more portable,and posses increased functionality has driven
electronic components to smaller and smaller sizes. This decease in size does
.. read more
A Case Study of In-Process Inspection Methods to Improve First Pass Yields
The electronics content of many consumer products has increased substantially over the past decade. Several of the
electronics added to the automobile control vehicle functions that have a dire
.. read more
Robust Optimization of a Lead Free SMT Process
This paper will focus on Dr. Taguchi’s Robust Engineering methodology,measurement methods and experimental
results for the optimization of a lead free SMT process for use in an Automotive Elect
.. read more
Using Flux-Coated Solder Preforms to Repeatably Achieve Low Voiding in Power ICs: An Automotive Case Study
For an automotive transmission control unit (TCU) platform, the bottom ground pad of a high power low-profile quad flat package (LQFP) component soldered to the thermal pad of the PCB had a
.. read more
Miniaturization with Help of Reduced Component to Component Spacing
Miniaturization and the integration of a growing number of functions in portable electronic devices require an extremely high packaging density for the active and passive components. There are
.. read more
Solder Paste Stencil Design for Optimal QFN Yield and Reliability
The use of bottom terminated components (BTC) has become widespread,specifically the use of Quad Flat No-lead (QFN) packages. The small outline and low height of this package type,improved elec
.. read more
Quantifying Stencil Aperture Wall Quality
The goal of this study was to develop a method by which stencil aperture wall quality can be inspected,and the results quantified. Additionally,we hope to establish a correlation between the st
.. read more
Qualification of Solder Beading and Tombstoning in Passive Devices using Designed Experiments
Solder beading and tombstoning are observed increasingly with chip components as their size decreases. This is
even more crucial in today’s packaging,due to the high ratio of passive components
.. read more
Evaluation of Lead Free Solder Paste Materials for PCBA
Most of electronic components on a printed circuit board assembly (PCBA) are surface mount components assembled using solder paste material. Having a good solder paste material is very critical
.. read more
Broadband Printing: The New SMT Challenge
The Surface Mount Technology (SMT) industry has overcome many challenges in the last 30 years,since its introduction in the 1980’s. One recent challenge has been the lead-free assembly. People
.. read more
Low-Silver BGA Assembly Phase I – Reflow Considerations and Joint Homogeneity Initial Report
Some Ball Grid Array suppliers are migrating their sphere alloys from SAC305 (3% Ag) or 405 (4% Ag) to alloys with lower silver contents. There are a numerous perceived benefits to this move in
.. read more
Case Study on the Validation of SAC305 and SnCu Based Solders in SMT,Wave and Hand-soldering at the Contract Assembler Level
insure the same quality a customer has been accustomed to with a Sn63Pb37 process is achieved. The reflow,wave soldering
and hand assembly processes must all be optimized carefully to insure go
.. read more
0.3mm W.L CSP Assembly
Due to the ever-aggressive
miniaturization program that is rolling
through the electronics industry,the
next component that is fast approaching
this horizon is the 0.3mm CSP
• This paper will r
.. read more
Determining Area Ratio Rule for Type 4 and Type 5 Solder Paste
Stencil design is one of the key factors in determining how well any particular stencil will print solder paste. Today’s high volume,24 hour a day,seven days a week manufacturing operations req
.. read more
Lead Free BGA Rework: A comparison of the effect on reliability of reworked BGAs that have been processed with solder...
The use of the Area Array Package and in particular,Ball Grid Array (BGA) technology in the electronics industry continues
to increase due to the fact that this package type allows for a greate
.. read more
Lead Free Process Transition Solder Paste Characteristic Assessment
The migration to Lead Free raw materials in the Electronics Industry will happen faster than the date proposed in the original
draft of the legislation. A true Pb-free solution for product such
.. read more
Effect of No-clean Solder Paste and Flux on Reliability of High Frequency Circuits
The use of no-clean solder paste and flux has become widely accepted as a cost saver in the SMT assembly process.
The presence of solder flux residues,solder mask,underfill or any SMT material
.. read more
Qualification of Solder Beading and Tombstoning in Passive Devices using Designed Experiments
Solder beading and tombstoning are observed increasingly with chip components as their size decreases. This is
even more crucial in today’s packaging,due to the high ratio of passive components
.. read more
A Materials Based Solution for the Elimination of Tombstones
The drive for electronic devices to become lightweight,more portable,and posses increased functionality has driven
electronic components to smaller and smaller sizes. This decease in size does
.. read more
A Case Study of In-Process Inspection Methods to Improve First Pass Yields
The electronics content of many consumer products has increased substantially over the past decade. Several of the
electronics added to the automobile control vehicle functions that have a dire
.. read more
Robust Optimization of a Lead Free SMT Process
This paper will focus on Dr. Taguchi’s Robust Engineering methodology,measurement methods and experimental
results for the optimization of a lead free SMT process for use in an Automotive Elect
.. read more