Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Size Matters - The Effects of Solder Powder Size on Solder Paste Performance
Solder powder size is a popular topic in the electronics industry due to the continuing trend of miniaturization of electronics. The question commonly asked is “when we should switch from Ty
.. read more
Jet Printed Solder Paste and Cleaning Challenges
In case of broadband technology,component packages and other devices assembled on the PCBs are ever-shrinking,yet demands for quality,precision and reliability remain the same. Thus,how can man
.. read more
Enclosed Media Printing as an Alternative to Metal Blades
Fine pitch/fine feature solder paste printing in PCB assembly has become increasingly difficult as board geometries have become ever more compact. The printing process itself,traditionally the
.. read more
Printing of Solder Paste – A Quality Assurance Methodology
Solder paste printing is known to be one of the most difficult processes to quality assure in electronic manufacturing. The challenge increases as the technology development moves toward a mix
.. read more
Solder Paste Deposits and the Precision of Aperture Sizes
Many articles have been published indicating that 60 to 75% of all board assembly problems stem from solder paste printing. The important outcome from the printing process is to get the correct
.. read more
Use of the IPC Solder Spread Coupon to Evaluate Pb-Free Solder Pastes and PCB Surface Finishes
Continental is using the IPC solder spread coupon (adopted from NPL) to evaluate Pb-free solder pastes and PCB surface finishes for Solderability. This presentation will compare and contrast so
.. read more
Using DMAIC Methodology for MLP Reflow Process Optimization
The widely publicized and studied implementation of lead free solders has led to increased scrutiny on the solder joint formation for surface mount technology electronic components. During the
.. read more
Lead Free Solder Paste Printing: Stencil and Squeegee Blade Impact
Rarely does a day pass by without a discussion centered on lead free manufacturing and it’s future impact on global
electronics assembly. The WEEE and RoHS directives drafted in January 2003 wi
.. read more
Lead Free Solder Paste Printing: Stencil and Squeegee Blade Impact
Rarely does a day pass by without a discussion centered on lead free manufacturing and it’s future impact on global
electronics assembly. The WEEE and RoHS directives drafted in January 2003 wi
.. read more
A Cost Effective Solution for Supporting Populated Circuit Boards during the Solder Paste Print Operation
Support tooling for circuit boards whose undersides are populated with electronic components is delicate,time
consuming to setup,and relatively expensive. This is because support pins or dedica
.. read more
Optimization Study for Solder Pastes Used in Wafer Bumping Applications
Solder paste for use in wafer bumping applications is becoming an extremely viable technology. Yields from solder
paste printing applications are approaching that of typical bumping technologie
.. read more
HDPUG's Lead-Free Design,Materials and Process of High Density Packages
The High Density Packaging Users Group (HDPUG) has conducted a substantial study of solder joint reliability of
high-density packages using lead-free solder. The design,material,and assembly pr
.. read more
Size Matters - The Effects of Solder Powder Size on Solder Paste Performance
Solder powder size is a popular topic in the electronics industry due to the continuing trend of miniaturization of electronics. The question commonly asked is “when we should switch from Ty
.. read more
Jet Printed Solder Paste and Cleaning Challenges
In case of broadband technology,component packages and other devices assembled on the PCBs are ever-shrinking,yet demands for quality,precision and reliability remain the same. Thus,how can man
.. read more
Enclosed Media Printing as an Alternative to Metal Blades
Fine pitch/fine feature solder paste printing in PCB assembly has become increasingly difficult as board geometries have become ever more compact. The printing process itself,traditionally the
.. read more
Printing of Solder Paste – A Quality Assurance Methodology
Solder paste printing is known to be one of the most difficult processes to quality assure in electronic manufacturing. The challenge increases as the technology development moves toward a mix
.. read more
Solder Paste Deposits and the Precision of Aperture Sizes
Many articles have been published indicating that 60 to 75% of all board assembly problems stem from solder paste printing. The important outcome from the printing process is to get the correct
.. read more
Use of the IPC Solder Spread Coupon to Evaluate Pb-Free Solder Pastes and PCB Surface Finishes
Continental is using the IPC solder spread coupon (adopted from NPL) to evaluate Pb-free solder pastes and PCB surface finishes for Solderability. This presentation will compare and contrast so
.. read more
Using DMAIC Methodology for MLP Reflow Process Optimization
The widely publicized and studied implementation of lead free solders has led to increased scrutiny on the solder joint formation for surface mount technology electronic components. During the
.. read more
Lead Free Solder Paste Printing: Stencil and Squeegee Blade Impact
Rarely does a day pass by without a discussion centered on lead free manufacturing and it’s future impact on global
electronics assembly. The WEEE and RoHS directives drafted in January 2003 wi
.. read more
Lead Free Solder Paste Printing: Stencil and Squeegee Blade Impact
Rarely does a day pass by without a discussion centered on lead free manufacturing and it’s future impact on global
electronics assembly. The WEEE and RoHS directives drafted in January 2003 wi
.. read more
A Cost Effective Solution for Supporting Populated Circuit Boards during the Solder Paste Print Operation
Support tooling for circuit boards whose undersides are populated with electronic components is delicate,time
consuming to setup,and relatively expensive. This is because support pins or dedica
.. read more
Optimization Study for Solder Pastes Used in Wafer Bumping Applications
Solder paste for use in wafer bumping applications is becoming an extremely viable technology. Yields from solder
paste printing applications are approaching that of typical bumping technologie
.. read more
HDPUG's Lead-Free Design,Materials and Process of High Density Packages
The High Density Packaging Users Group (HDPUG) has conducted a substantial study of solder joint reliability of
high-density packages using lead-free solder. The design,material,and assembly pr
.. read more