Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Optimization of Stencil Apertures to Compensate for Scooping During Printing
This study investigates the scooping effect during solder paste printing as a function of aperture width,aperture length and squeegee pressure. The percent of the theoretical volume deposited d
.. read more
Improve SMT Assembly Yields Using Root Cause Analysis in Stencil Design
Reduction of first pass defects in the SMT assembly process minimizes cost,assembly time and improves reliability. These three areas,cost,delivery and reliability determine manufacturing yields
.. read more
Optimization of Stencil Apertures to Compensate for Scooping During Printing
This study investigates the scooping effect during solder paste printing as a function of aperture width,aperture length and squeegee pressure. The percent of the theoretical volume deposited d
.. read more
Improve SMT Assembly Yields Using Root Cause Analysis in Stencil Design
Reduction of first pass defects in the SMT assembly process minimizes cost,assembly time and improves reliability. These three areas,cost,delivery and reliability determine manufacturing yields
.. read more