Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Telecommunications Case Studies Address Head-In-Pillow (Hnp) Defects and Mitigation through Assembly Process Modifications and Control
One of the most perplexing phenomena in the electronic manufacturing industry today is the defect called “head-in-pillow.”
Head-in-Pillow (HnP) defects occur on the blind solder joints of area
.. read more
Selection of Dip Transfer Fluxes and Solder Pastes for PoP Assembly
Consideration and selection of dip transfer flux and solder paste for PoP assembly are described,based on process consideration. The crucial properties vital for successful dip transfer include
.. read more
Reliability Evaluation of One-Pass and Two-Pass Techniques of Assembly for Package on Packages under Torsion Loads
Package on Packages (PoP) find use in applications that require high performance with increased memory density. One of the
greatest benefits of PoP technology is the elimination of the expensiv
.. read more
3 Steps to Successful Solder Paste Selection
Choosing a solder paste can make or break an assembly process. By choosing the right solder paste for the application,you will achieve the highest process consistency and solder joint quality.
.. read more
Bumping BGA’s Using Solder Paste Printing Process for RFI Shields Packaging
One manufacturing process used to attach RFI shields for medical applications/cellular phone circuit board assemblies
consists of “snapping” the shell-like shields onto solder spheres that are
.. read more
Lead Free Solder Paste Printing: Stencil and Squeegee Blade Impact
Rarely does a day pass by without a discussion centered on lead free manufacturing and it’s future impact on global
electronics assembly. The WEEE and RoHS directives drafted in January 2003 wi
.. read more
Comparison of Types III,IV and V Solder Pastes
A brand name Pb-free solder paste made with three different sizes of solder paste spheres was studied. The soldering ability
of Types III,IV and V solder paste in terms of opens,shorts,solder s
.. read more
Understanding Stencil Requirements for a Lead Free Mass Imaging Process
Many words have been written about the impending lead free transition,during this period of frantic discovery lots has
been communicated about the reflow and alloy concerns; But the print proce
.. read more
Telecommunications Case Studies Address Head-In-Pillow (Hnp) Defects and Mitigation through Assembly Process Modifications and Control
One of the most perplexing phenomena in the electronic manufacturing industry today is the defect called “head-in-pillow.”
Head-in-Pillow (HnP) defects occur on the blind solder joints of area
.. read more
Selection of Dip Transfer Fluxes and Solder Pastes for PoP Assembly
Consideration and selection of dip transfer flux and solder paste for PoP assembly are described,based on process consideration. The crucial properties vital for successful dip transfer include
.. read more
Reliability Evaluation of One-Pass and Two-Pass Techniques of Assembly for Package on Packages under Torsion Loads
Package on Packages (PoP) find use in applications that require high performance with increased memory density. One of the
greatest benefits of PoP technology is the elimination of the expensiv
.. read more
3 Steps to Successful Solder Paste Selection
Choosing a solder paste can make or break an assembly process. By choosing the right solder paste for the application,you will achieve the highest process consistency and solder joint quality.
.. read more
Bumping BGA’s Using Solder Paste Printing Process for RFI Shields Packaging
One manufacturing process used to attach RFI shields for medical applications/cellular phone circuit board assemblies
consists of “snapping” the shell-like shields onto solder spheres that are
.. read more
Lead Free Solder Paste Printing: Stencil and Squeegee Blade Impact
Rarely does a day pass by without a discussion centered on lead free manufacturing and it’s future impact on global
electronics assembly. The WEEE and RoHS directives drafted in January 2003 wi
.. read more
Comparison of Types III,IV and V Solder Pastes
A brand name Pb-free solder paste made with three different sizes of solder paste spheres was studied. The soldering ability
of Types III,IV and V solder paste in terms of opens,shorts,solder s
.. read more
Understanding Stencil Requirements for a Lead Free Mass Imaging Process
Many words have been written about the impending lead free transition,during this period of frantic discovery lots has
been communicated about the reflow and alloy concerns; But the print proce
.. read more