Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Investigation Into the Impact of Atmospheric Plasma Surface Preparation on Soldering & Cleaning Process Steps
The soldering (wave, reflow, and selective) along with flux removal (cleaning) processes have for years been optimized to yield the best result possible. Today more than ever these processes
.. read more
Embedded Fibers Enhance Nano-Scale Interconnections
While the density of chip-to-chip and chip-to-package component interconnections increases and their size decreases the ease
of manufacture and the interconnection reliability are being reduced
.. read more
Fluxless Die Attach by Activated Forming Gas
Eutectic god-tin (Au80Sn20) is widely used as the die-attach material for making radio-frequency (RF) and microwave devices. The metallic bonding is typically achieved by soldering using a gold
.. read more
Cost Effective and User Friendly Nitrogen Inerting Technology For Lead-Free Wave Soldering
It is well known that nitrogen inerting in wave soldering can significantly reduce dross formation and improve solder wetting. For lead-free wave soldering,the benefits of N2 inerting are even
.. read more
Measuring the True Wetting Time of Solders
As the electronics industry prepares to meet the requirements of the European Community’s RoHS directive on lead in electrical and electronic equipment an issue about which concern is frequentl
.. read more
Taking the Pain Out of Pb-Free Reflow
The introduction of Pb-free solder into the electronics industry has required changes to the standard surface mount process.
The largest changes are in the reflow process,as Pb-free pastes requ
.. read more
Investigation Into the Impact of Atmospheric Plasma Surface Preparation on Soldering & Cleaning Process Steps
The soldering (wave, reflow, and selective) along with flux removal (cleaning) processes have for years been optimized to yield the best result possible. Today more than ever these processes
.. read more
Embedded Fibers Enhance Nano-Scale Interconnections
While the density of chip-to-chip and chip-to-package component interconnections increases and their size decreases the ease
of manufacture and the interconnection reliability are being reduced
.. read more
Fluxless Die Attach by Activated Forming Gas
Eutectic god-tin (Au80Sn20) is widely used as the die-attach material for making radio-frequency (RF) and microwave devices. The metallic bonding is typically achieved by soldering using a gold
.. read more
Cost Effective and User Friendly Nitrogen Inerting Technology For Lead-Free Wave Soldering
It is well known that nitrogen inerting in wave soldering can significantly reduce dross formation and improve solder wetting. For lead-free wave soldering,the benefits of N2 inerting are even
.. read more
Measuring the True Wetting Time of Solders
As the electronics industry prepares to meet the requirements of the European Community’s RoHS directive on lead in electrical and electronic equipment an issue about which concern is frequentl
.. read more
Taking the Pain Out of Pb-Free Reflow
The introduction of Pb-free solder into the electronics industry has required changes to the standard surface mount process.
The largest changes are in the reflow process,as Pb-free pastes requ
.. read more