Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Assessment of Reterminated RoHS Components for SnPb Applications
The banning of Pb in electronic component termination finishes has flushed through the supply chain making it impossible in some cases for hi-reliability users to purchase Pb containing interco
.. read more
An Investigation into Low Temperature Tin-Bismuth and Tin-Bismuth-Silver Lead-Free Alloy Solder Pastes for Electronics Manufacturing Applications
The electronics industry has mainly adopted the higher melting point Sn3Ag0.5Cu solder alloys for lead-free reflow soldering applications. For applications where temperature sensitive component
.. read more
A Plasma Deposited Surface Finish for Printed Circuit Boards
This paper will discuss a new approach to the final finishing for the PCB industry which is based on the use of an ultra-thin
fluoropolymer film as a protective coating to preserve solderabilit
.. read more
Testing the Long Term Reliability of an Environmentally Friendly PCB Final Finish
The new plasma polymer PCB final finish that eliminates harsh chemicals and waste streams also promises to eliminate creep corrosion,but will it stand the test of time? Before any new produc
.. read more
IPC Tutorial Topic 3: Evaluation of No-clean Pb-free Halogen-free Solder Pastes That Can Effectively Mitigate Head-in-Pillow Defects and Have Good...
•Background and Objective
•Head-in-Pillow (HiP) Defect
•In Circuit Test (ICT) Testability
•Evaluation Steps
- Solder Paste Selection
- Head-in-Pillow Test
- Printability & Solderability Test
.. read more
Case Study Comparing the Solderability of a Specific Pb Free No Clean Paste in Vapor Phase and Convection Reflow
To help address the environmental requirements driven by the European Union RoHS Directive,consumer applications have changed the solder alloys for the manufacturing of printed circuit board as
.. read more
New Cleaning Agent Designs for Removing No-Clean Lead-Free Flux Residues
The process cleaning rate theorem holds that the static rate (chemical forces) plus the dynamic cleaning rate (mechanical forces) equals the process cleaning rate. New lead-free flux residues r
.. read more
IPC Tutorial Topic 3: Evaluation of No-clean Pb-free Halogen-free Solder Pastes That Can Effectively Mitigate Head-in-Pillow Defects and Have Good...
•Background and Objective
•Head-in-Pillow (HiP) Defect
•In Circuit Test (ICT) Testability
•Evaluation Steps
- Solder Paste Selection
- Head-in-Pillow Test
- Printability & Solderability Test
.. read more
An Investigation into Hand Sanitizers and Hand Lotions and Potential Risks to High Performance Electronics
As people become more concerned about the global outbreaks of various strains of influenza,more precautions are being taken with respect to personal hygiene. A common precaution involves the us
.. read more
Nanotechnology for Lead-Free PWB Final Finishes with Organic Metal
The use of an Organic Metal finish only a few nano-meters deposited onto copper pads of printed circuit boards provides effective protection against oxidation and preserves solderability. The N
.. read more
3 Steps to Successful Solder Paste Selection
Choosing a solder paste can make or break an assembly process. By choosing the right solder paste for the application,you will achieve the highest process consistency and solder joint quality.
.. read more
Hot Air Solder Leveling in the Lead-free Era
Although the advantages of Hot Air Solder Leveling (HASL) in providing the most robust solderable finish for printed circuit boards are well recognized,in the years leading up to the implementa
.. read more
Cupric Chloride-Hydrochloric Acid Microetch Roughening Process and its Applications
We have developed a cupric chloride-hydrochloric acid based microetchant process. This process provides a unique roughened copper surface,which yields excellent adhesion for both solder mask an
.. read more
Final Finishes for High Temperature Applications: A Comparison of OSP and Immersion Silver Final Finish Coatings
With the increased use of lead-free alloys there has been interest in understanding the applications and limitations of final finish coatings for lead-free assembly processes. The higher temper
.. read more
Laser Cutting - a Novel Method of Depaneling
There are many issues to be considered in the manufacturing of state-of-the-art electronic products. Today's electronic devices,whether based on flexible (FPC) or rigid (PCB) printed circuit bo
.. read more
The Advantages of Mildly Alkaline Immersion Silver as a Final Finish for Solderability
The immersion silver process has become the first choice of final finishing for many original equipment manufacturers (OEM) because of its shortened process flow,good conductivity,even depositi
.. read more
Describing Key Coating and Process Characteristics of a Pb-Free OSP Process
Organic Solderability Preservatives (OSP) continue to attract significant attention as circuit board final finishes. They have evolved from simple and thin benzotriazole coatings to thicker and
.. read more
Further Analysis of the Alternate Finishes Task Group Report on Time,Temperature and Humidity Stress of Final Board Finish Solderability
The IPC study mentioned in the title looked at the effects of time,temperature and humidity on the solderability of true bare copper,immersion silver,immersion tin,organic soldering preservativ
.. read more
Enabling Ultra-Fine Pitch Packages: Soldermask Patterning using Laser Ablation
The trend towards tighter pitch,smaller features,and shrinking pad sizes have put a strain on the standard photolithographic
processes for soldermask patterning on substrate packaging and rigid
.. read more
The Chemistry and Properties of a Newly Developed Immersion Silver Coating for PWB
To meet the emerging requirement of eliminating lead from electronics,the printed wiring board (PWB) industry is migrating
from hot-air-leveled SnPb solder to alternative final finishes. A thin
.. read more
Solderability of Sn/Cu Lead-Free Solder as a HASL Bare Board Final Finish
Sn/Cu lead-free solder is a good alternative to 63/37 solder for use in HASL processes. Solderability of Sn/Cu
surface exceeds that of 63/37 solder,nickel-gold,OSP,silver,and immersion tin both
.. read more
Immersion Silver and Immersion Tin IPC Plating Committee 4-14 Industry Update
The development of two new industry specifications – IPC-4553 (immersion silver IAg) and IPC-4554 (immersion tin ISn)
are well under way. Following in a tradition started with the development o
.. read more
Improving Oxide Resistance and Solderability of Electroplated Tin & Tin Alloy Coatings for Component Plating and Printed Circuit Board Final...
Abstract
Electroplated tin and tin alloy coatings are used in electronics plating applications as a solderable and corrosion resistant
surface finish for components and printed circuit boards (
.. read more
Board Finish Solderability with Sn-Ag-Cu
Lead-free soldering technology is still in its infancy with technical and cost issues posing major challenges for the
industry. It is expected that soldering in a nitrogen atmosphere might over
.. read more
Preliminary Study on Lead-free Sn42Bi57Ag1 Solder Paste
With the growth of the concern on the environment,more and more efforts have been done to protect the earth,to
minimize the pollution on the environment. The use of the lead free solder is repl
.. read more
Assessment of Reterminated RoHS Components for SnPb Applications
The banning of Pb in electronic component termination finishes has flushed through the supply chain making it impossible in some cases for hi-reliability users to purchase Pb containing interco
.. read more
An Investigation into Low Temperature Tin-Bismuth and Tin-Bismuth-Silver Lead-Free Alloy Solder Pastes for Electronics Manufacturing Applications
The electronics industry has mainly adopted the higher melting point Sn3Ag0.5Cu solder alloys for lead-free reflow soldering applications. For applications where temperature sensitive component
.. read more
A Plasma Deposited Surface Finish for Printed Circuit Boards
This paper will discuss a new approach to the final finishing for the PCB industry which is based on the use of an ultra-thin
fluoropolymer film as a protective coating to preserve solderabilit
.. read more
Testing the Long Term Reliability of an Environmentally Friendly PCB Final Finish
The new plasma polymer PCB final finish that eliminates harsh chemicals and waste streams also promises to eliminate creep corrosion,but will it stand the test of time? Before any new produc
.. read more
IPC Tutorial Topic 3: Evaluation of No-clean Pb-free Halogen-free Solder Pastes That Can Effectively Mitigate Head-in-Pillow Defects and Have Good...
•Background and Objective
•Head-in-Pillow (HiP) Defect
•In Circuit Test (ICT) Testability
•Evaluation Steps
- Solder Paste Selection
- Head-in-Pillow Test
- Printability & Solderability Test
.. read more
Case Study Comparing the Solderability of a Specific Pb Free No Clean Paste in Vapor Phase and Convection Reflow
To help address the environmental requirements driven by the European Union RoHS Directive,consumer applications have changed the solder alloys for the manufacturing of printed circuit board as
.. read more
New Cleaning Agent Designs for Removing No-Clean Lead-Free Flux Residues
The process cleaning rate theorem holds that the static rate (chemical forces) plus the dynamic cleaning rate (mechanical forces) equals the process cleaning rate. New lead-free flux residues r
.. read more
IPC Tutorial Topic 3: Evaluation of No-clean Pb-free Halogen-free Solder Pastes That Can Effectively Mitigate Head-in-Pillow Defects and Have Good...
•Background and Objective
•Head-in-Pillow (HiP) Defect
•In Circuit Test (ICT) Testability
•Evaluation Steps
- Solder Paste Selection
- Head-in-Pillow Test
- Printability & Solderability Test
.. read more
An Investigation into Hand Sanitizers and Hand Lotions and Potential Risks to High Performance Electronics
As people become more concerned about the global outbreaks of various strains of influenza,more precautions are being taken with respect to personal hygiene. A common precaution involves the us
.. read more
Nanotechnology for Lead-Free PWB Final Finishes with Organic Metal
The use of an Organic Metal finish only a few nano-meters deposited onto copper pads of printed circuit boards provides effective protection against oxidation and preserves solderability. The N
.. read more
3 Steps to Successful Solder Paste Selection
Choosing a solder paste can make or break an assembly process. By choosing the right solder paste for the application,you will achieve the highest process consistency and solder joint quality.
.. read more
Hot Air Solder Leveling in the Lead-free Era
Although the advantages of Hot Air Solder Leveling (HASL) in providing the most robust solderable finish for printed circuit boards are well recognized,in the years leading up to the implementa
.. read more
Cupric Chloride-Hydrochloric Acid Microetch Roughening Process and its Applications
We have developed a cupric chloride-hydrochloric acid based microetchant process. This process provides a unique roughened copper surface,which yields excellent adhesion for both solder mask an
.. read more
Final Finishes for High Temperature Applications: A Comparison of OSP and Immersion Silver Final Finish Coatings
With the increased use of lead-free alloys there has been interest in understanding the applications and limitations of final finish coatings for lead-free assembly processes. The higher temper
.. read more
Laser Cutting - a Novel Method of Depaneling
There are many issues to be considered in the manufacturing of state-of-the-art electronic products. Today's electronic devices,whether based on flexible (FPC) or rigid (PCB) printed circuit bo
.. read more
The Advantages of Mildly Alkaline Immersion Silver as a Final Finish for Solderability
The immersion silver process has become the first choice of final finishing for many original equipment manufacturers (OEM) because of its shortened process flow,good conductivity,even depositi
.. read more
Describing Key Coating and Process Characteristics of a Pb-Free OSP Process
Organic Solderability Preservatives (OSP) continue to attract significant attention as circuit board final finishes. They have evolved from simple and thin benzotriazole coatings to thicker and
.. read more
Further Analysis of the Alternate Finishes Task Group Report on Time,Temperature and Humidity Stress of Final Board Finish Solderability
The IPC study mentioned in the title looked at the effects of time,temperature and humidity on the solderability of true bare copper,immersion silver,immersion tin,organic soldering preservativ
.. read more
Enabling Ultra-Fine Pitch Packages: Soldermask Patterning using Laser Ablation
The trend towards tighter pitch,smaller features,and shrinking pad sizes have put a strain on the standard photolithographic
processes for soldermask patterning on substrate packaging and rigid
.. read more
The Chemistry and Properties of a Newly Developed Immersion Silver Coating for PWB
To meet the emerging requirement of eliminating lead from electronics,the printed wiring board (PWB) industry is migrating
from hot-air-leveled SnPb solder to alternative final finishes. A thin
.. read more
Solderability of Sn/Cu Lead-Free Solder as a HASL Bare Board Final Finish
Sn/Cu lead-free solder is a good alternative to 63/37 solder for use in HASL processes. Solderability of Sn/Cu
surface exceeds that of 63/37 solder,nickel-gold,OSP,silver,and immersion tin both
.. read more
Immersion Silver and Immersion Tin IPC Plating Committee 4-14 Industry Update
The development of two new industry specifications – IPC-4553 (immersion silver IAg) and IPC-4554 (immersion tin ISn)
are well under way. Following in a tradition started with the development o
.. read more
Improving Oxide Resistance and Solderability of Electroplated Tin & Tin Alloy Coatings for Component Plating and Printed Circuit Board Final...
Abstract
Electroplated tin and tin alloy coatings are used in electronics plating applications as a solderable and corrosion resistant
surface finish for components and printed circuit boards (
.. read more
Board Finish Solderability with Sn-Ag-Cu
Lead-free soldering technology is still in its infancy with technical and cost issues posing major challenges for the
industry. It is expected that soldering in a nitrogen atmosphere might over
.. read more
Preliminary Study on Lead-free Sn42Bi57Ag1 Solder Paste
With the growth of the concern on the environment,more and more efforts have been done to protect the earth,to
minimize the pollution on the environment. The use of the lead free solder is repl
.. read more